JPS5911615A - Case sheathing type electronic part - Google Patents
Case sheathing type electronic partInfo
- Publication number
- JPS5911615A JPS5911615A JP12078482A JP12078482A JPS5911615A JP S5911615 A JPS5911615 A JP S5911615A JP 12078482 A JP12078482 A JP 12078482A JP 12078482 A JP12078482 A JP 12078482A JP S5911615 A JPS5911615 A JP S5911615A
- Authority
- JP
- Japan
- Prior art keywords
- case
- resin layer
- filled resin
- filled
- plastic film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は金属化プラスチックフィルムコンデンサ素子あ
るいは金属化プラスチックフィルムコンデンサ素子を含
む複合電子部品素子をケース内に収納し7、合成樹脂を
二1−に分けて充填し7たケース外装形電子部品f係り
、特に二層の合成樹脂層の硬度をそ力ぞ引適宜選定1.
て内圧防爆機能を持たせたケース外装形電子部品に関す
るO
プラスチックフィルムに金属を蒸着した金属化プラスチ
ックフィルムを複数枚積層巻回して子と他の電子部品素
子とを接続してケース内に収納し、合成樹脂を充填して
構成したケース外化プラスチックフィルムコンデンサ素
子の電極が002〜0.1μm程度と@1.hて薄い蒸
着金属層であるため、プラスチックフィルムの電気的弱
点部分で絶縁破壊が生じて部分放電が発生17でも、絶
縁破壊部分及びその周辺のプラスチックフィルム表面の
!、極が、放電エネルギーによって溶融飛散して絶縁性
を回復する所謂自己回復性に優ねているため、各種電子
機器や商用電源の雑音防止用等に広く用いらflでいる
。[Detailed Description of the Invention] The present invention comprises a case in which a metallized plastic film capacitor element or a composite electronic component element including a metallized plastic film capacitor element is housed in a case 7, and a synthetic resin is divided into 21 parts and filled 7. The hardness of the case exterior electronic components, especially the two synthetic resin layers, should be appropriately selected.1.
O Concerning case-mounted electronic components that have an internal pressure explosion-proof function.Multiple sheets of metallized plastic film, which is made by vapor-depositing metal on plastic film, are laminated and wound, and the electronic components and other electronic components are connected to each other and housed in the case. , the electrode of the case-exposed plastic film capacitor element filled with synthetic resin is about 0.02 to 0.1 μm @1. Since it is a thin vapor-deposited metal layer, dielectric breakdown occurs at the electrically weak points of the plastic film, causing partial discharge. Since the electrode has excellent so-called self-healing properties, in which the electrode melts and scatters due to discharge energy and recovers its insulation properties, it is widely used for noise prevention in various electronic devices and commercial power supplies.
ところが、この優ねた自己回復機能を有する金属化プラ
スチックフィルムコンデンサ素子も、その使用中に異常
高温に長時聞きらさねたり、過大管、圧が長時間印加さ
ね続けた場合には プラスチックフィルムの劣化によっ
て耐電圧が低下(7て部分的絶縁破壊の発生頻度が増大
[17、そわに伴々う部分放電及び発熱の増加によって
更にプラスチックフィルムの劣化が促進さ引て破壊が進
行するが、上記した自己回復機能のたぬに完全短絡とl
dならず、ある抵抗値を持魂寺ま終局破壊に至る。従っ
てこの状態では例えばヒーーズやブレーカ−等の外部回
路に接続された安全装置が動作し得す続発する部分放電
によってプラスチックフィルムが分解されてガスが発生
し、このガスがケース外装形電子部品内に充満すること
になる。一方、ケース外装形電子部品の充填樹脂として
は、電気的、環境的特性、作業性、価格面等からエポキ
シ樹脂が主に用いられているが、これが非常に強固な材
質であるため、上述した分解ガスによって内部圧力が上
昇し、遂には充填樹脂及び外装ケースが爆発するに至り
、ケース外装形電子部品を組み込んだ装置を損傷させ、
更にガスに引火して火災が発生するなどの危険性があっ
た。However, even though this metallized plastic film capacitor element has an excellent self-healing function, if it is exposed to abnormally high temperatures for a long time during use, or if excessive pressure is not applied for a long time, the plastic may deteriorate. Due to deterioration of the film, the withstand voltage decreases (7) and the frequency of occurrence of partial dielectric breakdown increases [17] The deterioration of the plastic film is further accelerated by the increase in partial discharge and heat generation that accompanies fidgeting, and the breakdown progresses. , the self-recovery function described above is completely short-circuited and l
However, a certain resistance value leads to the ultimate destruction of Jikonji Temple. Therefore, in this state, a safety device connected to the external circuit, such as a heater or a breaker, may be activated.The plastic film is decomposed due to subsequent partial discharges, and gas is generated, and this gas enters the case-mounted electronic components. It will be full. On the other hand, epoxy resin is mainly used as the filling resin for case-mounted electronic components due to its electrical, environmental characteristics, workability, and cost. The internal pressure increases due to the decomposition gas, which eventually causes the filled resin and the outer case to explode, damaging equipment that incorporates case-mounted electronic components.
Furthermore, there was a risk that the gas could ignite and cause a fire.
この対策として従来より種々の保安構造を有するケース
外装形電子部品が案出されており、例えば金属化プラス
チックフィルムコンデンサ素子、あるいは金属化プラス
チックフィルムコンデンサ素子を含む複合電子部品素子
を密閉した金属ケースに収納し、ガス圧によるケースの
膨張を利用して素子のリード線を切断して電源から切り
離す方法や第1図に示す如(、金属化プラスチックフィ
ルムコンデンサ素子2と抵抗素子3とを接続して外装ケ
ース4に収納してエポキシ樹脂を充填し、この充填樹脂
を素子2゜3を被覆する第一の層5と、更に第一の層5
を覆う第二の層6との二層構造とし、ガスの圧力によっ
て第3図に示す如く第二の層6を第一の1−5から離脱
させてガスの放出を図り、さらにこの離脱力によって二
つの層の境界部分のリード線7を切断して素子2,6へ
の給′醒を遮断する方法や、上記二層充填樹脂構造のケ
ース外装形電子部品1の二つの樹脂層5,6の剥離を容
易にするため両相脂層の境界面8に絶縁紙やポリエステ
ルフィルム等のセパレータ11を介在させた構造や、更
に上記二つの樹脂層5.6の境界面8部分のリード線7
に、例えば第2図に示す如く、切り込みを人ねる等して
機械的弱部10を形成し、第二の樹脂層6の離脱時の、
リード線7の切断を容易にしたもの等が提案されていた
。As a countermeasure against this problem, case-exposed electronic components with various security structures have been devised. For example, a metalized plastic film capacitor element or a composite electronic component element including a metalized plastic film capacitor element is sealed in a metal case. There is a method of storing the capacitor and disconnecting it from the power supply by cutting the lead wire of the element using the expansion of the case due to gas pressure, or as shown in Fig. A first layer 5 which is housed in an exterior case 4 and filled with epoxy resin covers the element 2゜3, and a further first layer 5.
As shown in FIG. 3, the second layer 6 is separated from the first layer 1-5 by the pressure of the gas to release the gas. A method of cutting the lead wire 7 at the boundary between the two layers to cut off the supply to the elements 2 and 6, and a method of cutting the lead wire 7 at the boundary between the two layers by cutting the two resin layers 5, In order to facilitate the peeling of the two resin layers 5.6, a separator 11 such as insulating paper or polyester film is interposed at the interface 8 between the two resin layers, and a lead wire is provided at the interface 8 between the two resin layers 5.6. 7
For example, as shown in FIG. 2, a mechanically weak portion 10 is formed by making a cut, etc., and when the second resin layer 6 is separated,
A device in which the lead wire 7 can be easily cut has been proposed.
ところが金属ケースの膨張を利用する方法にあっては、
ケースの密閉性を得るために構造が複雑となり、又、充
填樹脂を二層構造とする方法では、樹脂層間の接着力の
ために内部圧力が相当上昇しないと層間の剥離は困難で
、この圧力に抗することのできるケースはその材質や構
造に著しく制約を受け、更に樹脂層間にセパレータを介
在させた構造にあっては、製造工程が複雑化してしまう
等の欠点があった。However, in the method that utilizes the expansion of the metal case,
The structure of the case is complicated in order to achieve airtightness, and in the method of using a two-layer structure of filled resin, it is difficult to separate the layers unless the internal pressure increases considerably due to the adhesive force between the resin layers. Cases that can withstand this are severely limited by their materials and structures, and structures in which a separator is interposed between resin layers have the disadvantage of complicating the manufacturing process.
本発明は上述の欠点を解消するために案出さ ゛れ
たもので、構造簡単にして製造が容易で、且つ優れた防
爆機能を有するケース外装形電子部品を提供することを
目的とする。The present invention was devised to solve the above-mentioned drawbacks, and an object of the present invention is to provide a case-exposed electronic component that has a simple structure, is easy to manufacture, and has an excellent explosion-proof function.
以上の目的を達成するため、合成樹脂の充填構造と硬度
とに着目し種々研究の結果、充填樹脂を二層構造とし、
且つケース底部側の充填樹脂層の硬度をJI8に630
1に規定のA硬度80以下、ケース開口部側の充填樹脂
層の硬度を同硬度90以上に選定した場合に金属化ブラ
スチックフィルムコンデンサ素子の破壊時に於ける両充
填樹脂層境界面の剥離が容易となって爆発を未然に防止
し得ることを見い出し本発明クフィルムコンデンサ素子
、あるいは金属化プラスチックフィルムコンデンサ素子
を含む複合電子部品素子を一面が開口部と々された外装
ケースに収納し、且つ上記素子を被覆する第一の充填樹
脂層を形成すると共に、第一の充填樹脂層を覆ってケー
ス開口部に第二の充填樹脂層を形成したケース外装形電
子部品において、第一の充填樹脂層の硬度をJI8に6
301に規定されるA硬度80以下、第二の充填樹脂層
の硬度を同硬度90以上に選定した構成を取るものであ
る。In order to achieve the above objectives, we focused on the filling structure and hardness of synthetic resin, and as a result of various studies, we created a two-layer structure for the filling resin.
And the hardness of the filled resin layer on the bottom side of the case is JI8 630
If the hardness of the filling resin layer on the case opening side is set to 90 or higher as specified in Section 1, the boundary surface of both filling resin layers will not peel off when the metallized plastic film capacitor element breaks. The present invention has found that a composite electronic component element including a film capacitor element or a metallized plastic film capacitor element is housed in an exterior case with an opening on one side, and that an explosion can be easily prevented. In a case-exposed electronic component, in which a first filled resin layer is formed to cover the element, and a second filled resin layer is formed at the case opening to cover the first filled resin layer, the first filled resin layer is formed. The hardness of the layer is JI8 to 6
301, and the hardness of the second filled resin layer is selected to be 90 or higher.
以下図面に基づき本発明の一実施例を説明する。An embodiment of the present invention will be described below based on the drawings.
第4図は本発明の一実施例に係るケース外装形雷1子部
品であり、図に於いて1はケース外装形電子部品、2は
金属化プラスチックフィルムコンデンサ素子、3は電子
部品素子、411−を外装ケース、5は第一の充填樹脂
層、6は第二の充填樹脂層を示している。しか12で、
ケース外装形電子部品1は、金属化プラスチックフィル
ムコンデンサ素子2に他の電子部品素子(本実施例では
固定抵抗器)5を接続して、ポリフェニリンオキサイド
、ポリエチレンテレフタレート、あるいはポリブチレン
テレフタレート等の合成樹脂よりなるプラスチックケー
ス4に、ケース4の開口部からリード線7を導出させて
収納し、合成樹脂を第一の層5及び第二の層6の二層に
分けて充填した構造となっている。上記第一の充填樹脂
層5は上記素子2,3を被覆しており、JISK630
1に規定されるA硬度80以下の柔かいポリウレタン系
合成樹脂によって形成され、又第二の充填樹脂層6は同
硬度90以上の硬いポリウレタン、エポキシ等の合成樹
脂よりなり、第一の充填樹脂層5の硬化後充填されて第
一の充填樹脂層5を覆い、外装ケース4の開口部を封止
している。更に、第一の充填樹脂層5は上面がケース4
に接する部分で高く中央部分で低い曲面状となっており
、又第二の充填樹脂層6は、下面が第一の充填樹脂層5
と同一形状の曲面、上面がケース4に接する部分で高く
中央部分で低い曲面状となっている。従って両充填樹脂
層5,6の境界面8の形状も、上記の形状となっている
。これは、ケース4を水平に保持して開口部から合成樹
脂を充填した場合、合成樹脂のケース4に対する濡れ及
び硬化時の合成樹脂の収縮によるものである。FIG. 4 shows a case-exterior type lightning element component according to an embodiment of the present invention, in which 1 is a case-exterior type electronic component, 2 is a metallized plastic film capacitor element, 3 is an electronic component element, 411 - indicates an exterior case, 5 indicates a first filled resin layer, and 6 indicates a second filled resin layer. Only 12,
The case-exterior type electronic component 1 has a metallized plastic film capacitor element 2 connected to another electronic component element (a fixed resistor in this example) 5, and is made of polyphenyline oxide, polyethylene terephthalate, polybutylene terephthalate, etc. The lead wire 7 is led out from the opening of the case 4 and housed in a plastic case 4 made of synthetic resin, and the synthetic resin is filled in two layers, a first layer 5 and a second layer 6. ing. The first filled resin layer 5 covers the elements 2 and 3, and is JIS K630
The second filled resin layer 6 is made of a soft polyurethane-based synthetic resin having an A hardness of 80 or less as defined in Section 1, and the second filled resin layer 6 is made of a hard synthetic resin such as polyurethane or epoxy that has an A hardness of 90 or more. 5 is filled after curing to cover the first filled resin layer 5 and seal the opening of the outer case 4. Furthermore, the upper surface of the first filled resin layer 5 is the same as that of the case 4.
The second filled resin layer 6 has a curved surface that is higher at the part that contacts with it and lower at the center, and the lower surface of the second filled resin layer 6 is higher than the first filled resin layer 5.
The upper surface has a curved surface having the same shape as that of the case 4, with the upper surface being higher at the part where it contacts the case 4 and lower at the central part. Therefore, the shape of the boundary surface 8 between both filled resin layers 5 and 6 is also the shape described above. This is because when the case 4 is held horizontally and the synthetic resin is filled from the opening, the synthetic resin wets the case 4 and the synthetic resin shrinks during curing.
かかる構成のケース外装形電子部品1に長時間異常高温
や過大電圧等が作用して金属化プラスチックフィルムコ
ンデンサ素子2が破壊された場合、第5図に示寸如くプ
ラスチックフィルムの分解によって発、生したガス9は
、金属プラスチックフィルムコンデンサ素子2と第一の
充填樹脂層5の間に充満し内部圧力を上昇させるが、金
属化プラスチックフィルムコンデンサ素子2の破壊によ
る発熱のために第一の充填樹脂層5が軟化し、風船の如
く脹らんで、第二の充填樹脂層6を押し上げてケース4
及び第一の充填樹脂層5から剥離させ、外気を遮りつつ
内部圧力を低下させる。この場合、リード線7として、
例えば機械的強度の弱いものや、両充填樹脂rf45,
6の境界面8部分に第2図に示すような切り込み等の機
械的弱点部分10を形成したもの等、少なくとも境界面
8部分の機械的強度が、上記第二の充填樹脂層乙の剥離
によって切断され得る強度に選定されたものを使用すれ
ば、リード線7の両充填樹脂層5,6の境界面8部分が
切断されてケース外装形電子部品1への電子2の破壊に
よる発熱によって軟化し、ガス圧によって脹らむために
は、その硬度がJ18に6301に規定のA硬度80以
下であることが必要であh1更に本実施例では充填樹脂
としてポリウレタン系の合成樹脂を使用しているのでポ
リウレタン特有の粘りによって上記作用を更に容易にし
ている。又、第二の充填樹脂層6が、上記発熱によって
軟化せず、且つ第一の充填樹脂層5の押し上げによって
もほとんど変形しないでケース4及び第一の充填樹脂層
5から剥離するためには、その硬度をJI8に6501
に規定のA硬度90以上に選定する必要があり、更に本
実施例では第一の充填樹脂層5と第二の充填樹脂層6と
の境界面8の形状が外装ケース4に接する部分で高く中
央部分で低い曲面状であるので、剥離作用が非常に容易
に行ない得る。If the metallized plastic film capacitor element 2 is destroyed due to abnormal high temperature, excessive voltage, etc. acting on the case-exposed electronic component 1 having such a structure, the metallized plastic film capacitor element 2 may be destroyed due to the decomposition of the plastic film as shown in FIG. The gas 9 filled between the metal-plastic film capacitor element 2 and the first filling resin layer 5 increases the internal pressure, but due to the heat generated by the destruction of the metal-plastic film capacitor element 2, the first filling resin layer The layer 5 softens and expands like a balloon, pushing up the second filled resin layer 6 and closing the case 4.
Then, it is peeled off from the first filled resin layer 5, and the internal pressure is lowered while blocking the outside air. In this case, as the lead wire 7,
For example, those with low mechanical strength, double-filled resin RF45,
6, the mechanical strength of at least the 8 portions of the boundary surface 8 is reduced by peeling off the second filled resin layer B. If a wire selected to have a strength that allows it to be cut is used, the boundary surface 8 between both filling resin layers 5 and 6 of the lead wire 7 will be cut and softened by the heat generated by the destruction of the electrons 2 to the case-exposed electronic component 1. However, in order for it to swell due to gas pressure, its hardness must be less than A hardness 80 specified in J18 and 6301. Furthermore, in this example, polyurethane-based synthetic resin is used as the filling resin. The unique viscosity of polyurethane makes the above action easier. In addition, in order for the second filled resin layer 6 to peel off from the case 4 and the first filled resin layer 5 without being softened by the heat generation and hardly deformed even when the first filled resin layer 5 is pushed up, , its hardness is JI8 6501
In addition, in this embodiment, the shape of the interface 8 between the first filled resin layer 5 and the second filled resin layer 6 is high at the part where it contacts the outer case 4. Due to the low curved shape in the central part, the peeling action can be carried out very easily.
以上述べた如く、本発明のケース外装形電子部品は、充
填樹脂を二層構造とし、金属化プラスチックフィルムコ
ンデンサ素子あるいは金属比プラスチックフィルムコン
デンサ素子を含む複合電子部品素子を被覆する第一の充
填樹脂層の硬度をJI8に6301に規定のA硬度80
以下、第二の充填樹脂層の硬度を同硬度90以上に選定
した構成となっているので、外装ケースに特別な材質や
構造のものを使用する必要がなく、且つ、合成樹脂を二
層に分けて充填するだけの簡単な製造方法で、金属化プ
ラスチックフコン行寸
イル電子の破壊時に於いて、確実に内部圧力を低下させ
爆発を回避することができるものである。As described above, the case-exterior type electronic component of the present invention has a two-layer structure of filled resin, and the first filled resin covers the composite electronic component element including the metallized plastic film capacitor element or the metallized plastic film capacitor element. The hardness of the layer is JI8 6301 and the specified A hardness 80
Since the hardness of the second filled resin layer is selected to be 90 or higher, there is no need to use a special material or structure for the outer case, and it is possible to use two layers of synthetic resin. With a simple manufacturing method that requires only separate filling, it is possible to reliably lower the internal pressure and avoid explosion when a metallized plastic container is destroyed.
第1図は従来のケース外装形電子部品の概略断面図、第
2図は充填樹脂層の境界面部分のリード線に機械的弱部
を形成した場合を示す拡大断面図、第3図は第を図に示
したケース外装形電子部品の防爆機構が動作した状態を
示す概略断面図、第4図は本発明の一実施例に係るケー
ス外装形電子部品の概略断面図、第5図は第4図に示し
たケース外装形電子部品の防爆機構が動作した状態を示
す概略断面図である。
1・・・ケース外装形電子部品 2・・・金属プラス
チックフィルムコンデンサ素子 3・・・電子部品素
子 4・・・外装ケース 5・・・第一の充填樹脂
層 6・・・第二の充填樹脂層Fig. 1 is a schematic cross-sectional view of a conventional case-exterior type electronic component, Fig. 2 is an enlarged cross-sectional view showing a case where a mechanically weak part is formed in the lead wire at the interface of the filled resin layer, and Fig. 3 is a schematic cross-sectional view of a conventional case-exterior type electronic component. FIG. 4 is a schematic cross-sectional view of a case-exposed electronic component according to an embodiment of the present invention, and FIG. FIG. 5 is a schematic cross-sectional view showing a state in which the explosion-proof mechanism of the case-exposed electronic component shown in FIG. 4 is in operation. DESCRIPTION OF SYMBOLS 1... Case exterior type electronic component 2... Metal-plastic film capacitor element 3... Electronic component element 4... Exterior case 5... First filled resin layer 6... Second filled resin layer
Claims (2)
あるいは金属化プラスチッナヤンデンサ素子を含む複合
電子部品素子を一面が開口部となされた外装ケースに収
納し、且つ上記素子を、被覆する第一の充填樹脂層を形
成すると共に第一の充填樹脂層を覆ってケース開口部に
第二の充填樹脂層を形成したケース外装形電子部品に於
いて、第一の充填樹脂層の硬度をJISK6301に規
定されるA硬度80以下、第二の充填樹脂層の硬度を同
硬度90以上に選定したことを特徴上するケース外装形
電子部品。(1) A composite electronic component element including a metallized plastic film capacitor element or a metallized plastic film capacitor element is housed in an exterior case having an opening on one side, and a first filled resin layer covering the element is provided. In case-exposed electronic components in which a second filled resin layer is formed at the case opening to cover the first filled resin layer, the hardness of the first filled resin layer is A hardness specified in JIS K6301. 80 or less, and the hardness of the second filled resin layer is selected to be 90 or more.
の形状が外装ケースに接する部分で高く中央部分で低い
曲面状であることを特徴とする特許請求の範囲第1項に
記載のケース外(3)第一の充填樹脂層がポリウレタン
系合成樹脂であることを特徴とする特許請求の範囲第1
項もしくFi第2項に記載のケース外装形電子部品。(2) Claim 1, characterized in that the shape of the boundary surface between the first filled resin layer and the second filled resin layer is a curved surface that is higher in the part that contacts the outer case and lower in the central part. Claim 1, characterized in that (3) the first filled resin layer is a polyurethane-based synthetic resin.
Case exterior type electronic component as described in item 2 or Fi item 2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12078482A JPS5911615A (en) | 1982-07-12 | 1982-07-12 | Case sheathing type electronic part |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12078482A JPS5911615A (en) | 1982-07-12 | 1982-07-12 | Case sheathing type electronic part |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5911615A true JPS5911615A (en) | 1984-01-21 |
JPS6354204B2 JPS6354204B2 (en) | 1988-10-27 |
Family
ID=14794912
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12078482A Granted JPS5911615A (en) | 1982-07-12 | 1982-07-12 | Case sheathing type electronic part |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5911615A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63137407A (en) * | 1986-11-28 | 1988-06-09 | 松下電器産業株式会社 | Metallized film capacitor |
JPS63215957A (en) * | 1987-03-04 | 1988-09-08 | Snow Brand Milk Prod Co Ltd | Explosionproof sensor |
JPH0714749A (en) * | 1993-06-01 | 1995-01-17 | Honshu Paper Co Ltd | Capacitor equipped with improved safety function |
JP2002313601A (en) * | 2001-04-17 | 2002-10-25 | Marcon Electronics Co Ltd | Resin-sealed electronic part |
JP2006245170A (en) * | 2005-03-02 | 2006-09-14 | Shizuki Electric Co Inc | Capacitor |
JP2009094266A (en) * | 2007-10-09 | 2009-04-30 | Nichicon Corp | Dry type film capacitor |
WO2019141388A1 (en) * | 2018-01-16 | 2019-07-25 | Tdk Electronics Ag | Wound capacitor encapsulated in housing |
WO2020031339A1 (en) * | 2018-08-09 | 2020-02-13 | 株式会社 オハラ | Crystallized glass substrate |
US11923147B2 (en) | 2019-08-29 | 2024-03-05 | Murata Manufacturing Co., Ltd. | Film capacitor |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5420358A (en) * | 1977-07-15 | 1979-02-15 | Matsushita Electric Ind Co Ltd | Metallized film capacitor |
JPS5495858U (en) * | 1977-12-19 | 1979-07-06 | ||
JPS54110750U (en) * | 1978-01-24 | 1979-08-03 | ||
JPS54169540U (en) * | 1978-05-18 | 1979-11-30 | ||
JPS5545282U (en) * | 1978-09-19 | 1980-03-25 | ||
JPS55173127U (en) * | 1979-05-28 | 1980-12-12 | ||
JPS56101731A (en) * | 1980-01-19 | 1981-08-14 | Matsushita Electric Ind Co Ltd | Metallized film condenser |
JPS56101734A (en) * | 1980-01-18 | 1981-08-14 | Matsushita Electric Ind Co Ltd | Metallized film storage battery |
JPS56169540U (en) * | 1980-05-16 | 1981-12-15 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5220363A (en) * | 1975-08-08 | 1977-02-16 | Nisshin Steel Co Ltd | Method of controlling thickness of hot bar |
-
1982
- 1982-07-12 JP JP12078482A patent/JPS5911615A/en active Granted
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5420358A (en) * | 1977-07-15 | 1979-02-15 | Matsushita Electric Ind Co Ltd | Metallized film capacitor |
JPS5495858U (en) * | 1977-12-19 | 1979-07-06 | ||
JPS54110750U (en) * | 1978-01-24 | 1979-08-03 | ||
JPS54169540U (en) * | 1978-05-18 | 1979-11-30 | ||
JPS5545282U (en) * | 1978-09-19 | 1980-03-25 | ||
JPS55173127U (en) * | 1979-05-28 | 1980-12-12 | ||
JPS56101734A (en) * | 1980-01-18 | 1981-08-14 | Matsushita Electric Ind Co Ltd | Metallized film storage battery |
JPS56101731A (en) * | 1980-01-19 | 1981-08-14 | Matsushita Electric Ind Co Ltd | Metallized film condenser |
JPS56169540U (en) * | 1980-05-16 | 1981-12-15 |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63137407A (en) * | 1986-11-28 | 1988-06-09 | 松下電器産業株式会社 | Metallized film capacitor |
JPH048932B2 (en) * | 1986-11-28 | 1992-02-18 | ||
JPS63215957A (en) * | 1987-03-04 | 1988-09-08 | Snow Brand Milk Prod Co Ltd | Explosionproof sensor |
JPH0714749A (en) * | 1993-06-01 | 1995-01-17 | Honshu Paper Co Ltd | Capacitor equipped with improved safety function |
JP2002313601A (en) * | 2001-04-17 | 2002-10-25 | Marcon Electronics Co Ltd | Resin-sealed electronic part |
JP4702507B2 (en) * | 2001-04-17 | 2011-06-15 | 日本ケミコン株式会社 | Resin-sealed electronic components |
JP2006245170A (en) * | 2005-03-02 | 2006-09-14 | Shizuki Electric Co Inc | Capacitor |
JP4702597B2 (en) * | 2005-03-02 | 2011-06-15 | 株式会社指月電機製作所 | Capacitor |
JP2009094266A (en) * | 2007-10-09 | 2009-04-30 | Nichicon Corp | Dry type film capacitor |
WO2019141388A1 (en) * | 2018-01-16 | 2019-07-25 | Tdk Electronics Ag | Wound capacitor encapsulated in housing |
WO2020031339A1 (en) * | 2018-08-09 | 2020-02-13 | 株式会社 オハラ | Crystallized glass substrate |
US11923147B2 (en) | 2019-08-29 | 2024-03-05 | Murata Manufacturing Co., Ltd. | Film capacitor |
Also Published As
Publication number | Publication date |
---|---|
JPS6354204B2 (en) | 1988-10-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101312253B (en) | Bag type secondary battery | |
US5305178A (en) | Capacitor with increased electrical breakdown strength and method of forming the same | |
JPS5911615A (en) | Case sheathing type electronic part | |
JPH1055792A (en) | Thin battery | |
JPS61216417A (en) | High voltage capacitor | |
US5446436A (en) | High voltage high power arc suppressing fuse | |
US3185905A (en) | Electric condenser embedded in a thermosetting resin and provided with a protector breakable by an interior overpressure | |
JPH05251290A (en) | Cased capacitor | |
JP2003022928A (en) | Laminated metallized film capacitor | |
JPH0414913Y2 (en) | ||
KR102264632B1 (en) | Secondary battery and method of manufacturing the same | |
JPH1174150A (en) | Capacitor | |
JPH0356026Y2 (en) | ||
JPS6210983Y2 (en) | ||
CN210467451U (en) | Surge absorbing element and electronic component | |
CN1103487C (en) | Internal fuse protected dry self-healing high-voltage capacitor element | |
JPH0414912Y2 (en) | ||
JPS607463Y2 (en) | Capacitor with safety device | |
JPH04372107A (en) | Metallized film capacitor | |
JPH05129011A (en) | Battery with safety mechanism | |
JPS6356687B2 (en) | ||
JPH0514500Y2 (en) | ||
JP2589484Y2 (en) | Electrolytic capacitor | |
JPH0463530B2 (en) | ||
JPS6128206B2 (en) |