JPS59110781A - Apparatus for etching metal plate - Google Patents
Apparatus for etching metal plateInfo
- Publication number
- JPS59110781A JPS59110781A JP21830482A JP21830482A JPS59110781A JP S59110781 A JPS59110781 A JP S59110781A JP 21830482 A JP21830482 A JP 21830482A JP 21830482 A JP21830482 A JP 21830482A JP S59110781 A JPS59110781 A JP S59110781A
- Authority
- JP
- Japan
- Prior art keywords
- manifold
- scale
- metal plate
- storage tank
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は金属板の腐蝕装置に係り、特に帯状金属板を連
続して腐蝕する腐蝕装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an apparatus for corroding a metal plate, and more particularly to an apparatus for corroding a strip-shaped metal plate in a continuous manner.
金属薄板に微細なパターン腐蝕加工したものが電子部品
等で多用されている。Thin metal plates with fine patterns etched into them are often used in electronic components.
このような腐蝕加工は通常金属薄板の一主面または両面
に例えばレジスト膜を塗布し光露光法によって腐蝕すべ
き部分のパターンを館山させ、腐蝕液を一主面または両
面側から吹きつけていわゆるエツチングが行なわれる。This kind of corrosion processing is usually done by applying a resist film to one or both main surfaces of a thin metal sheet, forming a pattern of the part to be corroded using a light exposure method, and then spraying a corrosive solution from one or both main surfaces. Etching is performed.
また量産的には金属薄板を帯状の長尺として一定速度で
移動させ乍ら連続腐蝕(以降エツチングと称す)させた
後素子ごとにカツテングする方法がとられる。For mass production, a method is used in which a thin metal plate is formed into a long strip and moved at a constant speed, subjected to continuous corrosion (hereinafter referred to as etching), and then cut into individual elements.
第1図はこのようなに樋装置の概略構成を示すもので、
腐蝕装置(1)は腐蝕液(4)を噴出させる複数のノズ
ル(3)を有するマニホールド(21を主体として構成
され、第1図の場合は一定速度で移動する帯状の長尺金
鳥薄板(5)を両側のノズル(31の中央を通過し腐蝕
が行ガわれる。腐蝕液は一定量の腐蝕により腐蝕能率が
低1・するのでポンプ(P)によりストレージタンク(
6)を介して循環させ、腐蝕能率が全体として許容値以
下とかった場合はドレイン(7)から廃液処理装置(図
示せず)へ送られることになる。また金属板(5)と腐
蝕液(4)によっては腐蝕液の再生も可能である。例え
ば、鉄を主成分とする金属板を塩化第2鉄液で腐蝕する
場合、
Fe+2Fec13−+ 3Fec12なる反応により
腐蝕能力のないFe c 12が生成されるが、とのF
e c 12は、
3Fec12 +、、1c12.3Fec13なる反応
により元の塩化第2鉄(Fee13)に再生することが
できる。この場合は再生ガス(91として塩素ガスと水
(8)を腐蝕液循環径路に加えて腐蝕液の濃度や比重を
調整すればよい。Figure 1 shows the schematic configuration of such a gutter device.
The corrosive device (1) is mainly composed of a manifold (21) having a plurality of nozzles (3) that eject a corrosive liquid (4), and in the case of FIG. 5) is passed through the center of both nozzles (31) and the corrosion is carried out.The corrosion efficiency of the corrosive liquid is low due to a certain amount of corrosion, so the pump (P) is used to remove the corrosive liquid from the storage tank (31).
6), and if the overall corrosion efficiency is below the allowable value, it will be sent to a waste liquid treatment device (not shown) from the drain (7). Furthermore, depending on the metal plate (5) and the corrosive liquid (4), it is also possible to regenerate the corrosive liquid. For example, when a metal plate whose main component is iron is corroded with a ferric chloride solution, the reaction Fe+2Fec13-+3Fec12 produces Fec12, which has no corrosive ability.
e c 12 can be regenerated into the original ferric chloride (Fee13) by the reaction 3Fec12 +, 1c12.3Fec13. In this case, the concentration and specific gravity of the corrosive liquid may be adjusted by adding chlorine gas and water (8) as the regeneration gas (91) to the corrosive liquid circulation path.
しかし乍ら腐蝕加工を継続して行う場合、第2図に示す
ようにマニホールド(2)内にスケール0υが溜積する
現象が発生する。このスケール(1,11は放置す株β
るとその溜積が冒チに増加し、マニホールド(2)壁か
ら剥頗イしてノズル(31の目詰りを生じて腐蝕むらを
生じたり、時には腐蝕熱によって腐蝕液温度が上昇しマ
ニホールド(2)を加熱しスケール旧)との熱膨張率の
違いによってマニホールド(2)にクラックを生ずるこ
とをえある。またスケールQ、11が形成される機構は
確認されていないが腐蝕液(4)のマニホールド(2)
内の流れによってマニホールド壁が浸蝕を受は荒れが発
生するとスケールの成長は急速に進行し、特にマニホー
ルドがチタンのような金属で形成はれている場合は腐蝕
液の侵蝕を隻・け易く従ッテスケールの成長′も速い。However, if the corrosion process is continued, a phenomenon occurs in which scale 0υ accumulates in the manifold (2), as shown in FIG. If this scale (1, 11 is strain β) is left untreated, its accumulation will increase significantly, and it will peel off from the manifold (2) wall, clog the nozzle (31), cause uneven corrosion, and sometimes The temperature of the corrosive liquid rises due to the heat of corrosion, which heats the manifold (2) and may cause cracks in the manifold (2) due to the difference in thermal expansion coefficient with the old scale.Also, the mechanism by which scales Q and 11 are formed Although not confirmed, the manifold (2) of the corrosive liquid (4)
If the manifold wall is eroded by the flow inside the manifold and becomes rough, scale growth will progress rapidly.Especially if the manifold is made of metal such as titanium, it will be easier to remove the corrosive liquid. The scale growth is also fast.
このスケールハ汚泥状の比較的やわらかい表面層とマニ
ホールド内壁側の固い層とに分かれて@層されており、
通常の流水洗浄や機械的とすりで完全に除去することは
非常に困難である。しかし乍らマニホールドを取り外し
マニホールド内壁を一定量研削するがまたは新たに交換
することは経済的にも労力的にも非常な不利益を蒙るこ
とになる。This scale is divided into a relatively soft sludge-like surface layer and a hard layer on the inside wall of the manifold.
It is extremely difficult to completely remove it with normal washing under running water or mechanical sanding. However, removing the manifold and grinding the inner wall of the manifold by a certain amount, or replacing the manifold with a new one, will result in great disadvantages both economically and in terms of labor.
本発明は以上の問題に鑑みてなされたもので、マニホー
ルド内に溜積したスケールをマニホールドを取り外すこ
となく容易に除去し得る金属板の腐蝕装置を提供するこ
とを目的とする。The present invention has been made in view of the above problems, and an object of the present invention is to provide a metal plate corrosion device that can easily remove scale accumulated in a manifold without removing the manifold.
本発明はマニホールド内に溜積するスケールを除去する
ためのマニホールドに連通ずる洗浄液循珈装置を備え、
スケールの内表面のやわらかい層は水圧により除去し、
マニホールド内壁側の固い層は化学的反応により除去す
ることを特徴とする。The present invention includes a cleaning liquid circulation device communicating with the manifold for removing scale accumulated in the manifold,
The soft layer on the inner surface of the scale is removed using water pressure.
The hard layer on the inner wall of the manifold is removed by a chemical reaction.
以下に本発明の実施例について説明する。本発明を実施
するに際してまずマニホールド内に溜積するスケールの
組成の解析を試みだ。例えば鉄を主成分とし腐蝕液とし
て塩化第2鉄を用いた腐蝕装置の場合、マニホールド内
に溜積するスケールのうち表面の比較的やわらかい汚泥
状の表面層はFe2O3・H2Oやレジストかす等が大
部分である。Examples of the present invention will be described below. When implementing the present invention, we first attempted to analyze the composition of scale that accumulates within the manifold. For example, in the case of an etching device that uses iron as the main component and ferric chloride as the corrosive liquid, the relatively soft sludge-like surface layer of the scale that accumulates in the manifold is largely composed of Fe2O3, H2O, resist scum, etc. It is a part.
レジストかすけ第2図に示す金属板(5)の面に塗布さ
れたレジスト膜(10)が腐蝕時に一部剥離しストレー
ジタンクを介してマニホールド(21内に循環qf5積
したもので、Fe2O8・H2Oは同じく腐蝕時の反応
生成物と考えられる。マニホールド内壁側に溜積した固
い層はシリカを主成分とするもので、とのシリカは金属
板に含まれているシリカが腐蝕時に複合化合物となって
遊離しマニホールド内に循環きれマニホールドを構成す
る金属表面と何等かの反応を生じて固着したものと考え
られ、この固い膜を機械的に均一に除去することは非常
に困難である。しかし乍らこのような固着膜はその組成
に応じて洗浄液、主として酸類により化学的に除去する
ことが可能である。Resist Fading The resist film (10) applied to the surface of the metal plate (5) shown in Fig. 2 partially peels off during corrosion and is circulated in the manifold (21) via the storage tank. H2O is also considered to be a reaction product during corrosion.The hard layer that accumulates on the inner wall of the manifold is mainly composed of silica, which is formed when the silica contained in the metal plate forms a composite compound during corrosion. It is thought that this hard film is stuck due to some kind of reaction with the metal surface that makes up the manifold, and it is extremely difficult to uniformly remove this hard film mechanically. However, such a fixed film can be chemically removed using a cleaning solution, mainly acids, depending on its composition.
第3図は本発明の実施例の腐蝕装置を示す概略構成図で
第1図と同様の部材は同一部材で示しである。以下に鉄
または鉄及びニッケルを主成分とする金属板、例えば厚
さ0.1 am乃至0.3菱のカラー受像管用シャドウ
マスクの多数の微細開孔を塩化第2鉄で腐蝕する場合に
ついて説明する。まず腐蝕装置に入る前段で金属板(5
)の両面に光露光法により腐蝕穿設されるべき開孔部分
に相当する部分のみレジスト膜を除去露出する工程が完
了されている。次いで金属板(5)は腐蝕装置(1)の
マニホールド(21の間を通過しマニホールド(21の
複数のノズル(3)から噴出する腐蝕液(4)塩化第2
鉄により両面側から腐蝕させ所定の開孔が穿設され次の
工程に送られる。腐蝕液(4)はストレージタンク(6
)を介してマニホールド(2)内へ循環されるが、この
循環径路中には再生ガス(9)として塩素ガスと水(8
)が導入され腐蝕液の濃度や比重が調整される。FIG. 3 is a schematic configuration diagram showing an etching apparatus according to an embodiment of the present invention, and the same members as in FIG. 1 are shown as the same members. Below, we will explain the case where a large number of fine holes in a metal plate mainly composed of iron or iron and nickel, such as a shadow mask for a color picture tube with a thickness of 0.1 am to 0.3 mm, are corroded with ferric chloride. do. First, a metal plate (5
) The process of removing and exposing only the portions of the resist film corresponding to the openings to be etched by photolithography on both sides of the substrate has been completed. The metal plate (5) then passes between the manifolds (21) of the corrosive device (1), and the corrosive liquid (4) jets out from the plurality of nozzles (3) of the manifold (21).
Both sides are corroded with iron, predetermined holes are drilled, and the material is sent to the next process. The corrosive liquid (4) is stored in the storage tank (6
) into the manifold (2), and during this circulation path, chlorine gas and water (8) are used as regeneration gas (9).
) is introduced to adjust the concentration and specific gravity of the corrosive solution.
このような腐蝕装置(1)により約1ケ月府蝕を継続し
た後、マニホールド内に溜積したスケールを除去する。After continuing the erosion for about one month using such an erosion device (1), the scale accumulated in the manifold is removed.
まずマニホールド(2)のノズル(3)を取り外し、マ
ニホールド(2)両端の金属板人出口にめくら蓋をとり
つけ、水導入路(8)から3乃至4 KgAJの圧力で
流水し、スケール表面の汚泥状層を洗い流す。First, remove the nozzle (3) of the manifold (2), attach a blind cover to the metal plate outlet at both ends of the manifold (2), and run water from the water introduction channel (8) at a pressure of 3 to 4 KgAJ to remove the sludge on the scale surface. Wash away the stratum corneum.
この流水はドレイン(7)から廃液処理装置(図示せず
)へ送られる。次いで洗浄液として約加%のふつ酸溶液
を洗浄液ストレージタンク任2)からマニホールド(2
)内に約2乃至3 Kg/crlの圧力で圧送し10乃
至m分程度洗浄しスケールのマニホールド四側の固着層
を溶解除去する。このぶつ酸液はストレージタンク02
+とマニホールド(2)内を循環する。ぶつ酸のスケー
ル溶解能力が規定値以下に低下した場合はストレージタ
ンク(121のドレインから廃液処理装置(図示せず)
へ送られる。次いで再び水導入路(8)からの3乃至4
KgA−の圧力の流水によりぶつ酸を洗い流す。この
時取り外したノズル(3)は別途上記と同様にスケール
を除去しておく。全ての洗浄が終了した時点で腐蝕液の
塩化第2鉄を再びマニホールド内に導入し腐蝕液の濃度
及び比重を調整し、ノズルをとりつける。また以上の各
工程においてスケール溶解後流水洗浄工程を省略し直ち
に屑蝕液で洗浄液を除去すれば相応分の腐蝕液は廃棄す
ることになるが工程数及び時間は短縮される0
以上の実施例ではカラー受像管のシャドウマスクに適用
した例について説明したが本発明はこれに限らず、回路
基板やリードフレーム等の電子部品或はその他にも適用
し得ることは言うまでもない。This running water is sent from the drain (7) to a waste liquid treatment device (not shown). Next, as a cleaning solution, a diluted acid solution with a concentration of approximately 1% is added from the cleaning solution storage tank (2) to the manifold (2
) at a pressure of about 2 to 3 Kg/crl and washed for about 10 to 10 m to dissolve and remove the fixed layer on the four sides of the scale manifold. This acid solution is stored in storage tank 02.
+ circulates in the manifold (2). If the scale dissolving ability of butic acid falls below the specified value, the storage tank (121 drain to waste liquid treatment device (not shown))
sent to. Then again from 3 to 4 from the water introduction channel (8)
The acid is washed away with running water at a pressure of KgA-. The scale of the nozzle (3) removed at this time is removed separately in the same manner as above. When all cleaning is completed, the corrosive liquid ferric chloride is introduced into the manifold again, the concentration and specific gravity of the corrosive liquid are adjusted, and the nozzle is attached. In addition, in each of the above steps, if the washing step with running water is omitted after scale dissolution and the washing solution is immediately removed with a waste corrosive solution, a corresponding amount of the corrosive solution will be discarded, but the number of steps and time will be shortened. Although an example in which the present invention is applied to a shadow mask of a color picture tube has been described, it goes without saying that the present invention is not limited to this, and can be applied to electronic components such as circuit boards and lead frames, and others.
以上のように本発明によればマニホールドを除去するこ
となくマニホールド内に溜積したスケールを容易に除去
することができ、能率的、経済的な腐蝕装置を提供する
ことができる。As described above, according to the present invention, scale accumulated in the manifold can be easily removed without removing the manifold, and an efficient and economical corrosion apparatus can be provided.
第1図は従来の腐蝕装置を示す概略構成図、第2図は第
1図のマニホールド部分を示す要部の部分断面図、第3
図は本発明の一実施例を示す概略構成図である。
(1)・・・腐蝕装置 (2)・・・マニホー
ルド(3)・・・/ スル(41・・・腐蝕液(5)・
・・金属板 (6)・・・腐蝕液ストレージ
タンク
(7)・・・ドレイン (8)・・・水(9)
・・・再生ガス (12+・・・洗浄液ストレ
ージタンク
代理人弁理士 則 近 憲 佑 (ほか1名)第 1
図
第 2 図Fig. 1 is a schematic configuration diagram showing a conventional corrosion equipment, Fig. 2 is a partial sectional view of the main part showing the manifold part of Fig. 1, and Fig. 3
The figure is a schematic configuration diagram showing one embodiment of the present invention. (1)...Erosion device (2)...Manifold (3).../Thru (41...Erosion liquid (5)
...Metal plate (6) ...Corrosive liquid storage tank (7) ...Drain (8) ...Water (9)
...Regeneration gas (12+...Cleaning liquid storage tank representative patent attorney Noriyuki Chika (and one other person) No. 1
Figure 2
Claims (1)
液を循環させて金属板を腐蝕する金属板の腐蝕装置にお
いて、前記マニホールド内に溜積するスケールを除去す
るための前記マニホールドに連通する洗浄液循環装置を
具備することを特徴とする金属板の腐蝕装置。In a metal plate corrosive apparatus that corrodes a metal plate by circulating a corrosive liquid in a manifold having a nozzle for spouting a corrosive liquid, a cleaning liquid circulation device communicating with the manifold for removing scale accumulated in the manifold. A metal plate corrosion device characterized by comprising:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21830482A JPS59110781A (en) | 1982-12-15 | 1982-12-15 | Apparatus for etching metal plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21830482A JPS59110781A (en) | 1982-12-15 | 1982-12-15 | Apparatus for etching metal plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59110781A true JPS59110781A (en) | 1984-06-26 |
Family
ID=16717735
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21830482A Pending JPS59110781A (en) | 1982-12-15 | 1982-12-15 | Apparatus for etching metal plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59110781A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013187036A1 (en) * | 2012-06-14 | 2013-12-19 | シャープ株式会社 | Chemical processing apparatus |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5420978A (en) * | 1977-07-16 | 1979-02-16 | Kouriyuu Kougiyou Kk | Method of cleaning scale |
-
1982
- 1982-12-15 JP JP21830482A patent/JPS59110781A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5420978A (en) * | 1977-07-16 | 1979-02-16 | Kouriyuu Kougiyou Kk | Method of cleaning scale |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013187036A1 (en) * | 2012-06-14 | 2013-12-19 | シャープ株式会社 | Chemical processing apparatus |
CN104246989A (en) * | 2012-06-14 | 2014-12-24 | 夏普株式会社 | Chemical processing apparatus |
JPWO2013187036A1 (en) * | 2012-06-14 | 2016-02-04 | シャープ株式会社 | Chemical treatment equipment |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5753135A (en) | Apparatus and method for recovering photoresist developers and strippers | |
JP2002515318A (en) | Apparatus and method for recovering photoresist developer and film stripper | |
JPS59110781A (en) | Apparatus for etching metal plate | |
CA1147246A (en) | Process for cleaning copper-containing metal surfaces | |
US4889585A (en) | Method for selectively forming small diameter holes in polyimide/Kevlar substrates | |
JPS5852324B2 (en) | Manufacturing method of semiconductor device | |
JPH0786261A (en) | Method for peeling photoresist | |
JP3078581B2 (en) | Method and apparatus for washing metal sheet after chemical etching | |
CA2028060A1 (en) | Apparatus for processing pre-sensitized lithographic printing plate | |
JPH01201491A (en) | Etching method | |
JPS6145875B2 (en) | ||
KR101752782B1 (en) | Cleansing liquid for removing lower electrode coating layer and lower elerode coating layer removing method using the same | |
JPH09249980A (en) | Wet etching method of metal material | |
JPH0742000A (en) | Method for etching metal surface | |
JP2003283111A (en) | Method for cleaning printed wiring board | |
JP3716456B2 (en) | Etching part manufacturing method | |
JP4665498B2 (en) | Developing apparatus and developing method | |
JPH07261013A (en) | Production of color filter and production of tft circuit | |
CN116991045A (en) | Etching process for controlling etching (depth and shape of half etching area) | |
JPH11202309A (en) | Substrate washing and etching device for liquid crystal display substrate | |
JPH0113097B2 (en) | ||
JP4120308B2 (en) | Manufacturing method of color filter | |
JP2006267820A (en) | Liquid development method and development apparatus | |
CN118390054A (en) | Etching solution treatment method for processing mask plate | |
JPS62287063A (en) | Method for removing matter sticking to thin film treating equipment |