JPS59110149A - Pressurizing device for semiconductor element unit - Google Patents

Pressurizing device for semiconductor element unit

Info

Publication number
JPS59110149A
JPS59110149A JP57219184A JP21918482A JPS59110149A JP S59110149 A JPS59110149 A JP S59110149A JP 57219184 A JP57219184 A JP 57219184A JP 21918482 A JP21918482 A JP 21918482A JP S59110149 A JPS59110149 A JP S59110149A
Authority
JP
Japan
Prior art keywords
pressurizing
pressure
element unit
semiconductor
pressurizing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57219184A
Other languages
Japanese (ja)
Inventor
Yukio Kaneko
幸雄 金子
Hideki Ikeuchi
秀樹 池内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP57219184A priority Critical patent/JPS59110149A/en
Publication of JPS59110149A publication Critical patent/JPS59110149A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To enable to adjust the pressure by incorporating a measurement element and a pressure fitting to a jig plate, in a semiconductor unit wherein a semiconductor elements and cooling bodies are stacked alternately and clamped. CONSTITUTION:The flat type semiconductor element unit 1 is composed by alternately stacking the flat type semiconductor elements 2 and the cooling bodies 3, inserting insulation studs 6 between the upper check plate 4 and the lower check plate, and then clamping them with nuts 7. A leaf spring 9 is interposed between the upper check plate 4 and an insulation plate 8 provided on the cooling body 3 at the uppermost stage, and pressure is applied to each element and cooling body. A pressure device 10 consisting of the jig plate 11, a pressing bolt 14, and the measurement element 12 is provided at the upper ends of the insulation studs 6. After pressing up to a prescribed pressure by using the pressure device 10, the nuts are lightly tightened, and the pressure device is removed, thus completing the assembly.

Description

【発明の詳細な説明】[Detailed description of the invention]

［発明の技術分野３ 本発明は複数個の平形半導体素子を積み重ねて構成する
平形半導体素子ユニットの改良した加圧装置に関する。 ［発明の技術的背景とその問題点］ 平形半導体素子ユニットは所要数の半導体素子と冷却体
とを交互に積み点ね、これを板バネを介して両側の押え
板をスタッドで締めつけることによって構成されている
。そし７てその板バネによって必要な規定圧力が附加さ
れてユニットとしての構築体が維持されているととも[Technical Field of the Invention 3] The present invention relates to an improved pressurizing device for a flat semiconductor device unit formed by stacking a plurality of flat semiconductor devices. [Technical background of the invention and its problems] A flat semiconductor device unit is constructed by stacking the required number of semiconductor devices and cooling bodies alternately, and tightening the holding plates on both sides with studs via leaf springs. has been done. 7.The leaf spring applies the necessary specified pressure to maintain the structure as a unit.

【
二、各半導体素子および冷却体の接触圧力も保持てれて
いるものである。したがってこのような半導体素子ユニ
ットとしては、バネによる加圧力管理がその長期使用に
よる劣化を防止するためｌ二大事なことである。 しかして、従来の素子ユニットの素子加圧方法は、所要
数の素子および冷却体を積み重ねたのち、フレスなど工
、泗圧して組み立しているが、例えば素子ユニット製品
の納入先での素子交換を行なう場合は、プレスなどの加
圧装置が無いことがら、素子ユニットを組み立てている
締付スフラド用ナツトの締めつけトルクによって加圧力
が管理していた。しかし、ナツトの締めっけトルクによ
る加圧力管理は、間接的測定であり、かつネジの摩擦と
いう１ｂｊｖ、めで不定性要素の大きい方法でもあり、
正確な測定は困峠と云わねばならない。 一方、素子ユニットの構成体の中ｆ二、例えば上部押え
板に加圧力を耐力する締付ボルトとその締付圧力を測定
する測定素子とを組みこむことも考えられる。しかし、
これでは加圧、＜ｕ’ｉ定素子の附加によって素子ユニ
ットの価格が高くなるばかりか、長期使用からくる劣化
による信頼性の低下は妨げられない。 ［発明の目的］ 本発明の目的は、素子ユニットの組立工程の過程で、ま
たは素子交かの過程で間車な手法Ｃよって容易に加圧有
理ができ、併せて作業し易い軽量小形で部品点数の少な
い半導体素子ユニットの加圧装置を提供するものである
。 ［発明の概要］ 本発明は素子ユニットの絶縁締付スフラドの端部を利用
して取りつけられる治具板に加圧用ボルトを設け、この
加圧用ポル）−二より測定素子を介して素子ユニットを
加圧することを特徴とする半導体素子ユニットの加圧装
置、に関するものである。 ［発明の実施例］ 以下本発明を図面と二示す各実施例に二ついて説明する
。まず第１図は本発明による加圧装置を用いて本発明に
よる加圧方法の施行によって組み立てられた平形半導体
素子ユニット１を示している。 同図において、素子ユニット１は必要個数の平形半導体
素子２と冷却体３とを交互Ｃ１績み、淑ね、その上部押
え板４および下部弁え板５０間に絶縁スタッド６を通し
、ナツト７を締めつけるとと（二よって構成されている
。 上部押え板４と最上段の冷却体３の上面に設けた絶縁板
８との間に板バネ９を介挿している。この板バネ９は絶
縁スタッド６によって締めつけられたどき、図示のよう
ζ二偏位されて積み重ねられた各素子２および冷却体３
に加圧力を附与する。 この加圧カバ、素子ユニット１の機械的構築力を維持す
るとともに、それらの相互間の電気的接触圧力を保持す
るものである。したがってこの板バネ９（二よる加圧力
は、適正に値にすることが素子ユニット１の長Ｍ寿命の
保持につながる。 本発明はめ２図に示すようｉ１素子ユニット１を組み立
てるときに板バネ９による加圧力を附与する加圧装置ｊ
０に特徴を有する。すなわち、第２図において、本発明
による加圧装置１０は、治具板１１゜加圧具である加圧
用ボルト１４およびストレンゲージの如き測定素子１２
を具備し、その治具板１１の両端ｆ１索子ユニット１の
絶縁締付スタッド６．６の上、ｘｊ３：が貫通する遊び
孔１３，１３を設（・Ｊｌその中央部（１加圧用ボルト
１／Ｉを設けるとともに、その下面の凹部１６１−ボル
ト１４で動かされるようＣ１当て板１５をつ「シて測冗
素子１２を設けて構成されている。本発明の加圧装ｆｉ
ｌ　１０は、Ｙ行具板１１．加圧用ボルト１４および測
定素子１２を一体に組み合わされ、しかもこの装置１０
は素子ユニット１の絶縁締付スフラド６．６に取りつけ
るだけで加圧作業を実施することができることが％徴で
ある。すなわち、本発明Ｃ二おいては、素子ユニット１
の組み立てに際し、加圧装置ＩＯを設けるための特別の
治具を多く必要としない。 次に本発明の加圧装置１（ｌで素子ユニット１に加圧力
を附与する手法（二ついて説明する。第２図において、
はじめに絶縁締付スタッド６．６の先端に治具板１１を
通し、ナラ）１７，１７で戦るく左右のバランスを保ち
ながら締める。このとき、測定子］２は凹部１６内ｆ二
当て板１５とともに納められている。 次ｉ二加圧用ボルト１４ζユよって測定子１２がら得ら
れる外部の加圧力表示器が示す規定圧力まで加圧を行な
う。規定圧力となったのち、ナツト７．７を軽るく締め
、加圧用ボルト１４を緩めてナツト１７．１７を外すこ
と【二よって治具板ＩＪの取外しが完了する。 第３図に示す他の実施例は、絶縁締付スタッド６．６の
先端が短い素子ユニット１に適用するもので、スタッド
６．６の先端にネジ孔をあけ、これ１ニワツシャ１８．
１８を有するポル）　１９．．１９で治具板ｌ】を取り
つける。そしてこの加圧装置１０による加圧力法は、第
２図ｆ二示す実施例と同様に行なわ虹る。 第４図に示す他の実施例は、既設の素子ユニット１１一
本発明の加圧装置１．０を適用する場合で、下部の治具
板２０に素子ユニット１を載せ、との治具板２０と加圧
装置ＩＯの治具＆１１との間をロングスタッド２１．２
１とナラ）２２．２２によって間隔を固定したのち、第
２図の場合と同様（ニナット７．７を緩めた状態で中心
部に測定素子１２を当板１５ととも（二凹部１６（二挿
入し、加圧用ボルト１４によって規定圧捷で締めつける
。次にナツト７．７を軽るく締めて加圧は完了する。完
了後はナツト２２．２２を緩め］しはよい。 なお、本発明による加圧装置ＩＯは、第２図ないし第４
図に示す実施例の他に絶縁締付スタッド６．６を保合す
る仕方として、そのスタッド６．６の頭部を犬きくして
横から止ビンを挿入することも考えられる。また中央の
加圧用ポル）　１４０代り１−１油圧又は空気シリンダ
を設けてもよく、あるいは加圧用ボルト１４の無くして
絶縁締付スタンド６．６のナツト１７．１７を代行させ
てもよい。いわゆる素子ユニット１の押え板４を介して
各素子２および冷却体３の積層体Ｃ加圧力を与える加圧
具であればよい。 ［発明の効果］ 以上のよう５二本発明（−よれば、素子ユニットの構成
部品を利用して着脱できる治具板Ｃ二加圧具および測定
素子を組みこんだことによす、軒オ小形で部品点数が少
なく、簡単な操作によって加圧力を管理することができ
るなどの利点をＭする。[
Second, the contact pressure between each semiconductor element and the cooling body is also maintained. Therefore, for such a semiconductor element unit, it is important to manage the pressure applied by the spring in order to prevent deterioration due to long-term use. The conventional method for pressurizing elements in element units is to stack the required number of elements and cooling bodies, then press and press them to assemble them. When performing this, since there is no press or other pressurizing device, the pressurizing force is managed by the tightening torque of the tightening sprue nut used to assemble the element unit. However, the pressure control using the tightening torque of nuts is an indirect measurement method, and it is also a method that involves a large amount of uncertainty due to the friction of the screw.
Accurate measurement must be said to be difficult. On the other hand, it is also conceivable to incorporate a tightening bolt that withstands a pressing force and a measuring element that measures the tightening pressure into the middle of the structure of the element unit, for example, the upper presser plate. but,
This not only increases the price of the element unit due to pressurization and the addition of <u'i constant elements, but also does not prevent reliability from decreasing due to deterioration caused by long-term use. [Objective of the Invention] The object of the present invention is to easily apply pressure in the process of assembling an element unit or in the process of replacing elements, and to create a lightweight and small part that is easy to work with. The present invention provides a pressurizing device for semiconductor element units with a small number of points. [Summary of the Invention] The present invention provides a pressurizing bolt on a jig plate that is attached to the element unit using the end of the insulation tightening sprad, and connects the element unit through the measuring element from this pressurizing bolt. The present invention relates to a pressurizing device for a semiconductor element unit, which is characterized by applying pressure. [Embodiments of the Invention] The present invention will be described below with reference to the drawings and two embodiments. First, FIG. 1 shows a flat semiconductor element unit 1 assembled by the pressurizing method according to the present invention using the pressurizing apparatus according to the present invention. In the figure, an element unit 1 is made by alternately stacking a required number of flat semiconductor elements 2 and a cooling body 3, and then inserting an insulating stud 6 between an upper holding plate 4 and a lower valve plate 50, and tightening a nut 7. A plate spring 9 is inserted between the upper holding plate 4 and an insulating plate 8 provided on the top surface of the uppermost cooling body 3. When tightened by the stud 6, each element 2 and the cooling body 3 are stacked with ζ2 deviation as shown in the figure.
Apply pressure to the This pressure cover maintains the mechanical construction force of the element unit 1 and also maintains the electrical contact pressure between them. Therefore, setting the pressing force applied to the leaf spring 9 to an appropriate value will lead to maintaining a long lifespan of the element unit 1.In the present invention, as shown in Figure 2, when assembling the i1 element unit 1, the leaf spring 9 A pressurizing device that applies pressure by
It has a characteristic of 0. That is, in FIG. 2, the pressurizing device 10 according to the present invention includes a jig plate 11, a pressurizing bolt 14 which is a pressurizing tool, and a measuring element 12 such as a strain gauge.
At both ends of the jig plate 11, above the insulating tightening studs 6.6 of the f1 cable unit 1, play holes 13, 13 are provided through which the 1/I is provided, and a redundancy measuring element 12 is provided by connecting a C1 backing plate 15 to be moved by a recess 161 and a bolt 14 on the lower surface of the recess 161.
l 10 is the Y tool board 11. The pressurizing bolt 14 and the measuring element 12 are combined together, and this device 10
The advantage of this is that pressurizing work can be carried out simply by attaching it to the insulating clamping sufraud 6.6 of the element unit 1. That is, in the present invention C2, the element unit 1
When assembling the pressurizing device IO, many special jigs are not required. Next, a method of applying pressure to the element unit 1 with the pressurizing device 1 (l of the present invention) will be explained using two methods. In FIG.
First, pass the jig plate 11 through the tip of the insulating tightening stud 6.6, and tighten with nuts 17, 17 while maintaining the left and right balance. At this time, the probe] 2 is housed in the recess 16 together with the second contact plate 15. Next, pressurize the measuring element 12 with the two pressurizing bolts 14ζ until the specified pressure indicated by the external pressurizing force indicator is obtained. After the specified pressure is reached, lightly tighten the nuts 7.7, loosen the pressure bolt 14, and remove the nuts 17.17. [2] Thus, the removal of the jig plate IJ is completed. Another embodiment shown in FIG. 3 is applied to the element unit 1 in which the tip of the insulating fastening stud 6.6 is short, and a screw hole is made at the tip of the stud 6.6.
Pol with 18) 19. ．． Attach the jig plate l] at step 19. The pressurizing method using this pressurizing device 10 is carried out in the same manner as in the embodiment shown in FIG. Another embodiment shown in FIG. 4 is a case where the pressurizing device 1.0 of the present invention is applied to the existing element unit 11, and the element unit 1 is placed on the lower jig plate 20. Long stud 21.2 between 20 and pressurizing device IO jig &11
1 and Nara) 22. After fixing the spacing with 22.22, place the measuring element 12 in the center with the backing plate 15 (2 recesses 16 (2 insertion Then tighten the pressure bolt 14 to the specified pressure.Next, lightly tighten the nuts 7.7 to complete the pressure application.After completion, loosen the nuts 22.22.In addition, according to the present invention The pressurizing device IO is shown in Figures 2 to 4.
In addition to the embodiment shown in the figures, it is also conceivable to secure the insulating clamping stud 6.6 by sharpening the head of the stud 6.6 and inserting a stopper from the side. In addition, a 1-1 hydraulic or air cylinder may be provided instead of the central pressurizing pole (140), or the pressurizing bolt 14 may be omitted and the nut 17.17 of the insulating tightening stand 6.6 may be substituted. Any pressurizing tool may be used as long as it applies a pressurizing force to the laminate C of each element 2 and cooling body 3 via the so-called holding plate 4 of the element unit 1. [Effects of the Invention] As described above, according to the present invention (-), the eaves ocher is manufactured by incorporating the jig plate C2, which can be attached and detached using the component parts of the element unit, and the measuring element. It has the advantages of being small, having a small number of parts, and being able to control the pressing force with simple operations.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は平形半導体素子ユニットを示す正面図、第２図
および第３図は本発明Ｃ二よる半坐体累子ユニットの加
圧装置のそれぞれ異なる実施例を一部欠截して示す正面
図、第４図は本発明のさらに他の実施例を示す正面図で
ある。 １・・・半導体素子ユニット　２・・・半導体素子３・
・・冷却体　　　　　４．５・・・押え板６・・・絶縁
締付スタッド　７・・・ナツト８・・・絶縁板　　　　
　９・・・板バネｌＯ・・・加圧装置　　　　１１・・
・治具板１２・・・測定素子　　　　１３・・・遊び孔
１４・・・加圧具（加圧ボルト）１５・・・当て板１６
・・・凹部　　　　　　１７・・・ナツト２０・・・下
部治具板　　　２１・・・ロングスタッド代理人　弁理
士　猪　股　祥　晃　（ほか１名）第１図 第２図 第３図 坑４図FIG. 1 is a front view showing a flat semiconductor element unit, and FIGS. 2 and 3 are partially cut-out front views showing different embodiments of a pressurizing device for a semi-situated transducer unit according to the present invention C2. 4 are front views showing still another embodiment of the present invention. 1... Semiconductor element unit 2... Semiconductor element 3.
... Cooling body 4.5 ... Holding plate 6 ... Insulating tightening stud 7 ... Nut 8 ... Insulating plate
9...Plate spring lO...Pressure device 11...
・Jig plate 12... Measuring element 13... Play hole 14... Pressure tool (pressure bolt) 15... Backing plate 16
...Concavity 17...Nut 20...Lower jig plate 21...Long stud agent Patent attorney Yoshiaki Inomata (and 1 other person) Figure 1 Figure 2 Figure 3 Pit Figure 4

Claims (4)

【特許請求の範囲】[Claims] （１）両側の押え板の間Ｃ半導体素子および冷却体を交
互に積み重ねこれを板バネを介して締めつけて構成した
半導体ユニットと、この半導体ユニットの構成部品ζ二
着脱される治具板に測定素子およびこの６（す定素子を
介して前記半導体ユニットの俗半導体素子および冷却体
Ｃ加圧力を附与する加圧具を組みこみだ加圧装置とから
構成した半導体素子ユニットの加圧装置(1) A semiconductor unit constructed by stacking C semiconductor elements and a cooling body alternately between the presser plates on both sides and tightening them via leaf springs, and a measuring element and A pressurizing device for a semiconductor element unit constituted by a pressurizing device incorporating a pressurizing tool that applies a pressurizing force to the ordinary semiconductor element of the semiconductor unit and the cooling body C through a constant element. （２）　　半導体ユニットの構成部品は絶縁締付スタン
ドの先端部を利用する特許請求の範囲第１項記載の半導
体素子ユニットの加圧装置(2) The pressurizing device for a semiconductor element unit according to claim 1, wherein the component of the semiconductor unit uses the tip of an insulating tightening stand. （３）加圧具は治具板の中央部に設けた加圧用ボルトで
ある特許請求の範囲第１項記載の半導体素子ユニットの
加圧装置(3) The pressurizing device for a semiconductor element unit according to claim 1, wherein the pressurizing tool is a pressurizing bolt provided in the center of the jig plate. （４）測定素子な治具板の下面に設けた凹部に当て根を
介して挿入して取りつけた特許請求の範囲第１項記載の
半導体素子ユニットの加圧装置(4) A pressurizing device for a semiconductor element unit according to claim 1, which is attached by being inserted into a recess provided on the lower surface of a jig plate serving as a measuring element via a stopper.
JP57219184A 1982-12-16 1982-12-16 Pressurizing device for semiconductor element unit Pending JPS59110149A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57219184A JPS59110149A (en) 1982-12-16 1982-12-16 Pressurizing device for semiconductor element unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57219184A JPS59110149A (en) 1982-12-16 1982-12-16 Pressurizing device for semiconductor element unit

Publications (1)

Publication Number Publication Date
JPS59110149A true JPS59110149A (en) 1984-06-26

Family

ID=16731511

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57219184A Pending JPS59110149A (en) 1982-12-16 1982-12-16 Pressurizing device for semiconductor element unit

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JP (1) JPS59110149A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030039206A (en) * 2001-11-12 2003-05-17 주식회사 다온테크 Improvement device of cooling fuction in cooling apparatus of radiator type
US6792375B2 (en) 2002-11-01 2004-09-14 International Business Machines Corporation Apparatus, system, and method of determining loading characteristics on an integrated circuit module
WO2009115124A1 (en) * 2008-03-20 2009-09-24 Abb Technology Ag A voltage source converter
WO2014019745A1 (en) * 2012-07-30 2014-02-06 Abb Technology Ag Power semiconductor clamping stack
CN104766786A (en) * 2015-04-22 2015-07-08 株洲南车时代电气股份有限公司 Device and method for assisting press fitting assembly in press fitting for semiconductor element

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030039206A (en) * 2001-11-12 2003-05-17 주식회사 다온테크 Improvement device of cooling fuction in cooling apparatus of radiator type
US6792375B2 (en) 2002-11-01 2004-09-14 International Business Machines Corporation Apparatus, system, and method of determining loading characteristics on an integrated circuit module
WO2009115124A1 (en) * 2008-03-20 2009-09-24 Abb Technology Ag A voltage source converter
CN101978494A (en) * 2008-03-20 2011-02-16 Abb技术有限公司 Voltage source converter
US8339823B2 (en) 2008-03-20 2012-12-25 Abb Technology Ag Voltage source converter
KR101243515B1 (en) * 2008-03-20 2013-03-20 에이비비 테크놀로지 아게 A voltage source converter
WO2014019745A1 (en) * 2012-07-30 2014-02-06 Abb Technology Ag Power semiconductor clamping stack
CN104508817A (en) * 2012-07-30 2015-04-08 Abb技术有限公司 Power semiconductor clamping stack
CN104766786A (en) * 2015-04-22 2015-07-08 株洲南车时代电气股份有限公司 Device and method for assisting press fitting assembly in press fitting for semiconductor element

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