JPS59109085U - connector - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来のコネクタにより２枚の基板を接続した状
態の断面図、第２図は第１図における基板Ａをコネクタ
に接続した状態の正面図、第３図および第４図はそれぞ
れ従来のコネクタにおけるコネクタ接触子を示す斜視図
、第５図はこの考案のコネクタに使用される圧接コネク
タラバーの斜視図、第６図はこの考案のコネクタの一実
施例を示す斜視図、第７図は第６図のコネクタにより２
枚の基板を接続した状態を示す斜視図、第８図はこの考
案のコネクタの他の実施例を示す側面図である。 １１・・・圧接コネクタラバー、１２・・・金属箔、１
３・・・基板結合モールド、１３ａ〜１３ｄ・・・係止
突起、Ａ、　Ｂ・・・基板、ＡＩ、　Ｂｌ・・・接触面
。Figure 1 is a cross-sectional view of two boards connected by a conventional connector, Figure 2 is a front view of board A in Figure 1 connected to a connector, and Figures 3 and 4 are conventional connectors. FIG. 5 is a perspective view of a press-contact connector rubber used in the connector of this invention, FIG. 6 is a perspective view of an embodiment of the connector of this invention, and FIG. 7 is 2 with the connector shown in Figure 6.
FIG. 8 is a perspective view showing a state in which two boards are connected, and FIG. 8 is a side view showing another embodiment of the connector of this invention. 11... Pressure welding connector rubber, 12... Metal foil, 1
3... Board bonding mold, 13a-13d... Locking protrusion, A, B... Board, AI, Bl... Contact surface.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] シリコンゴムなどの薄板の一方の面に所定の間隔をもっ
て金属箔を固着して形成された圧接コネクタラバーと、
「Ｌ」字形に形成されその垂直部分と水平部分にそれぞ
れ基板のつめ穴に係止する突起を有するとともにこの水
平部分と垂直部分に接続する基板に上記金属箔が接触す
るように上記圧接コネクタラバーが貼り付けられた基板
結合モールドとよりなるコネクタ＝A press-contact connector rubber formed by fixing metal foil at a predetermined interval to one side of a thin plate such as silicone rubber;
The press-contact connector rubber is formed in an "L" shape and has protrusions on its vertical and horizontal parts that engage with the pawl holes of the board, and is arranged so that the metal foil comes into contact with the board connected to the horizontal and vertical parts. Connector consisting of board bonding mold with pasted =