JPS59107195U - printed wiring board circuit device - Google Patents

printed wiring board circuit device

Info

Publication number
JPS59107195U
JPS59107195U JP19854082U JP19854082U JPS59107195U JP S59107195 U JPS59107195 U JP S59107195U JP 19854082 U JP19854082 U JP 19854082U JP 19854082 U JP19854082 U JP 19854082U JP S59107195 U JPS59107195 U JP S59107195U
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
mounting surface
circuit device
board circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19854082U
Other languages
Japanese (ja)
Other versions
JPH0126157Y2 (en
Inventor
光正 斉藤
熊本　研一郎
Original Assignee
ソニー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ソニー株式会社 filed Critical ソニー株式会社
Priority to JP19854082U priority Critical patent/JPS59107195U/en
Publication of JPS59107195U publication Critical patent/JPS59107195U/en
Application granted granted Critical
Publication of JPH0126157Y2 publication Critical patent/JPH0126157Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図Ａは、本考案に係るプリント配線基板回路装置の
一例の要部を示す部分平面図、第１図Ｂは第１図Ａに於
ける１Ｂ−１Ｂ線の断面図、第２図Ａは第１図に示さた
る例に用いられるシールド兼放熱部材の一例を示す斜視
図、第２図Ｂはシールド兼放熱部材の他の例を示す斜視
図、第３図は本考案に係るプリント配線基板回路装置の
他の例の要部を示す部分断面図、第４図は本考案に係る
プリント配線基板回路装置のさらに他の例の要部を示す
部分断面図、第５図は第４図に示される例に用いられる
シールド兼放熱部材を示す斜視図である。 図中、１はプリント配線基板、１ａはパターン面、１ｂ
はマウント面、２は配線パターン部、２ａはアース配線
パターン部、４は高周波集積回路部品、５ａ及び５ｂは
端子ピン、７はシールド兼放熱部材、７ａは第１の平板
部、７ｂは第２の平板部、８は貫通裏孔である。FIG. 1A is a partial plan view showing essential parts of an example of a printed wiring board circuit device according to the present invention, FIG. 1B is a sectional view taken along line 1B-1B in FIG. 1A, and FIG. 1 is a perspective view showing an example of the shield/heat radiating member used in the example shown in FIG. 1, FIG. 2B is a perspective view showing another example of the shield/heat radiating member, and FIG. 3 is a printed wiring according to the present invention. FIG. 4 is a partial cross-sectional view showing the main part of another example of the printed wiring board circuit device according to the present invention; FIG. FIG. 2 is a perspective view showing a shield/heat dissipation member used in the example shown in FIG. In the figure, 1 is a printed wiring board, 1a is a pattern surface, 1b
is a mounting surface, 2 is a wiring pattern part, 2a is a ground wiring pattern part, 4 is a high frequency integrated circuit component, 5a and 5b are terminal pins, 7 is a shield and heat dissipation member, 7a is a first flat plate part, 7b is a second The flat plate part 8 is a through hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント配線基板のマウント面に沿う第１の部分と上記
マウント面に略直交する第２の部分とを有する金属片か
らなり、上記プリント配線基板に取り付けられた集積回
路部品の対向辺の一方側の端子ピンと対向辺の他方側の
端子ピンとの間で、上記第１の部分が上記集積回路部品
と上記マウント面との間に配され、上記第２の部分が上
記プリント配線基板をその上記マウント面からパターン
面側へ貫通し、上記パターン面に設けられたアース配線
パターン部に電気的に接続されるシールド兼放熱部材を
備えて成るプリント配線基板回路装置。The metal piece is made of a metal piece having a first part along the mounting surface of the printed wiring board and a second part substantially perpendicular to the mounting surface, and is located on one side of the opposite side of the integrated circuit component mounted on the printed wiring board. Between the terminal pin and the terminal pin on the other side of the opposing side, the first portion is disposed between the integrated circuit component and the mounting surface, and the second portion is disposed between the printed wiring board and the mounting surface. What is claimed is: 1. A printed wiring board circuit device comprising a shield and heat dissipation member that penetrates from the ground to the pattern surface side and is electrically connected to a ground wiring pattern section provided on the pattern surface.
JP19854082U 1982-12-30 1982-12-30 printed wiring board circuit device Granted JPS59107195U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19854082U JPS59107195U (en) 1982-12-30 1982-12-30 printed wiring board circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19854082U JPS59107195U (en) 1982-12-30 1982-12-30 printed wiring board circuit device

Publications (2)

Publication Number Publication Date
JPS59107195U true JPS59107195U (en) 1984-07-19
JPH0126157Y2 JPH0126157Y2 (en) 1989-08-04

Family

ID=30424105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19854082U Granted JPS59107195U (en) 1982-12-30 1982-12-30 printed wiring board circuit device

Country Status (1)

Country Link
JP (1) JPS59107195U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023157355A1 (en) * 2022-02-21 2023-08-24 株式会社Ｊｖｃケンウッド Heatsink securing structure

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2058651B1 (en) 2006-10-19 2015-09-02 Panasonic Healthcare Holdings Co., Ltd. Method for measuring hematocrit value of blood sample, method for measuring concentration of analyte in blood sample, sensor chip and sensor unit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023157355A1 (en) * 2022-02-21 2023-08-24 株式会社Ｊｖｃケンウッド Heatsink securing structure

Also Published As

Publication number Publication date
JPH0126157Y2 (en) 1989-08-04

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