JPS59107155U - semiconductor circuit device - Google Patents
semiconductor circuit deviceInfo
- Publication number
- JPS59107155U JPS59107155U JP1983000100U JP10083U JPS59107155U JP S59107155 U JPS59107155 U JP S59107155U JP 1983000100 U JP1983000100 U JP 1983000100U JP 10083 U JP10083 U JP 10083U JP S59107155 U JPS59107155 U JP S59107155U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- chip component
- circuit device
- electrode
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来構造の縦断面図、第２図は本考案に係る半
導体回路装置の縦断面図、第３図はその平面図である。
１・・・・・・半導体チップ部品、２・・・・・・回路
基板、３ａ、 ３ｂ、’ ３ｃ、 ３ｄ・・・・・
・電極、４・・・・・・導通孔、７・・・・・・コンデ
ンサ、８・・・・・・封止用ケース、１０・・・・・・
封止板、１１・・・・・・接着剤。FIG. 1 is a vertical sectional view of a conventional structure, FIG. 2 is a vertical sectional view of a semiconductor circuit device according to the present invention, and FIG. 3 is a plan view thereof. 1...Semiconductor chip parts, 2...Circuit board, 3a, 3b,' 3c, 3d...
・Electrode, 4... Conductive hole, 7... Capacitor, 8... Sealing case, 10...
Sealing plate, 11...Adhesive.
Claims (1)
半導体回路装置において、前記回路基板の一面に設けた
電極に前記半導体チップ部品を接続し、この半導体チッ
プ部品を封止用ケースにて封止し、前記電極を導通孔を
介して前記回路基板の他面に導出すると共に、この導出
した電極が一方の電極となる印刷コンデンサを前記導通
孔の周囲に環状に設け、前記コンデンサで囲まれた部分
に前記導通孔を塞ぐ封止板を接着剤にて固定したことを
特徴とする半導体回路装置。In a semiconductor circuit device in which a semiconductor chip component is bonded to a circuit board, the semiconductor chip component is connected to an electrode provided on one surface of the circuit board, the semiconductor chip component is sealed in a sealing case, and the semiconductor chip component is sealed in a sealing case. An electrode is led out to the other surface of the circuit board through the conduction hole, and a printed capacitor is provided in a ring shape around the conduction hole, with the led out electrode serving as one electrode, and the A semiconductor circuit device characterized in that a sealing plate that closes a conduction hole is fixed with an adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983000100U JPS59107155U (en) | 1983-01-06 | 1983-01-06 | semiconductor circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983000100U JPS59107155U (en) | 1983-01-06 | 1983-01-06 | semiconductor circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59107155U true JPS59107155U (en) | 1984-07-19 |
Family
ID=30131847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983000100U Pending JPS59107155U (en) | 1983-01-06 | 1983-01-06 | semiconductor circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59107155U (en) |
-
1983
- 1983-01-06 JP JP1983000100U patent/JPS59107155U/en active Pending
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