JPS59100176A - Adhesive - Google Patents
AdhesiveInfo
- Publication number
- JPS59100176A JPS59100176A JP20855582A JP20855582A JPS59100176A JP S59100176 A JPS59100176 A JP S59100176A JP 20855582 A JP20855582 A JP 20855582A JP 20855582 A JP20855582 A JP 20855582A JP S59100176 A JPS59100176 A JP S59100176A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- temp
- adhesive
- temperature
- electronic part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Abstract
Description
【発明の詳細な説明】
発明の属する技術分野
本分明−１熱伝導１トオたは導電性を有する接着剤に関
する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention This invention relates to an adhesive having thermal conductivity or electrical conductivity.
従来技術
一般の接着剤は、枦１脂がσへｐよぴ１．’ｌｙＦ、気
の不１１２，９体であるととめ・ら導電、ｐｒ、、熱伝
ン・Ｌ件で・−低い０、（−７かし、導電性、熱伝導性
、／Ｉ；％：、：←さｔ）る場合がある。Conventional adhesives in general have a ratio of 1 fat to σ to 1. 'lyF, 112, 9 bodies of tome-ra conductivity, pr,, heat conduction, L matter - low 0, (-7 kashi, conductivity, thermal conductivity, /I;% :, :←sat) may occur.
例えば電子部品への放べ） 、ｌ’ｌ−１１・−トシン
クの取付は等では熱伝導性が良好な）３ ＞、’：ｒ剤
がＪ／？ ’がマ′ある。イイ来、このような接着剤と
１２ては、（ｈ１脂中に金、ぐ）１ □等の金属
粒子を混入１，７だものが１１：・甲さｔｌでいる−し
かし、このような従来の接一層剤ｉｄ４、杉ＩＪ接危物
を除去するためには、佼Ｉ脂の面１熱劣化温度以上にｌ
ｔ。For example, the heat conductivity is good when attaching a sink to an electronic component) 3>,':R agent is J/? There is 'ma'. Good, this kind of adhesive and 12 are mixed with metal particles such as (gold in h1 fat) 1 □ and 1,7 is 11:・Kosa tl - However, such adhesive In order to remove the conventional bonding agent id4, cedar IJ, surface 1 of the cedar lubricant must be heated to a temperature higher than the thermal deterioration temperature.
t.
熱しなければならたい。１′１！を熱１１！ｒ科の良好
な樹脂は、当然に耐熱劣化温度が；ＨＴ ＜ 、破詞・
管Ｉ：ηを除去するたＶ）には５００〜７００℃・ｔ′
ビｊ埃以十の１し百Ａ１１に加熱しなければならないた
め、被接着物が熱破壊さｆｌ。I want it to be hot. 1'1! Heat 11! Good resins of the R family naturally have a heat resistance deterioration temperature;
Tube I: 500-700℃・t' for V) to remove η
Since the adhesive must be heated to a temperature of 10 to 100 A11, the object to be adhered will be thermally destroyed.
てし１って再使用できなくなるという欠点がある。The disadvantage is that it cannot be reused.
一方、面１熱劣化招度が低い４！７＋ ：ｌｉｉは、当
然に耐熱特性が勘、いから使用時の発熱等によって特性
が劣化する等問題が釜い。On the other hand, 4!7+:lii, which has a low degree of surface 1 thermal deterioration, has many problems such as its heat resistance characteristics being deteriorated by heat generation during use.
発明の目的
本発明の目的は、土述の従非の欠点を［；Ｉ（決し、耐
熱特性が良好で、しかも披接冶物を破１みしないで容桔
に除去することが可能な熱伝導性井、たゆ導電性分有す
る接オｆ剤を提供することにある。OBJECT OF THE INVENTION The purpose of the present invention is to solve the disadvantages of the above-mentioned problems by creating a heat resistant material which has good heat resistance properties and which can be removed into a container without damaging the metal. The object of the present invention is to provide a conductive material having a conductive property.
発明の構成□ ′：、：：″一
本発明の接着剤は、樹脂中に、固相温度または共晶温１
片が前記樹脂の硬化温度より高く、かっ液相温度捷たは
共晶温度が前記樹脂の耐熱温度より低い金属粒子を混入
してなることを特徴とする。Structure of the invention
The piece is characterized in that it contains metal particles that are higher than the curing temperature of the resin and whose liquidus temperature or eutectic temperature is lower than the heat resistance temperature of the resin.
発明の実施例
次に、本発明について、図面□をＧ ＩＴ（ｔ ’して
詳細に説４明する。Embodiments of the Invention Next, the present invention will be explained in detail by referring to the drawing □ as GIT(t').
第１図は、本発明の一実施例を示す断面図でああ。−１
＆ゎち、＋ｍ庁１１ｉＢ１．１ヤッ位、１□２中に半田
１粒子１１が混入されていて、熱伝導性およびｆ４電性
が良好である。基板２上に、接着剤１を塗布し、電子部
品３を載置して、例えば１５０℃以下でエポキシ樹脂］
２を硬化すれば接着が完了する。半田粒子１１の固相又
は共晶温度は、前記１５０℃より高いから、エポキシ樹
脂１２の硬化中に溶融することはない。また、エポキシ
樹脂１２は耐熱温度が高く、従って耐熱特性が良好であ
り、使、用、、、、中に電子部品３の発熱Φｒによって
劣化すると□ 、・−，１１
とはなく、充分な接着強度を保持（〜でいる。また、□
電子１池品、３：の発熱は、接着剤１を介Ｌ７て基板２
に集導、されるかう放警管性が良い。、。FIG. 1 is a sectional view showing one embodiment of the present invention. -1
&ゎchi, +m office 11iB1.1 yach, 1 solder particle 11 is mixed in 1□2, and the thermal conductivity and f4 electric property are good. Apply adhesive 1 on substrate 2, place electronic component 3 on it, and apply epoxy resin at 150° C. or lower, for example.]
Adhesion is completed by curing 2. Since the solid phase or eutectic temperature of the solder particles 11 is higher than the above-mentioned 150° C., the solder particles 11 do not melt during curing of the epoxy resin 12. In addition, the epoxy resin 12 has a high heat resistance temperature and therefore has good heat resistance characteristics, and if it deteriorates due to the heat generation Φr of the electronic component 3 during use, it will not cause □ , -, 11 and will have sufficient adhesion. Maintains strength (with ~.Also, □
The heat generated by the electronic 1 battery, 3: is transferred to the board 2 via the adhesive 1, L7.
It is good to have a good control and control system. ,.
電子部品３を除去するときは、半田粒子１１の液相温度
又は共晶温度より高い２５ （Ｉ ＣＲｌａ“に加熱す
ることによって半田粒子１１を溶融すると、構造的に樹
“脂の機械的強Ｗが低下する。この結果ビン化ット等に
よる僅かな外力によってｔ電子部品３を除去することが
できる。半田粒子は溶融して相互に合体し、第２図に示
すように半田合体］３がエポキシ樹脂１□２吊に残□存
する。−上記２５０ｕ程度の加熱：で１、電、子〒品３
は熱イＩ９さ五ず、除去した後再使用が可晶４・ある。When removing the electronic component 3, if the solder particles 11 are melted by heating to 25 (ICRla) higher than the liquidus temperature or eutectic temperature of the solder particles 11, the mechanical strength W of the resin will be reduced structurally. As a result, the electronic component 3 can be removed by a slight external force from a bottle or the like.The solder particles melt and coalesce with each other, and as shown in FIG. Epoxy resin 1□2 remains in suspension.-Heating above about 250U: 1, electric, electronic 3
There are four crystals that can be reused after being removed.
基板上には、未硬化の同様な接着剤によって他の新（７
い電子部品を接着して、電子部品を交換することが可能
である。On the substrate, other new (7
It is possible to replace electronic components by gluing new electronic components together.
上記エポキシ樹脂に代えてポリイミド４７ｉ４脂を使用
し、該ポリイミド樹脂の硬化温度よシ高い固相温度また
は共晶温度を有し、かつ該ポリイミド樹脂の耐熱温度よ
り低い液相温度または共晶温度を木する半田粒子等の金
属粒子を混入しても同様な効果を秦する、
発明の効果
以上のように、本発明においては、樹脂の硬化温度より
高い［Ｉ−」相温度または共晶温度を有し、液相温度ま
たは共晶温度は該樹脂の耐熱温度より低い金属粒子を、
上記樹脂中に混入する構成としたから、熱伝導性、導筒
、性を有し耐熱特性が良好で、しかも接着、した部品等
を破壊し、ないで容易に除去できる接着剤を提供できる
。すなわち、電子部品等の取付け、除去を容易かつ経済
的に可能とする効果がある。Polyimide 47i4 resin is used in place of the above epoxy resin, and has a solidus temperature or eutectic temperature higher than the curing temperature of the polyimide resin, and a liquidus temperature or eutectic temperature lower than the heat resistance temperature of the polyimide resin. Even if metal particles such as wood solder particles are mixed, the same effect can be obtained.As described above, in the present invention, the [I-] phase temperature or eutectic temperature higher than the curing temperature of the resin is metal particles having a liquidus temperature or eutectic temperature lower than the heat-resistant temperature of the resin,
Since the adhesive is mixed in the resin, it is possible to provide an adhesive that has thermal conductivity, conductive properties, good heat resistance properties, and can be easily removed without destroying the bonded parts. That is, it has the effect of making it possible to easily and economically attach and remove electronic parts and the like.
第１図は本発明の一実施例を示す断面図、第２図は本発
明の接着剤によって接着した電子部品を除去した状態を
□示す断面図である。
図において、１・・・接着剤、２・・・基板ζ ３・・
・電子部品、］１・・・半田粒子、１２・・・エポキシ
樹、脂、１３・・・半田合体。
代理人弁理士 住 １）俊 宗
： ７．、＋＆ １国
、−、、第、２図FIG. 1 is a sectional view showing one embodiment of the present invention, and FIG. 2 is a sectional view □ showing a state in which electronic components bonded with the adhesive of the present invention have been removed. In the figure, 1...adhesive, 2...substrate ζ 3...
-Electronic components,] 1...Solder particles, 12...Epoxy resin, resin, 13...Solder union. Representative Patent Attorney Sumi 1) So Toshi: 7. ,+& 1 country,-, ,Figure 2
Claims (1)
前記樹脂の硬化温度より高く、かっ液相温ｔｒ（ブたは
共晶温度がｉｌｌが樹脂の耐熱温度より低い金か１粒子
を混入してなることを特徴にする九着剤。 （２、特許請求の範囲第１項Ｈｃ１載の接着ｉ′１１
［おいて、ｔｆｆｉｉｌ記金スベ粒子は半田粒子である
ことを７痔徴とするもの１、 （３） ’Ｉ’Ｆ Ｔ！’Ｉ”請求の帥囲第１項寸たけ
第２珀ｄ１１．岐の接、資剤に卦いて、ｉ１１記樹脂は
エホキシ樹涌呻ゾζはポリイミド樹脂１１であることを
特徴とするもの４．[Claims]! +1 PI In IJ, one particle of gold is mixed in which the in-phase temperature or eutectic temperature is higher than the curing temperature of the resin and the liquid phase temperature tr (but or eutectic temperature is lower than the heat resistance temperature of the resin). (2. Adhesive i'11 according to Claim 1 Hc1)
[In this case, tffiil notes that the metal particles are solder particles. ``I'' Claim: Item 1, Dimensions, Item 2, d11. In terms of materials, the resin i11 is an epoxy resin, and the resin ζ is a polyimide resin 11. ．．
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20855582A JPS59100176A (en) | 1982-11-30 | 1982-11-30 | Adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20855582A JPS59100176A (en) | 1982-11-30 | 1982-11-30 | Adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59100176A true JPS59100176A (en) | 1984-06-09 |
Family
ID=16558116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20855582A Pending JPS59100176A (en) | 1982-11-30 | 1982-11-30 | Adhesive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59100176A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5376403A (en) * | 1990-02-09 | 1994-12-27 | Capote; Miguel A. | Electrically conductive compositions and methods for the preparation and use thereof |
| US5853622A (en) * | 1990-02-09 | 1998-12-29 | Ormet Corporation | Transient liquid phase sintering conductive adhesives |
-
1982
- 1982-11-30 JP JP20855582A patent/JPS59100176A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5376403A (en) * | 1990-02-09 | 1994-12-27 | Capote; Miguel A. | Electrically conductive compositions and methods for the preparation and use thereof |
| US5830389A (en) * | 1990-02-09 | 1998-11-03 | Toranaga Technologies, Inc. | Electrically conductive compositions and methods for the preparation and use thereof |
| US5853622A (en) * | 1990-02-09 | 1998-12-29 | Ormet Corporation | Transient liquid phase sintering conductive adhesives |
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