JPS5897856U - 発光ダイオ−ドランプ用レンズアダプタ - Google Patents
発光ダイオ−ドランプ用レンズアダプタInfo
- Publication number
- JPS5897856U JPS5897856U JP19587981U JP19587981U JPS5897856U JP S5897856 U JPS5897856 U JP S5897856U JP 19587981 U JP19587981 U JP 19587981U JP 19587981 U JP19587981 U JP 19587981U JP S5897856 U JPS5897856 U JP S5897856U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- diode lamp
- lens adapter
- lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第１図はこの考案の実施例を示す要部を縦断した拡大側
面図、第２図は表示パネルの正面図である。 １・・・発光ダイオード、２・・・抵抗、３・・・照光
レンズ、４・・・口金、７・・・レンズアダプタ、７ａ
・・・凹凸部、７ｂ・・・凹窪部、７Ｃ・・・取付脚、
８・・・表示パネル。
面図、第２図は表示パネルの正面図である。 １・・・発光ダイオード、２・・・抵抗、３・・・照光
レンズ、４・・・口金、７・・・レンズアダプタ、７ａ
・・・凹凸部、７ｂ・・・凹窪部、７Ｃ・・・取付脚、
８・・・表示パネル。
Claims (1)
- 外表面に光拡散用凹凸部を設けるとともに内面中央部に
発光ダイオードランプの照光レンズ面を内嵌させる凹窪
部を穿設し、周側から前記ランプ外周と着脱自由な複数
個の取付脚を延設して構成したことを特徴とする発光ダ
イオードランプ用レンズアダプタ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19587981U JPS5897856U (ja) | 1981-12-24 | 1981-12-24 | 発光ダイオ−ドランプ用レンズアダプタ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19587981U JPS5897856U (ja) | 1981-12-24 | 1981-12-24 | 発光ダイオ−ドランプ用レンズアダプタ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5897856U true JPS5897856U (ja) | 1983-07-02 |
Family
ID=30109137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19587981U Pending JPS5897856U (ja) | 1981-12-24 | 1981-12-24 | 発光ダイオ−ドランプ用レンズアダプタ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5897856U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010161420A (ja) * | 1998-03-27 | 2010-07-22 | Yoshio Takada | 発光体 |
| JP2010193824A (ja) * | 2009-02-26 | 2010-09-09 | Fine Rubber Kenkyusho:Kk | 植物栽培用光源 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5275285A (en) * | 1975-12-08 | 1977-06-24 | Savage John Jun | Light emitting diode assembly |
-
1981
- 1981-12-24 JP JP19587981U patent/JPS5897856U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5275285A (en) * | 1975-12-08 | 1977-06-24 | Savage John Jun | Light emitting diode assembly |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010161420A (ja) * | 1998-03-27 | 2010-07-22 | Yoshio Takada | 発光体 |
| JP2010193824A (ja) * | 2009-02-26 | 2010-09-09 | Fine Rubber Kenkyusho:Kk | 植物栽培用光源 |
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