JPS5885376U - Printed circuit board using metal core - Google Patents
Printed circuit board using metal coreInfo
- Publication number
- JPS5885376U JPS5885376U JP18182681U JP18182681U JPS5885376U JP S5885376 U JPS5885376 U JP S5885376U JP 18182681 U JP18182681 U JP 18182681U JP 18182681 U JP18182681 U JP 18182681U JP S5885376 U JPS5885376 U JP S5885376U
- Authority
- JP
- Japan
- Prior art keywords
- metal core
- circuit board
- printed circuit
- refrigerant
- filled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はこの考案の一実施例を示す斜視図、第２図は他
の実施例を示す斜視図、第３図および第４図はそれぞれ
この考案の基板の他の変形例を示 。
す断面図、第５図は金属−コアの作り方の一例を示す斜
視図である。
１・・・・・・金属コア、２・・・・・・注入口、３・
・・・・・排出口。FIG. 1 is a perspective view showing one embodiment of this invention, FIG. 2 is a perspective view showing another embodiment, and FIGS. 3 and 4 each show other modified examples of the substrate of this invention. FIG. 5 is a perspective view showing an example of how to make a metal core. 1...Metal core, 2...Inlet, 3.
·····Vent.
Claims (1)
てなることを特徴とする金属コアを用いたプリント回路
用基板。 ２ 前記冷媒は水や油等であり、また前記金属コアの内
部は注入口および排出口を介して外部と通じており、こ
れらの口を介して金属コアの内部に充填された冷媒を外
部との間で流通させるようにしたことを特徴とする実用
新案登録請求の範囲第１項記載お金属コアを用いたプリ
ント回路用基板。 ３ 前記金属コアの内部は密封空間とされ、前記冷媒は
金属コア自身がヒートパイプを構成するようにウィック
に侵みこまされた状態で金属コアの内部に充填されてい
ることを特徴とする実用新案登録請求の範囲第１項記載
の金属コアを用いたプリント回路用基板。[Claims for Utility Model Registration] 1. A printed circuit board using a metal core, characterized in that the hollow metal core is filled with a refrigerant. 2 The refrigerant is water, oil, etc., and the inside of the metal core communicates with the outside through an inlet and an outlet, and the refrigerant filled inside the metal core is communicated with the outside through these ports. A printed circuit board using a metal core as set forth in claim 1 of the utility model registration, characterized in that the printed circuit board is adapted to be distributed between. 3. A practical use characterized in that the inside of the metal core is a sealed space, and the refrigerant is filled inside the metal core while being penetrated by a wick so that the metal core itself constitutes a heat pipe. A printed circuit board using the metal core according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18182681U JPS5885376U (en) | 1981-12-07 | 1981-12-07 | Printed circuit board using metal core |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18182681U JPS5885376U (en) | 1981-12-07 | 1981-12-07 | Printed circuit board using metal core |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5885376U true JPS5885376U (en) | 1983-06-09 |
Family
ID=29979653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18182681U Pending JPS5885376U (en) | 1981-12-07 | 1981-12-07 | Printed circuit board using metal core |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5885376U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53128766A (en) * | 1977-04-15 | 1978-11-10 | Fujitsu Ltd | Method of contacting printed board with cold plate |
-
1981
- 1981-12-07 JP JP18182681U patent/JPS5885376U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53128766A (en) * | 1977-04-15 | 1978-11-10 | Fujitsu Ltd | Method of contacting printed board with cold plate |
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