JPS5883388A - Dynamic storage device - Google Patents

Dynamic storage device

Info

Publication number
JPS5883388A
JPS5883388A JP56181526A JP18152681A JPS5883388A JP S5883388 A JPS5883388 A JP S5883388A JP 56181526 A JP56181526 A JP 56181526A JP 18152681 A JP18152681 A JP 18152681A JP S5883388 A JPS5883388 A JP S5883388A
Authority
JP
Japan
Prior art keywords
cells
cell
dummy
memory
storage device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56181526A
Other languages
Japanese (ja)
Inventor
Katsuichi Mimura
三村 勝一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56181526A priority Critical patent/JPS5883388A/en
Publication of JPS5883388A publication Critical patent/JPS5883388A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/14Dummy cell management; Sense reference voltage generators

Abstract

PURPOSE:To prevent a soft error by allocating dummy cells to respective data lines, and compensating potential variation due to carrier flowing to capacitors of memory cells on the average. CONSTITUTION:Divided dummy cells 6b to be connected to dummy cell word lines 5 at adequate intervals are provided for respective data lines 2, and the capacity sum of capacitiors of the cells 6b is equal to that of the dummy cell when they are not divided. Consequently, a minor carrier generated in a semiconductor substrate flow into the cells 6b from a cell 6b close to a memory cell 4 so that when a minor carrier flow into one of memory cells 4, the total amount is nearly equalized. Therefore, potential variation caused by the flowing of minor carrier to the capacitor part of the cell 4 is compensated on the average and minimized to prevent the occurrence of a soft error, thus obtaining a high-reliable dynamic storage device.

Description

【発明の詳細な説明】 本発明は半導体記憶装置としてコンテンtを情報蓄積手
段に用−るダイナミック記憶装置に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a dynamic storage device as a semiconductor storage device that uses content t as information storage means.

半導体記憶装置の中で、1ビツト当)1対のM2S)ラ
ンジスタとコンデンサを使用するダイナミック記憶装置
は集積&を高めるのに最も適した記憶装置である。
Among semiconductor memory devices, a dynamic memory device that uses a pair of M2S) transistors and a capacitor per bit is the most suitable memory device for increasing the integration density.

ところでコンデンサを情報蓄積手段に用いるこのダイナ
ミッタ記憶装置は、上述したように高集積化には適して
−るが、1メモリセル当りの情報蓄積レベルが量論こと
からソフトエラーを犯しゃす論と−う開運も同時に抱え
てpる。
By the way, this dynamitter memory device, which uses a capacitor as an information storage means, is suitable for high integration as mentioned above, but since the information storage level per memory cell is stoichiometric, it is prone to soft errors. It also brings good luck at the same time.

な禽ツフトエラーとは、半導体基板中に生成された少数
キャリアがアルファ線等の放射線の影響によ!データラ
イン、センスアンプあるいはメモ!セルコンデンを等の
拡散領kRKflれ込むことによ)生じる電位変動によ
って記憶装置の誤動作を引き起すと^う現象でTon、
特にダイナミック記憶装置IIcお−てはこの問題が深
刻である。
A short error is when minority carriers generated in a semiconductor substrate are affected by radiation such as alpha rays! Data line, sense amplifier or memo! Ton is a phenomenon that causes malfunction of the storage device due to potential fluctuations caused by introducing cell capacitors into diffusion regions such as kRKfl, etc.
This problem is particularly serious in the dynamic storage device IIc.

ζζに、従来のツフートエラ一対策としてl) 半導体
デツプO,,I:lcコーディング物質を塗布すること
によシ外来の放射線t−迩断する。
ζζ, as a countermeasure against the conventional safety error, l) Semiconductor depth O,, I: By applying a lc coating material, extraneous radiation is blocked.

2) 第1図に示すようにワードライン1、データライ
ン2、センスアンプ3およびメモリセル4で構成される
周知のダイナミック記憶装置の基本装−において、半導
体基板中に生成された少数キャリアがセンスアンプ3に
接続されるデータライン2に対しできるだけ均等に流れ
込むよう、例えば第2図に示すようにデータライy2の
配列rrrp返し配列としてこれらデータライン2同士
を互−に近づける。
2) As shown in FIG. 1, in the basic configuration of a well-known dynamic memory device consisting of a word line 1, a data line 2, a sense amplifier 3, and a memory cell 4, minority carriers generated in a semiconductor substrate are sensed. In order to flow into the data lines 2 connected to the amplifier 3 as evenly as possible, the data lines 2 are arranged close to each other, for example, as shown in FIG.

等々の方法がとられていたが、いずれにしろいまだ十分
とriv−えなかり次。
Various methods have been used, but in any case, it is still insufficient.

すなわち、上記1)、の対策をとりたとしても実際に半
導体チップ内部に存在する放射線源の影響によりて前述
した少数キャリアの拡散領域への流呑込みが生じ、また
上記2)、の対策をとり九としてもメモリセル4のうち
いずれか1つのメモリセルコンデンサに少数キャリアが
流n込んだときにはこれによって生じる電位変動を抑え
ることはできない、なお、上記2)、の対策tとる場合
、通常は第81I[示すようにデータライン2の一部毎
にワードライy5で結ばれ前記メモリセル4と同−構J
IEをとるダミーセル6at−各1つ設ケ該ダミーセル
6&のコンデンサにも同等の少数キャリアを流入される
仁とにようて上述した電位変動を補償すべく配慮がなさ
れることが多いが、このダ1−セル6畠から離れた位t
にあるメモリセルのゴンデンtに少数キャリアが流れ込
んだ場合にはそれでもなお少数キャリアの流入に不均衡
が生じ、結果的にソフトエラーを犯す確率も高μ。
In other words, even if the above measure 1) is taken, the aforementioned minority carriers will flow into the diffusion region due to the influence of the radiation source actually existing inside the semiconductor chip, and the above measure 2) will still occur. In particular, when minority carriers flow into the memory cell capacitor of any one of the memory cells 4, it is impossible to suppress the potential fluctuation caused by this. Note that when taking the countermeasure 2) above, normally 81I [As shown, each part of the data line 2 is connected by a word line y5 and has the same structure as the memory cell 4.
Consideration is often given to compensate for the above-mentioned potential fluctuations by providing one dummy cell 6at for each IE. 1-cell 6 far from the field
If minority carriers flow into the memory cell t in the memory cell, there will still be an imbalance in the flow of minority carriers, and as a result, the probability of soft errors will be high μ.

本発明は上記実情に鑑みてなされたものであり、ダミー
セルを各データライン毎に複数個分割して配設すること
により少数キャリアがメモリセルのコンデンサ部分に流
入して引き起こす電位変動を平均的に補償し、ソフトエ
ラーの発生を未然に防止するダイナミック記憶装置を提
供するものである。
The present invention has been made in view of the above circumstances, and by dividing and arranging a plurality of dummy cells for each data line, it is possible to average out potential fluctuations caused by minority carriers flowing into the capacitor portion of a memory cell. The present invention provides a dynamic storage device that compensates and prevents the occurrence of soft errors.

以下、本発明に係るダイナミック記憶装置につめて添#
図両の実施例管参照し、詳細に説明する。
The following is a summary of the dynamic storage device according to the present invention.
A detailed explanation will be given with reference to the embodiment tubes shown in the figures.

菖411は本発明に係るダイナミック記憶装置の一実施
例を示すものであり、この実施例装置は折り返し配列と
したデータラインの各データライン毎にそれぞれ適宜に
離間して3つのダミーセル6bを配設して6る。また各
データライン毎に配設するこれら3つのダミーセル6b
のコンデンサの総容量は、従来のダイナミック記憶装置
におpて各データライン2毎に1つ設けられたダミーセ
ル6&(第3図参照)のコンデンサの容量と等しくなる
よう設定している。なお第4図におhて、先の第1図〜
第3図に示したライン、セルまたはアンブト同一のライ
ン、セルまたはアンプには同一の脅号の付して示してお
り、重複する説明は省略する。
The irises 411 show an embodiment of the dynamic memory device according to the present invention, and this embodiment device has three dummy cells 6b arranged at appropriate intervals for each data line of data lines arranged in a folded arrangement. 6. In addition, these three dummy cells 6b are arranged for each data line.
The total capacitance of the capacitors is set to be equal to the capacitance of the capacitors of the dummy cells 6& (see FIG. 3), which are provided one for each data line 2 in the conventional dynamic memory device. In addition, in Fig. 4 h, the previous Fig. 1~
Lines, cells, or amplifiers that are the same as those shown in FIG. 3 are labeled with the same symbols, and redundant explanations will be omitted.

さて、ダイナミック記憶装置をこのような構成とするこ
とにより、半導体基板中に生成された少数キャリアがメ
モリセル4のうちいずれか1つに流入した場合、該少数
キャリアが流入したメモリセルと同一データラインに配
設された3つのダミーセル6bに対しても該少数キャリ
アが流入し九メモリセルの最寄シのダミーセルから順に
、また総量として該1つのメモリセルに流入した量とほ
ぼ同等量の少数キャリアが流入することになる。
Now, by configuring the dynamic memory device in this way, when minority carriers generated in the semiconductor substrate flow into any one of the memory cells 4, the same data as that of the memory cell into which the minority carriers flowed is stored. The minority carriers also flow into the three dummy cells 6b arranged in the line, starting from the dummy cell closest to the nine memory cells, and the minority carriers flow into the three dummy cells 6b in order, and the total amount of minority carriers is almost the same as the amount flowing into the one memory cell. There will be an influx of carriers.

すなわち、メモリセル4の1つに流入する少数キャリア
の量と上記3つのダミーセル6bにそれぞれ流入する少
数キャリアの総量とは完全に同量とはな)難いがまた大
きくくい違うとiうようなこともなくなる。この結果、
メモリセル4のコンデyts分に少数キャリアが流入す
ることによって引き起こされる電位変動は^かなる場合
においても最小限に食止められ、ソフトエラーのエラー
率も大@に改善される。
In other words, the amount of minority carriers flowing into one of the memory cells 4 and the total amount of minority carriers flowing into each of the three dummy cells 6b are not exactly the same amount, but there is a large difference. There will be no more. As a result,
The potential fluctuation caused by the inflow of minority carriers into the memory cell 4 is kept to a minimum in any case, and the error rate of soft errors is greatly improved.

なお、不発#iに係るダイナミック記憶)置において各
チータライン毎に配設されるダミーセルの数は任意であ
り、1つのデータラインにおける各ダミ〜ヤルのコンデ
ンサの総容量が1つのメモリセルのコンデンサに流入す
る少数キャリアの量と同等量の少数キャリア’kR入さ
せ得る容量でさえ6f’Ltf、同一データラインに配
設される各メモリセルとダミーセルとがおよそ平均して
近傍した位置関係となるような適宜な数に分割すること
ができる。
Note that the number of dummy cells arranged for each cheater line in the dynamic memory device related to misfire #i is arbitrary, and the total capacitance of each dummy cell in one data line is equal to the capacitor of one memory cell. Even if the capacity to allow the same amount of minority carriers flowing into 'kR' is 6f'Ltf, each memory cell and dummy cell arranged on the same data line will be in a positional relationship that is approximately close to each other on average. It can be divided into an appropriate number of parts.

また、第4図に示した実施例装置は、少数キャリアがデ
ータライン2に流入した場合においても有効にソフトエ
ラーの発生を防止し得るよう第2図または第3図に示し
たようなデータライン2’を折り返し配列としたタイプ
の装置に本発明に係るダイナミック記憶装置を適用した
ものであるが、この本発明に係るダイナミック記憶装置
が第1図に示した構成を有する装置についても同様に適
用でさるものであることは勿論である。
In addition, the embodiment device shown in FIG. 4 has a data line as shown in FIG. Although the dynamic storage device according to the present invention is applied to a type of device in which 2' is a folded arrangement, the dynamic storage device according to the present invention can be similarly applied to a device having the configuration shown in FIG. Of course, it is a monkey.

以上説明したように、本発明に係るダイナミック記憶装
置によ扛ばソフトエラーのエラー率が大幅(二改善され
、またこれにより、記憶されるデータの信頼性も著しく
向上する。したがって高集積化に最も適するというダイ
ナミック記憶装置本来の特徴とも相まって、小型ながら
集積性、信頼性共に優nた記憶装置を実現することがで
きる。
As explained above, by using the dynamic storage device according to the present invention, the error rate of soft errors is significantly improved, and the reliability of stored data is also significantly improved. Coupled with the inherent characteristic of a dynamic storage device that it is the most suitable, it is possible to realize a storage device that is small but has excellent integration and reliability.

【図面の簡単な説明】[Brief explanation of drawings]

第1図〜第3図はそ扛ぞn従来のダイナミック記憶装置
構成を示す図、第4図は本発明に係るダイナミック記憶
装置の一実施例構成を示す図である。 1・・・ワードライン、2・・・データライン、3=−
センスアンプ、4−・メモリセル、5−・ダミーセルワ
ードライン、6a、6b−ダミーセル。 第1図 第2図 第3図 第4図
1 to 3 are diagrams showing the configuration of a conventional dynamic storage device, and FIG. 4 is a diagram showing the configuration of an embodiment of the dynamic storage device according to the present invention. 1...word line, 2...data line, 3=-
Sense amplifier, 4--memory cell, 5--dummy cell word line, 6a, 6b-dummy cell. Figure 1 Figure 2 Figure 3 Figure 4

Claims (1)

【特許請求の範囲】[Claims] 行列状に形成された複数のワードラインとデーp’yイ
yとをMOS)ランジスタとコンデンサトで構成される
メモリセルをそれぞれ介して各交差させ、かつ前記デー
タライン毎に前記メモリセルと同一構成を有するダミー
セルを設けたダイナミック記憶装置にお−て、″前記ダ
ミーセルを前記データライン毎に複数箇所分割して配設
し、半導体基板中に生成された少数キャリアがりかなる
位置にあるメモリセルのコンデンサに流入してもこれに
よりて引き起こされる電位変動を平均的に補償するよう
にしたことt*黴とするダイナミック記憶装置。
A plurality of word lines and data lines formed in a matrix are crossed through memory cells each composed of a transistor (MOS) and a capacitor, and each data line is connected to the same memory cell as the memory cell. In a dynamic memory device provided with dummy cells having the following structure, the dummy cells are divided into a plurality of locations for each of the data lines, and the minority carriers generated in the semiconductor substrate are arranged in memory cells at different positions. A dynamic memory device that compensates on average for potential fluctuations caused by inflow into a capacitor.
JP56181526A 1981-11-12 1981-11-12 Dynamic storage device Pending JPS5883388A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56181526A JPS5883388A (en) 1981-11-12 1981-11-12 Dynamic storage device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56181526A JPS5883388A (en) 1981-11-12 1981-11-12 Dynamic storage device

Publications (1)

Publication Number Publication Date
JPS5883388A true JPS5883388A (en) 1983-05-19

Family

ID=16102301

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56181526A Pending JPS5883388A (en) 1981-11-12 1981-11-12 Dynamic storage device

Country Status (1)

Country Link
JP (1) JPS5883388A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03147594A (en) * 1989-11-01 1991-06-24 N M B Semiconductor:Kk Semiconductor memory device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03147594A (en) * 1989-11-01 1991-06-24 N M B Semiconductor:Kk Semiconductor memory device

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