JPS5883146U - Transfer molding mold - Google Patents

Transfer molding mold

Info

Publication number
JPS5883146U
JPS5883146U JP17971881U JP17971881U JPS5883146U JP S5883146 U JPS5883146 U JP S5883146U JP 17971881 U JP17971881 U JP 17971881U JP 17971881 U JP17971881 U JP 17971881U JP S5883146 U JPS5883146 U JP S5883146U
Authority
JP
Japan
Prior art keywords
transfer molding
molding mold
resin passage
mold
cavities
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17971881U
Other languages
Japanese (ja)
Other versions
JPS6120755Y2 (en
Inventor
松村　保男
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP17971881U priority Critical patent/JPS5883146U/en
Publication of JPS5883146U publication Critical patent/JPS5883146U/en
Application granted granted Critical
Publication of JPS6120755Y2 publication Critical patent/JPS6120755Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来のトランスファ成形用金型の正面図、第２
図は本考案の一実施例のトランスファ成形用金型の正面
図、第３図は第２図の■−■線に沿う断面図、第４図及
び第５図は第２図で得られる半導体装置のモールド後及
び切断後の斜視図である。 １１・・・・・・トランスファ成形用金型、１２・・・
・・・ポット、１３・・・・・・ランナ（樹脂通路）、
１４・・・・・・キャビティ、１５・・・・・・巾狭部
。Figure 1 is a front view of a conventional transfer molding die, Figure 2 is a front view of a conventional transfer molding die.
The figure is a front view of a transfer molding die according to an embodiment of the present invention, FIG. 3 is a sectional view taken along the line ■-■ in FIG. 2, and FIGS. 4 and 5 are semiconductors obtained in FIG. 2. FIG. 3 is a perspective view of the device after molding and after cutting. 11...Transfer molding mold, 12...
...Pot, 13...Runner (resin passage),
14...Cavity, 15...Narrow part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金型内の樹脂通路に複数個のキャビティを互に離間して
直列的に配設すると共に、前記各キャビティ間の樹脂通
路の断面積をキャビティ内の樹脂通路の断面積より小さ
くしたことを特徴とするトランスファ成形用金型。A plurality of cavities are spaced from each other and arranged in series in a resin passage in the mold, and the cross-sectional area of the resin passage between the cavities is made smaller than the cross-sectional area of the resin passage within the cavity. A mold for transfer molding.
JP17971881U 1981-11-30 1981-11-30 Transfer molding mold Granted JPS5883146U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17971881U JPS5883146U (en) 1981-11-30 1981-11-30 Transfer molding mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17971881U JPS5883146U (en) 1981-11-30 1981-11-30 Transfer molding mold

Publications (2)

Publication Number Publication Date
JPS5883146U true JPS5883146U (en) 1983-06-06
JPS6120755Y2 JPS6120755Y2 (en) 1986-06-21

Family

ID=29975663

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17971881U Granted JPS5883146U (en) 1981-11-30 1981-11-30 Transfer molding mold

Country Status (1)

Country Link
JP (1) JPS5883146U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015005088A1 (en) * 2013-07-09 2015-01-15 株式会社村田製作所 Measurement device, and method for manufacturing same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015005088A1 (en) * 2013-07-09 2015-01-15 株式会社村田製作所 Measurement device, and method for manufacturing same
JP5958654B2 (en) * 2013-07-09 2016-08-02 株式会社村田製作所 Measuring device and manufacturing method thereof

Also Published As

Publication number Publication date
JPS6120755Y2 (en) 1986-06-21

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