JPS5883146U - Transfer molding mold - Google Patents
Transfer molding moldInfo
- Publication number
- JPS5883146U JPS5883146U JP17971881U JP17971881U JPS5883146U JP S5883146 U JPS5883146 U JP S5883146U JP 17971881 U JP17971881 U JP 17971881U JP 17971881 U JP17971881 U JP 17971881U JP S5883146 U JPS5883146 U JP S5883146U
- Authority
- JP
- Japan
- Prior art keywords
- transfer molding
- molding mold
- resin passage
- mold
- cavities
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来のトランスファ成形用金型の正面図、第2
図は本考案の一実施例のトランスファ成形用金型の正面
図、第3図は第2図の■−■線に沿う断面図、第4図及
び第5図は第2図で得られる半導体装置のモールド後及
び切断後の斜視図である。
11・・・・・・トランスファ成形用金型、12・・・
・・・ポット、13・・・・・・ランナ(樹脂通路)、
14・・・・・・キャビティ、15・・・・・・巾狭部
。Figure 1 is a front view of a conventional transfer molding die, Figure 2 is a front view of a conventional transfer molding die.
The figure is a front view of a transfer molding die according to an embodiment of the present invention, FIG. 3 is a sectional view taken along the line ■-■ in FIG. 2, and FIGS. 4 and 5 are semiconductors obtained in FIG. 2. FIG. 3 is a perspective view of the device after molding and after cutting. 11...Transfer molding mold, 12...
...Pot, 13...Runner (resin passage),
14...Cavity, 15...Narrow part.
Claims (1)
直列的に配設すると共に、前記各キャビティ間の樹脂通
路の断面積をキャビティ内の樹脂通路の断面積より小さ
くしたことを特徴とするトランスファ成形用金型。A plurality of cavities are spaced from each other and arranged in series in a resin passage in the mold, and the cross-sectional area of the resin passage between the cavities is made smaller than the cross-sectional area of the resin passage within the cavity. A mold for transfer molding.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17971881U JPS5883146U (en) | 1981-11-30 | 1981-11-30 | Transfer molding mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17971881U JPS5883146U (en) | 1981-11-30 | 1981-11-30 | Transfer molding mold |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5883146U true JPS5883146U (en) | 1983-06-06 |
JPS6120755Y2 JPS6120755Y2 (en) | 1986-06-21 |
Family
ID=29975663
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17971881U Granted JPS5883146U (en) | 1981-11-30 | 1981-11-30 | Transfer molding mold |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5883146U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015005088A1 (en) * | 2013-07-09 | 2015-01-15 | 株式会社村田製作所 | Measurement device, and method for manufacturing same |
-
1981
- 1981-11-30 JP JP17971881U patent/JPS5883146U/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015005088A1 (en) * | 2013-07-09 | 2015-01-15 | 株式会社村田製作所 | Measurement device, and method for manufacturing same |
JP5958654B2 (en) * | 2013-07-09 | 2016-08-02 | 株式会社村田製作所 | Measuring device and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
JPS6120755Y2 (en) | 1986-06-21 |
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