JPS5878676U - Ceramic wiring device - Google Patents

Ceramic wiring device

Info

Publication number
JPS5878676U
JPS5878676U JP17317781U JP17317781U JPS5878676U JP S5878676 U JPS5878676 U JP S5878676U JP 17317781 U JP17317781 U JP 17317781U JP 17317781 U JP17317781 U JP 17317781U JP S5878676 U JPS5878676 U JP S5878676U
Authority
JP
Japan
Prior art keywords
wiring device
ceramic wiring
wiring pattern
wiring
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17317781U
Other languages
Japanese (ja)
Inventor
坂村　利弘
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP17317781U priority Critical patent/JPS5878676U/en
Publication of JPS5878676U publication Critical patent/JPS5878676U/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来のライトペンを示す図、第２図は本考案に
よるライトペンを示す図、第３図は本考案の別の実施例
を示す側面図である。 図において、１０．１６はセラミック製の構造物、１１
．１７は平坦面、１２・・・は回路部品、１８はフィン
である。FIG. 1 is a diagram showing a conventional light pen, FIG. 2 is a diagram showing a light pen according to the present invention, and FIG. 3 is a side view showing another embodiment of the present invention. In the figure, 10.16 is a ceramic structure, 11
．． 17 is a flat surface, 12... are circuit components, and 18 is a fin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] セラミック製の構造物に配線パターンを設けるための平
坦面を形成して、該平坦面に厚膜の配線パターンを設け
１、該配線パターンに直接回路部品を接続すると共に、
セラミック製構造物に部品搭載と配線及び放熱の機能を
兼ねさせたことを特徴とするセラミック配線装置。Forming a flat surface for providing a wiring pattern on a ceramic structure, providing a thick film wiring pattern on the flat surface 1, connecting circuit components directly to the wiring pattern,
A ceramic wiring device characterized in that a ceramic structure has the functions of mounting components, wiring, and heat radiation.
JP17317781U 1981-11-20 1981-11-20 Ceramic wiring device Pending JPS5878676U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17317781U JPS5878676U (en) 1981-11-20 1981-11-20 Ceramic wiring device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17317781U JPS5878676U (en) 1981-11-20 1981-11-20 Ceramic wiring device

Publications (1)

Publication Number Publication Date
JPS5878676U true JPS5878676U (en) 1983-05-27

Family

ID=29965041

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17317781U Pending JPS5878676U (en) 1981-11-20 1981-11-20 Ceramic wiring device

Country Status (1)

Country Link
JP (1) JPS5878676U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011125344A1 (en) * 2010-04-06 2011-10-13 株式会社アテクト Substrate and method for manufacturing substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011125344A1 (en) * 2010-04-06 2011-10-13 株式会社アテクト Substrate and method for manufacturing substrate
JP2011222624A (en) * 2010-04-06 2011-11-04 Atect Corp Substrate and method for manufacturing the same

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