JPS5877071U - 発光ダイオ−ド表示器 - Google Patents

発光ダイオ−ド表示器

Info

Publication number
JPS5877071U
JPS5877071U JP17152681U JP17152681U JPS5877071U JP S5877071 U JPS5877071 U JP S5877071U JP 17152681 U JP17152681 U JP 17152681U JP 17152681 U JP17152681 U JP 17152681U JP S5877071 U JPS5877071 U JP S5877071U
Authority
JP
Japan
Prior art keywords
emitting diode
diode display
insulating layer
light emitting
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17152681U
Other languages
English (en)
Other versions
JPS6218072Y2 (ja
Inventor
真 山根
Original Assignee
三洋電機株式会社
鳥取三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社, 鳥取三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP17152681U priority Critical patent/JPS5877071U/ja
Publication of JPS5877071U publication Critical patent/JPS5877071U/ja
Application granted granted Critical
Publication of JPS6218072Y2 publication Critical patent/JPS6218072Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第1図は従来の表示器の断面図、第2図は本考案実施例
の発光ダイオード表示器の断面図である。 1・・・プリント基板、2・・・樹脂基台、3・・・絶
縁層、4・・・導電箔層、5・・・半導体素子、7・・
・絶縁体、8゜8・・・発光ダイオード。

Claims (1)

    【実用新案登録請求の範囲】
  1. (1)フェノール樹脂系の樹脂基台と、その樹脂基台に
    積層された不透明な絶縁層と、その絶縁層上−積層され
    た導電箔層とから成るプリント基板鵞、そのプリント基
    板の導電箔層上に載置さλ蒜テ÷エイオードと、プリン
    ト基板上に載置な絶縁体で覆われた半導体素子とを 事を特徴とする発光ダイオード表示器。 (2J  前記絶縁層は光反射性の絶縁層である事を特
    徴とする前記実用新案登録請求の範囲第1項記載の発光
    ダイオード表示器。
JP17152681U 1981-11-17 1981-11-17 発光ダイオ−ド表示器 Granted JPS5877071U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17152681U JPS5877071U (ja) 1981-11-17 1981-11-17 発光ダイオ−ド表示器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17152681U JPS5877071U (ja) 1981-11-17 1981-11-17 発光ダイオ−ド表示器

Publications (2)

Publication Number Publication Date
JPS5877071U true JPS5877071U (ja) 1983-05-24
JPS6218072Y2 JPS6218072Y2 (ja) 1987-05-09

Family

ID=29963445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17152681U Granted JPS5877071U (ja) 1981-11-17 1981-11-17 発光ダイオ−ド表示器

Country Status (1)

Country Link
JP (1) JPS5877071U (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62101250U (ja) * 1985-12-13 1987-06-27
JPH0254252U (ja) * 1988-10-12 1990-04-19
JP2002124703A (ja) * 2000-08-09 2002-04-26 Rohm Co Ltd チップ型発光装置
WO2007072659A1 (ja) * 2005-12-20 2007-06-28 Toshiba Lighting & Technology Corporation 発光装置
JP2007294867A (ja) * 2006-03-28 2007-11-08 Toshiba Lighting & Technology Corp 発光装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62101250U (ja) * 1985-12-13 1987-06-27
JPH0254252U (ja) * 1988-10-12 1990-04-19
JP2002124703A (ja) * 2000-08-09 2002-04-26 Rohm Co Ltd チップ型発光装置
WO2007072659A1 (ja) * 2005-12-20 2007-06-28 Toshiba Lighting & Technology Corporation 発光装置
JP2007294867A (ja) * 2006-03-28 2007-11-08 Toshiba Lighting & Technology Corp 発光装置

Also Published As

Publication number Publication date
JPS6218072Y2 (ja) 1987-05-09

Similar Documents

Publication Publication Date Title
JPS5877071U (ja) 発光ダイオ−ド表示器
JPS6098876U (ja) 表示装置
JPS6027466U (ja) フレキシブル回路基板用基材
JPS58110917U (ja) 発光式メンブレンスイツチ
JPS59191794U (ja) プリント基板
JPS58133183U (ja) 表示装置
JPS59111064U (ja) 印刷配線板
JPS5817726U (ja) キ−回路基板
JPS5813205U (ja) 脈拍センサ−
JPS5815375U (ja) 混成集積回路用基板
JPS5929008U (ja) 厚膜配線基板
JPS585376U (ja) 両面印刷配線板
JPS59126492U (ja) 厚膜el素子
JPS5834701U (ja) 印刷抵抗基板
JPS6138996U (ja) プリント基板の放熱構造
JPS5887350U (ja) 回路基板
JPS5849817U (ja) キ−スイツチ用プリント基板
JPS59186875U (ja) 絶縁ラベル
JPS5967961U (ja) プリント基板
JPS59127261U (ja) プリント基板
JPS5878526U (ja) スイツチ装置
JPS59179488U (ja) 整流スタツク
JPS5977254U (ja) ハイブリツド用基板
JPS58124978U (ja) フレキシブルプリント基板
JPS6115140U (ja) 透光性断熱化粧板