JPS585987B2 - Rotary evaporation equipment - Google Patents

Rotary evaporation equipment

Info

Publication number
JPS585987B2
JPS585987B2 JP9224879A JP9224879A JPS585987B2 JP S585987 B2 JPS585987 B2 JP S585987B2 JP 9224879 A JP9224879 A JP 9224879A JP 9224879 A JP9224879 A JP 9224879A JP S585987 B2 JPS585987 B2 JP S585987B2
Authority
JP
Japan
Prior art keywords
vapor
vapor deposition
deposited film
substrate
rotary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9224879A
Other languages
Japanese (ja)
Other versions
JPS5616668A (en
Inventor
浦出俊則
山本博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP9224879A priority Critical patent/JPS585987B2/en
Publication of JPS5616668A publication Critical patent/JPS5616668A/en
Publication of JPS585987B2 publication Critical patent/JPS585987B2/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50Substrate holders
    • C23C14/505Substrate holders for rotation of the substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Physical Vapour Deposition (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Description

【発明の詳細な説明】 本発明は、複数の基板に順次蒸着膜を形成する回転式蒸
着装置の改善に係り、とくに蒸着膜を形成する複数の基
板を回転枠に軸支した回動自在な吊下げ具に取り付ける
ようにした新しい蒸着装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement of a rotary vapor deposition apparatus for sequentially forming vapor deposited films on a plurality of substrates, and particularly to a rotary vapor deposition apparatus in which a plurality of substrates on which vapor deposited films are to be formed are pivotally supported on a rotary frame. This invention relates to a new vapor deposition device that is attached to a hanging fixture.

従来、例えば間接放電型ガス放電表示パネルの製造工程
において、ガラス基板上に形成した所定パターンの電極
を被覆してAl120f、にどの誘電体層を形成する場
合、量産性の見地から第1図に示すような回転式蒸着装
置が用いられていた。
Conventionally, in the manufacturing process of indirect discharge type gas discharge display panels, for example, when forming a dielectric layer on Al120f to cover electrodes in a predetermined pattern formed on a glass substrate, the method shown in Fig. 1 was used from the standpoint of mass production. A rotary evaporation apparatus as shown was used.

すなわち第1図において、1は蒸着槽となる円筒状の真
空容器、2は前記真空容器1の中に設置された蒸着試料
容器、3は前記蒸着試料容器内に収容される蒸着試料で
、4は蒸着すべき基板5を固定する回転枠である。
That is, in FIG. 1, 1 is a cylindrical vacuum container serving as a vapor deposition tank, 2 is a vapor deposition sample container installed in the vacuum container 1, 3 is a vapor deposition sample accommodated in the vapor deposition sample container, and 4 is a rotating frame that fixes the substrate 5 to be deposited.

このような構成の回転式蒸着装置においては、あらかじ
め電極パターンを形成した基板5を回転枠4の各辺に被
蒸着面が内向きとなるよう取付けさらにAl2O3など
の所定の蒸着試料3を蒸着試料容器2に収容する。
In a rotary evaporation apparatus having such a configuration, a substrate 5 on which an electrode pattern has been formed in advance is attached to each side of the rotating frame 4 so that the surface to be evaporated faces inward, and a predetermined evaporation sample 3 such as Al2O3 is attached to the evaporation sample. It is stored in container 2.

そして真空容器1内を図示しない真空ポンプで排気し高
真空を保持した状態で回転枠4を矢印A方向に回転する
と、基板5の蒸着膜形成面が蒸着試料3の上側に順次位
置するようになる。
Then, when the rotary frame 4 is rotated in the direction of arrow A while evacuating the inside of the vacuum container 1 with a vacuum pump (not shown) and maintaining a high vacuum, the vapor deposition film forming surface of the substrate 5 is sequentially positioned above the vapor deposition sample 3. Become.

かくして前記蒸着試料3を加熱して蒸発せしめれば前記
回転枠4の各辺に取り付けた複数の基板5のそれぞれの
蒸着膜形成面に順次蒸着膜を形成することができる。
By heating and evaporating the vapor deposition sample 3 in this manner, a vapor deposition film can be sequentially formed on each of the vapor deposition film formation surfaces of the plurality of substrates 5 attached to each side of the rotating frame 4.

しかしながらかかる構成の回転式蒸着装置にあっては、
基板5の蒸着膜形成面のみならずその他の部分にも蒸着
膜が付着する。
However, in a rotary evaporation apparatus with such a configuration,
The vapor deposited film adheres not only to the vapor deposited film forming surface of the substrate 5 but also to other parts.

その付着物が数μ以上の厚さとなると、真空容器1内の
熱サイクル等によって該付着物が剥離し易くなって落下
する場合がある。
If the thickness of the deposit is several microns or more, the deposit may easily peel off due to thermal cycles within the vacuum container 1 and may fall.

この場合に蒸着膜を形成する基板5の内、下側に位置し
ている基板は蒸着膜形成面が上向きとなっているため、
当該蒸着膜形成面上に前記付着物が剥離して落下すると
、そのまま異物として残留し、次の蒸着膜との間に閉じ
込められたりして蒸着膜の均一性を損なう欠点があった
In this case, among the substrates 5 on which the vapor deposited film is formed, the substrate located on the lower side has the vapor deposited film forming surface facing upward.
When the deposit peels off and falls onto the surface on which the deposited film is formed, it remains as a foreign matter and is trapped between the deposited film and the next deposited film, resulting in a disadvantage that the uniformity of the deposited film is impaired.

本発明は前記の欠点を解消すべくなされたもので、基板
を回転枠に軸支した回動自在な吊下げ具に取り付け、回
転枠の回転位置にかかわらず各基板の蒸着膜形成面が常
時下向きとなるように保持せしめることを目的としたも
のである。
The present invention has been made to solve the above-mentioned drawbacks, and the substrates are attached to a rotatable hanging tool that is pivotally supported on a rotating frame, so that the vapor-deposited film forming surface of each substrate is always fixed regardless of the rotational position of the rotating frame. The purpose is to hold it facing downward.

簡単に述べると本発明は、回転枠に支持された複数の基
板の少なくとも一側表面に蒸着膜を形成する回転式蒸着
装置において、前記回転枠に回動自在に軸支された複数
の吊下げ具を設け、該吊下げ具を介して前記蒸着すべき
基板をその蒸着膜形成面が常時下向きとなるよう保持せ
しめたことを特徴とするものである。
Briefly stated, the present invention provides a rotary vapor deposition apparatus for forming a vapor deposited film on at least one side surface of a plurality of substrates supported by a rotating frame, in which a plurality of hangings rotatably supported by the rotating frame are provided. The apparatus is characterized in that a tool is provided, and the substrate to be vapor-deposited is held via the hanging tool so that the surface on which the vapor-deposited film is formed always faces downward.

以下図面を参照しながら本発明に係る回転式蒸着装置に
ついて詳細に説明する。
The rotary vapor deposition apparatus according to the present invention will be described in detail below with reference to the drawings.

第2図は、本発明に係る回転式蒸着装置の一実施例の概
略を示す側断面図で、前図と同等の部分については同一
符号で記しである。
FIG. 2 is a side sectional view schematically showing an embodiment of a rotary evaporation apparatus according to the present invention, and parts equivalent to those in the previous figure are designated by the same reference numerals.

6は回転枠で7は前記回転枠6の円周上の略等間隔の位
置に軸8により回転自在に軸支された複数の吊下げ具で
ある。
Reference numeral 6 denotes a rotating frame, and 7 indicates a plurality of hanging tools rotatably supported by a shaft 8 at approximately equal intervals on the circumference of the rotating frame 6.

このような構成とすることによって基板5を前記複数の
吊下げ具1に蒸着膜形成面が下向きとなるよう取り付け
、前記回転枠6を矢印A方向に回転する左、基板5を取
り付けた吊下げ具7は重力によって常時水平状態を保持
された形となり、基板5の蒸着膜形成面も常に下向きと
なる。
With this configuration, the substrate 5 is attached to the plurality of hanging tools 1 so that the deposited film forming surface faces downward, and the rotating frame 6 is rotated in the direction of arrow A to the left, and the substrate 5 is attached to the hanging device. The tool 7 is always kept in a horizontal state due to gravity, and the surface of the substrate 5 on which the deposited film is formed always faces downward.

かくして基板5の蒸着膜形成面以外に付着した不要な蒸
着物が剥離し落下しても、前記基板5の蒸着膜形成面は
常時下側を向いた形で水平状態にあるので、蒸着膜形成
面に付着することがなくなり、高品質の蒸着膜が形成で
きるわけである。
In this way, even if unnecessary vapor deposits attached to a surface other than the surface on which the vapor deposited film is formed of the substrate 5 peel off and fall, the surface on which the vapor deposited film is formed on the substrate 5 is always in a horizontal state facing downward, so that the vapor deposited film cannot be formed. This eliminates the possibility of adhesion to the surface and allows the formation of a high-quality deposited film.

なお、本実施例ではガス放電表示パネルの電極基版表面
に対する誘電体層用の蒸着膜を形成する装置について詳
述したが、その他蒸着工程を有する各種素子のための量
産向蒸着装置として適用が可能である。
In this example, an apparatus for forming a vapor deposited film for a dielectric layer on the surface of an electrode substrate of a gas discharge display panel was described in detail, but it can also be applied as a mass production vapor deposition apparatus for various devices having other vapor deposition processes. It is possible.

以上説明したように、本発明に係る回転式蒸着装置によ
れば、回転枠6の回転位置にかかわらず複数の基板5の
蒸着膜形成面が常時下方を向いた状態にあるので、蒸着
装置内において無用な異物の付着が防止でき、高品質の
蒸着膜の形成が可能となり、各種の一着装置に適用して
、極めて有益である。
As explained above, according to the rotary vapor deposition apparatus according to the present invention, the vapor deposition film forming surfaces of the plurality of substrates 5 always face downward regardless of the rotational position of the rotary frame 6, so that It is possible to prevent the adhesion of unnecessary foreign matter and to form a high-quality deposited film, which is extremely beneficial when applied to various deposition devices.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、従来の回転式蒸着装置の概略を示す側断面図
、第2図は、本発明に係る回転式蒸着装置の一実施例の
概略を示す側断面図である。 1・・・真空容器、2・・・蒸着試料容器、3・・・蒸
着試料、4,6・・・回転枠、5・・・基板、7・・・
吊下げ具、8・・・観
FIG. 1 is a side sectional view schematically showing a conventional rotary evaporation apparatus, and FIG. 2 is a side sectional view schematically showing an embodiment of a rotary evaporation apparatus according to the present invention. DESCRIPTION OF SYMBOLS 1... Vacuum container, 2... Vapor deposition sample container, 3... Vapor deposition sample, 4, 6... Rotating frame, 5... Substrate, 7...
Hanging tool, 8... view

Claims (1)

【特許請求の範囲】[Claims] 1回転枠によって回転するよう保持された複数の基板の
少なくとも一側表面に、蒸着膜を形成する回転式蒸着装
置において、前記回転枠に回転自在に軸支された複数の
吊下げ具を設け、該吊下げ具を介して前記蒸着すべき基
板をその蒸着膜形成面が常時下向きとなるよう保持せし
めたことを特徴とする回転式蒸着装置。
In a rotary vapor deposition apparatus for forming a vapor deposited film on at least one side surface of a plurality of substrates held for rotation by a single rotation frame, a plurality of hanging tools rotatably supported by the rotation frame are provided, A rotary vapor deposition apparatus characterized in that the substrate to be vapor-deposited is held via the hanging tool so that the surface on which the vapor-deposited film is formed always faces downward.
JP9224879A 1979-07-19 1979-07-19 Rotary evaporation equipment Expired JPS585987B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9224879A JPS585987B2 (en) 1979-07-19 1979-07-19 Rotary evaporation equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9224879A JPS585987B2 (en) 1979-07-19 1979-07-19 Rotary evaporation equipment

Publications (2)

Publication Number Publication Date
JPS5616668A JPS5616668A (en) 1981-02-17
JPS585987B2 true JPS585987B2 (en) 1983-02-02

Family

ID=14049117

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9224879A Expired JPS585987B2 (en) 1979-07-19 1979-07-19 Rotary evaporation equipment

Country Status (1)

Country Link
JP (1) JPS585987B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0238835Y2 (en) * 1986-11-26 1990-10-18
JP4721555B2 (en) * 2001-05-25 2011-07-13 河合光学株式会社 Prism surface deposition apparatus and method

Also Published As

Publication number Publication date
JPS5616668A (en) 1981-02-17

Similar Documents

Publication Publication Date Title
KR20190002834U (en) In-line coater for the deposition of the thin film coatings in vacuum
JPS6130661A (en) Coating forming device
US3417733A (en) Apparatus for vacuum coating
US3523517A (en) Rotating workpiece holder
JPS585987B2 (en) Rotary evaporation equipment
KR100624767B1 (en) OLED evaporation system using shutter rotation for continuous deposition process
JPH02141575A (en) Thin film depositing device
US3934059A (en) Method of vapor deposition
JPS5845175B2 (en) Rotary evaporation equipment
JPH0570931A (en) Vacuum deposition apparatus and sticking prevention plate
JPS5822542B2 (en) Method for forming multiple deposited films
JPH02173261A (en) Vacuum film forming device
JPH032228B2 (en)
JPS5812336B2 (en) How to make a living
JPH04202773A (en) Film forming method and corrector used therefor
JPS6086269A (en) Vacuum vapor deposition apparatus
KR20000054211A (en) Heating crucible of apparatus for depositing a organic materials
JPH1171671A (en) Vacuum deposition device
SU512249A1 (en) Vacuum coater for embossed substrates
GB2175015A (en) Depositing vaporized material uniformly
JP2001035846A (en) Method and device for thin film formation
JPH082649Y2 (en) LCD manufacturing equipment
JPH08319560A (en) Vacuum deposition device and vacuum deposition method
JP2000345333A (en) Method and device for forming a1 film
JPS5873768A (en) Rotating and revolving type vapor depositing device