JPS5858624U - Mixed mounting structure - Google Patents
Mixed mounting structureInfo
- Publication number
- JPS5858624U JPS5858624U JP15184281U JP15184281U JPS5858624U JP S5858624 U JPS5858624 U JP S5858624U JP 15184281 U JP15184281 U JP 15184281U JP 15184281 U JP15184281 U JP 15184281U JP S5858624 U JPS5858624 U JP S5858624U
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- package
- mounting structure
- wiring board
- mixed mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来婢術での実装構造を示す斜視図、第２図は
部分的な多端子化の細巾を図示した説明図、第３図ａ
” ｃは電子回路パッケージでの多端子の様子を示した
電面図、第一図、第５図はそれぞれ本考案の一実施例を
示した正面図および一部切欠いて示した斜視図、第６図
は本考案の他の実施例を示す概略図である。
１・・・・・・裏面配線板、２・・・・・・シャーシ、
３・・面電子回路パッケージ、４・・・・・・集積素子
、ＩＣ類、５・・・・・・多端子化電子回路パッケージ
、６・・・・・・コネクタ、７・・・・・・冷却ブロッ
ク、８，９・・・・・・システムの論理ブロック。Figure 1 is a perspective view showing a conventional mounting structure, Figure 2 is an explanatory diagram illustrating a partial multi-terminal structure, and Figure 3 a.
"c is an electrical plan view showing the state of multi-terminals in an electronic circuit package, FIG. 1 and FIG. Figure 6 is a schematic diagram showing another embodiment of the present invention. 1... Rear wiring board, 2... Chassis,
3... Surface electronic circuit package, 4... Integrated element, ICs, 5... Multi-terminal electronic circuit package, 6... Connector, 7... - Cooling block, 8, 9... Logical block of the system.
Claims (1)
パッケージと、これら電子回路パッケージ複数とコネク
タを介して接続され、同時に電子回路パッケージ間の布
線接続を収容する裏面配線板において、電子回路パ゛ツ
ケージの一辺をコネクタ領域となし、パッケージを裏面
煕線板に垂直に実装した平面実装群と、電子回路パッケ
ージの一辺以上を用いてコネクタ領域とし、裏面配線板
に平行の位置にて実装した三次元実装とにより電子回路
パッケージと裏面配線板を接続し、 たこと今特徴と
する混在形実装構造。 □（２）実用新案登録請求の範
囲第１項記載の混在形実装構造において、平行に実装し
た部分にできる空間に、ファンまたは小形ダクー等の冷
却手段を設置し、特定パッケージを冷却することを特徴
とする混在形実装構造。(1) An electronic circuit package mounted with a functional element such as an integrated circuit is connected to a plurality of these electronic circuit packages via a connector, and the electronic circuit board is connected to a backside wiring board that accommodates wiring connections between the electronic circuit packages. One side of the electronic circuit package is used as the connector area and the package is mounted perpendicularly to the back side wiring board, and the other is the flat mount group where one side of the electronic circuit package is used as the connector area and the package is mounted parallel to the back side wiring board. The electronic circuit package and the backside wiring board are connected using three-dimensional mounting, creating a mixed mounting structure that is currently unique. □(2) Scope of Utility Model Registration In the mixed mounting structure described in claim 1, a cooling means such as a fan or a small duct is installed in the space created in the parallel mounted parts to cool a specific package. Features a mixed mounting structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15184281U JPS5858624U (en) | 1981-10-13 | 1981-10-13 | Mixed mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15184281U JPS5858624U (en) | 1981-10-13 | 1981-10-13 | Mixed mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5858624U true JPS5858624U (en) | 1983-04-20 |
Family
ID=29944521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15184281U Pending JPS5858624U (en) | 1981-10-13 | 1981-10-13 | Mixed mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5858624U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002541542A (en) * | 1999-04-02 | 2002-12-03 | ユニシス コーポレイシヨン | Modular packaging of computer systems |
-
1981
- 1981-10-13 JP JP15184281U patent/JPS5858624U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002541542A (en) * | 1999-04-02 | 2002-12-03 | ユニシス コーポレイシヨン | Modular packaging of computer systems |
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