JPS5858371U - Chip parts mounting device - Google Patents

Chip parts mounting device

Info

Publication number
JPS5858371U
JPS5858371U JP15276881U JP15276881U JPS5858371U JP S5858371 U JPS5858371 U JP S5858371U JP 15276881 U JP15276881 U JP 15276881U JP 15276881 U JP15276881 U JP 15276881U JP S5858371 U JPS5858371 U JP S5858371U
Authority
JP
Japan
Prior art keywords
mounting device
chip parts
parts mounting
chip component
component mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15276881U
Other languages
Japanese (ja)
Inventor
悟 田崎
稔 佐藤
政雄 林
白石 潔
Original Assignee
クラリオン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by クラリオン株式会社 filed Critical クラリオン株式会社
Priority to JP15276881U priority Critical patent/JPS5858371U/en
Publication of JPS5858371U publication Critical patent/JPS5858371U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

゛    第1図は、本考案の一実施例によるプリント
配線板等を示す断面図、第2図は1、同一実施例による
プリント配線板を示す底面図、第3図及び第4図は、本
考案の他の実施例の斜視図である。 1・・・プリント配線板、−2・・・チップ部品、4・
・・吸引ノズルの開孔。
゛ Fig. 1 is a sectional view showing a printed wiring board etc. according to an embodiment of the present invention, Fig. 2 is a bottom view showing a printed wiring board according to the same embodiment, and Figs. FIG. 6 is a perspective view of another embodiment of the invention; 1...Printed wiring board, -2...Chip parts, 4.
... Suction nozzle opening.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント配線板の開孔を介して吸引ノズルによ′リチツ
プ部品を吸着させるように構成したことを特徴とするチ
ップ部品装着装置。
1. A chip component mounting device characterized in that the chip component mounting device is configured so that a re-chip component is sucked by a suction nozzle through an opening in a printed wiring board.
JP15276881U 1981-10-16 1981-10-16 Chip parts mounting device Pending JPS5858371U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15276881U JPS5858371U (en) 1981-10-16 1981-10-16 Chip parts mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15276881U JPS5858371U (en) 1981-10-16 1981-10-16 Chip parts mounting device

Publications (1)

Publication Number Publication Date
JPS5858371U true JPS5858371U (en) 1983-04-20

Family

ID=29945408

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15276881U Pending JPS5858371U (en) 1981-10-16 1981-10-16 Chip parts mounting device

Country Status (1)

Country Link
JP (1) JPS5858371U (en)

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