JPS5850748A - Unit for processing semiconductor - Google Patents
Unit for processing semiconductorInfo
- Publication number
- JPS5850748A JPS5850748A JP14789781A JP14789781A JPS5850748A JP S5850748 A JPS5850748 A JP S5850748A JP 14789781 A JP14789781 A JP 14789781A JP 14789781 A JP14789781 A JP 14789781A JP S5850748 A JPS5850748 A JP S5850748A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- guide
- stopper
- holder
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Weting (AREA)
Abstract
Description
【発明の詳細な説明】 本発明は半導体処理装置に関する。[Detailed description of the invention] The present invention relates to semiconductor processing equipment.
一般に、半導体製品の製造過程において半導体ウニへの
処理な行う場合、たとえばレフスト除去装置のように処
理液をたとえば80G−100Gの高温に加熱してレジ
ストの除去な行ったり、・あるいはエツチングな行う処
瑞工鴨がある。その場合、ウェハはカートリッジに収容
され、該カートリッジをハンドルで持ち上げて処理槽の
中に搬入している。この操作な自動的に行う機構におい
ては、ハンドルを自動的に搬送する必要があるので。Generally, when processing a semiconductor in the process of manufacturing semiconductor products, the resist is removed by heating the processing liquid to a high temperature of 80G to 100G, for example, in a resist removal device, or by etching. There is Zuiko duck. In this case, the wafer is housed in a cartridge, and the cartridge is lifted by a handle and carried into the processing tank. In a mechanism that automatically performs this operation, it is necessary to automatically transport the handle.
処理装置が大型化してしまうという欠点がある。This has the disadvantage that the processing equipment becomes larger.
tだ、、の従来装置では、ウェハの処理はカートリッジ
単位で行われるので、ウニノ1の収・容位置により温度
や濃度等が異なった状態にある処理液に触れるととにな
り、処理が不均一になってしまう。さらに、処理液の中
にカートリッジ自体も持ち込むので、カートリッジ周辺
の受ける温度変化も大きく、処理液の温度も不安定とな
ってしまう。In conventional equipment, wafers are processed in cartridges, so if UNINO 1 comes into contact with processing liquids that have different temperatures and concentrations depending on the storage location, processing may fail. It becomes uniform. Furthermore, since the cartridge itself is brought into the processing liquid, the temperature around the cartridge is subject to large changes, and the temperature of the processing liquid becomes unstable.
本発明の目的は、前記従来技術の欠点を解消し、ウニへ
の処理な均一に行うことができ、しかもコンパクトな半
導体処理装置゛を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a compact semiconductor processing apparatus which can eliminate the drawbacks of the prior art, uniformly process sea urchins, and which is compact.
この目的を達成するため1本発明は処理槽内に複数個設
けられたウニノ1ホルダの中にウニノ・を1枚ずつ自動
的に搬入および搬出するよう構成したものである。In order to achieve this object, the present invention is configured to automatically carry in and take out Unino one by one into a plurality of Unino 1 holders provided in a processing tank.
以下1本発明を図面に示す実施例にしたがってさらに説
明する。The present invention will be further explained below with reference to embodiments shown in the drawings.
第1図は本発明による半導体処理装置の一実施例な示す
斜視図、第2図はその11纏牛断面図である。FIG. 1 is a perspective view showing one embodiment of a semiconductor processing apparatus according to the present invention, and FIG. 2 is a cross-sectional view of an 11-piece thereof.
本実施例において、符号lは洗浄槽であり、こ ゛の洗
浄槽lの中には、ウェハ2を垂直方向K1枚ずつ収容で
きるウェハホルダ3が円周方向に複数11、たとえ1f
約30個設けられている。つ、ハホルダ3は回転モータ
4により回転できる。まだ、ウェハホルダ3は第2図か
ら明らかなように、石英材料からなる加熱部5と、その
外側の断熱lB6とt有し、7Jl熱部50内側には処
理液7かウェハ2を十分法めることのできるよう収容さ
れている。In this embodiment, reference numeral 1 denotes a cleaning tank, and in this cleaning tank 1, there are a plurality of wafer holders 3 in the circumferential direction, each of which can accommodate one wafer 2 in the vertical direction, for example, 1 f.
There are about 30 of them. First, the holder 3 can be rotated by a rotary motor 4. As is clear from FIG. 2, the wafer holder 3 has a heating section 5 made of quartz material and insulation lB6 and t on the outside thereof, and the processing liquid 7 or the wafer 2 is sufficiently applied inside the heating section 50. It is housed in such a way that it can be accommodated.
加熱部5は処理液7%:所定の高温に加熱するヒータな
内蔵している。The heating unit 5 has a built-in heater that heats the processing liquid to a predetermined high temperature of 7%.
洗浄槽の全体は、断熱材を内蔵した蓋8により覆うこと
ができ、処理液7の熱が外部に放散するのを阻止するよ
う罠なっている。この蓋8の一部には、ウェハ2をウェ
ハホルダ3に対して搬入および搬出するための出入口9
が半径方向にスリ。The entire cleaning tank can be covered with a lid 8 containing a heat insulating material, which acts as a trap to prevent the heat of the processing liquid 7 from dissipating to the outside. A part of the lid 8 has an entrance 9 for loading and unloading the wafer 2 into and out of the wafer holder 3.
is pickpocketed in the radial direction.
ト状に形成されている。It is shaped like a toe.
一方1本実施例においては、ウェハ2をウェハホルダ3
に搬入、搬出するための機構とし゛〔、ウェハ2を案内
する、ガイド11.該ガイド11から受は取ったウェハ
2をり2ハガイド3に移換する。On the other hand, in this embodiment, the wafer 2 is held in the wafer holder 3.
A guide 11 that guides the wafer 2 is used as a mechanism for loading and unloading the wafer. The wafer 2 taken from the guide 11 is transferred to the guide 3.
移換中間ガイド12.咳移換中間ガイド12とウェハホ
ルダ3との間でウェハ2を受は渡す上下可能なプッシャ
ー13を含んでいる。移換中間ガイド12は回転軸14
の回りで第1図の水平状態から1直状態まで時計方向に
90度だけ回転(揺動)でき、またその表面上には、ガ
イド11から搬送されて米たウェハ2を停止させるため
のストッパ15が2本配置されている。Transfer intermediate guide 12. It includes a pusher 13 that can move up and down to receive and pass the wafer 2 between the cough transfer intermediate guide 12 and the wafer holder 3. The transfer intermediate guide 12 is connected to the rotating shaft 14
It can be rotated (swung) clockwise by 90 degrees from the horizontal state to the vertical state shown in FIG. Two 15's are placed.
さらに、移換中間ガイド12の下流側には、処理液7に
よる処理を終了したウェハ2を骸移換中間ガイド12か
ら受は取って水洗槽17の中に供するためのガイド16
が配置されている。Further, on the downstream side of the intermediate transfer guide 12, a guide 16 is provided for receiving the wafer 2 that has been processed with the processing liquid 7 from the intermediate transfer guide 12 and placing it in the washing tank 17.
is located.
次に1本実施例の作用について説明する。Next, the operation of this embodiment will be explained.
処理されるつ!ハ2はまずガイド11を通って移換中間
ガイド12のストッパ15の位置まで搬送されて停止す
る。この状態で移換中間ガイド12を回転軸14により
時計方向に90度回転させると、S換中間ガイド12は
―直状−になる。その後、ストッパ15を開いて、ウェ
ハ2をグツシャー13により移換中間ガイド12からウ
ェハホルダ3に受は渡しく第2図)、ウェハ2を処理液
7の中に浸漬して所望の処理を行う。このようなウェハ
2のウェハホルダ3への搬入411枚ずつ行われ、先に
搬入されたウェハ2は回転モータ4でウニ・・ホルダ3
を所定量だけ回転させ、次のウニノ・ホルダ3が蓋8の
出入口9と整合する位置に米るようにすることによって
1枚ずつ各ウェハホルダ3の中に搬入される。It will be processed! C2 is first conveyed through the guide 11 to the stopper 15 position of the transfer intermediate guide 12 and stopped. In this state, when the intermediate transfer guide 12 is rotated 90 degrees clockwise by the rotating shaft 14, the S intermediate guide 12 becomes straight. Thereafter, the stopper 15 is opened, the wafer 2 is transferred from the intermediate guide 12 to the wafer holder 3 by the squeezer 13 (FIG. 2), and the wafer 2 is immersed in the processing liquid 7 to perform the desired processing. In this way, 411 wafers 2 are loaded into the wafer holder 3, and the first wafer 2 is transferred to the wafer holder 3 by the rotary motor 4.
The wafers are rotated by a predetermined amount so that the next wafer holder 3 is aligned with the opening 9 of the lid 8, so that the wafers are loaded one by one into each wafer holder 3.
処理液7による所定の処理を終えたウェハ2は前記搬入
操作とは逆の操作でブツシャ13.ストッパ15.移換
中間ガイド12により、該移換中間ガイド12からガイ
ド16を経て水洗槽17に送られ、水洗処理+L−終え
た後、洗浄槽17から次の処理工種に送られる。The wafer 2 that has been subjected to the predetermined treatment using the treatment liquid 7 is transferred to the bushing 13 by an operation opposite to the carrying-in operation. Stopper 15. The material is sent from the transfer intermediate guide 12 to the washing tank 17 via the guide 16, and after the washing process +L- is completed, it is sent from the washing tank 17 to the next processing type.
本実施例においては、ウニ/4は1枚ずつ槽内の処理液
7中に供給され、しかもウェハ2は槽内の処理液7の中
で移動するので、ウェハ2に接触する処理液7は全りエ
へについて同一状態であり。In this embodiment, the sea urchins/4 are fed into the processing liquid 7 in the tank one by one, and since the wafer 2 moves in the processing liquid 7 in the tank, the processing liquid 7 that comes into contact with the wafer 2 is All of them are in the same condition.
またウェハ2のみが槽内に入るので、a内温度の変動が
小さく、均一な処理が得られ1歩留りを向上させること
ができる。また、ウェハ2は1枚ずつ処理されるので装
置全体がコンパクトであり。Further, since only the wafer 2 enters the bath, fluctuations in the temperature inside a are small, uniform processing is obtained, and the yield can be improved. Further, since the wafers 2 are processed one by one, the entire apparatus is compact.
蓋8により槽内からの熱の放散も最小@に抑制できる。The lid 8 can also suppress heat dissipation from inside the tank to a minimum.
以上説明したように1本発明によれば、ウニへの均一処
理により歩留りな向上させることができ、しかもコンパ
クトな構造を得ることかできる。As explained above, according to the present invention, the yield can be improved by uniformly treating sea urchins, and moreover, a compact structure can be obtained.
第1図は本発明による半導体処魂装置の一実施例を示す
斜視図、第2mは第1図のト1線半断面図である。
l・・・洗浄槽、2・・・ウェハ、3・・・ウェハホル
ダ。
4・・・回転モータ、5・・・加熱部、6・・・断熱部
、7・・・処理液、8・・・蓋%9・・・出入口、ll
・・・ガイド、12・・・移換中間ガイド、13・・・
グツシャー、14・・・回転輪、15・・・ストッパ、
16・・・ガイド、17・・・水洗槽。
第 1 図
第2図
201FIG. 1 is a perspective view showing an embodiment of a semiconductor soul processing device according to the present invention, and FIG. 2m is a half sectional view taken along line 1 in FIG. l...Cleaning tank, 2...Wafer, 3...Wafer holder. 4... Rotating motor, 5... Heating section, 6... Heat insulation section, 7... Processing liquid, 8... Lid %9... Entrance/exit, ll
...Guide, 12...Transfer intermediate guide, 13...
Gutsusha, 14... rotating wheel, 15... stopper,
16...Guide, 17...Washing tank. Figure 1 Figure 2 201
Claims (1)
ホルダを設け、搬送されたクエへを前記つ2ハホルダの
中に1枚ずつ自動的に搬入しかつ該ウニへホルダから搬
出するつ2ハ搬入および搬出機構を備えている半導体処
理装置。□ 2、つ2ハ搬入および搬出機構は1回転軸の回りに回転
可能な移換中間ガイド、ストッパおよびウェハを移換中
間ガイドとウニへホルダとの間で受は渡すプッシャーよ
りなることを特徴とする特許請求の範Wi第1項記載の
半導体処理装置。[Scope of Claims] 1. A plurality of wafer holders into which wafers are placed one by one are provided in the processing tank, and the transported wafers are automatically transferred one by one into the two wafer holders and transferred to the wafers. A semiconductor processing device equipped with two loading and unloading mechanisms for unloading from a holder. □ 2. The loading and unloading mechanism consists of a transfer intermediate guide rotatable around a rotation axis, a stopper, and a pusher that passes the wafer between the transfer intermediate guide and the holder. A semiconductor processing apparatus according to claim 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14789781A JPS5850748A (en) | 1981-09-21 | 1981-09-21 | Unit for processing semiconductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14789781A JPS5850748A (en) | 1981-09-21 | 1981-09-21 | Unit for processing semiconductor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5850748A true JPS5850748A (en) | 1983-03-25 |
Family
ID=15440618
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14789781A Pending JPS5850748A (en) | 1981-09-21 | 1981-09-21 | Unit for processing semiconductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5850748A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006009102A1 (en) | 2004-07-20 | 2006-01-26 | Kabushiki Kaisha Powrex | Coating device |
-
1981
- 1981-09-21 JP JP14789781A patent/JPS5850748A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006009102A1 (en) | 2004-07-20 | 2006-01-26 | Kabushiki Kaisha Powrex | Coating device |
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