JPS58493U - Heat dissipation structure of electronic circuit components - Google Patents
Heat dissipation structure of electronic circuit componentsInfo
- Publication number
- JPS58493U JPS58493U JP9347081U JP9347081U JPS58493U JP S58493 U JPS58493 U JP S58493U JP 9347081 U JP9347081 U JP 9347081U JP 9347081 U JP9347081 U JP 9347081U JP S58493 U JPS58493 U JP S58493U
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- heat dissipation
- circuit components
- dissipation structure
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は来者訟に係る電子回路部品の放熱構造を示す展
開斜視図、第２図は同組立状態の側面図である。
Ａ：電子回路部品、Ｂ：金属板、Ｃ：函体、Ｐニブリン
ト基板。FIG. 1 is an exploded perspective view showing the heat dissipation structure of the electronic circuit component according to the lawsuit, and FIG. 2 is a side view of the assembled state. A: electronic circuit component, B: metal plate, C: box, Pnibrint board.
Claims (1)
ト基板に取付けると共に、その取付位置から離隔した函
体のパネル面を放熱表面として構成するところの電子回
路部品の放熱構造であって、アルミニウム等の熱伝導性
の良好な比較的厚肉の金属板で、電子回路部品と函体パ
ネルに対する当接固定面を各端に持った適宜折曲形状の
導熱板により、電子回路部品と函体パネルの間を連結し
たことを特徴とする電子回路部品の放熱構造。A heat dissipation structure for electronic circuit components in which various electronic circuit components such as transistors that generate heat are mounted on a printed circuit board, and the panel surface of a box separated from the mounting position is configured as a heat dissipation surface. It is a relatively thick metal plate with good conductivity, and has an appropriately bent heat conductive plate at each end that has a fixed surface that contacts the electronic circuit components and the housing panel. A heat dissipation structure for an electronic circuit component, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9347081U JPS58493U (en) | 1981-06-24 | 1981-06-24 | Heat dissipation structure of electronic circuit components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9347081U JPS58493U (en) | 1981-06-24 | 1981-06-24 | Heat dissipation structure of electronic circuit components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58493U true JPS58493U (en) | 1983-01-05 |
Family
ID=29888435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9347081U Pending JPS58493U (en) | 1981-06-24 | 1981-06-24 | Heat dissipation structure of electronic circuit components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58493U (en) |
-
1981
- 1981-06-24 JP JP9347081U patent/JPS58493U/en active Pending
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