JPS5847876B2 - Manufacturing method of light emitting diode lamp - Google Patents
Manufacturing method of light emitting diode lampInfo
- Publication number
- JPS5847876B2 JPS5847876B2 JP58001534A JP153483A JPS5847876B2 JP S5847876 B2 JPS5847876 B2 JP S5847876B2 JP 58001534 A JP58001534 A JP 58001534A JP 153483 A JP153483 A JP 153483A JP S5847876 B2 JPS5847876 B2 JP S5847876B2
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- tape
- diode chip
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
【発明の詳細な説明】
本発明は非常に小型の発光ダイオードランプの製造方法
に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing very compact light emitting diode lamps.
第１図は従来の小型の発光ダイオードランプの一部を示
す図である。FIG. 1 is a diagram showing a part of a conventional small-sized light emitting diode lamp.
第１図ａは薄い金属板をエッチング加工によって形成さ
れた金属フレーム１を示す斜視図であり、一対の対向し
たリード線２，３が形成されている。FIG. 1a is a perspective view showing a metal frame 1 formed by etching a thin metal plate, on which a pair of opposing lead wires 2 and 3 are formed.
第１図ｂは第１図ａのＩＪ一ド線２，３間にＰＮ接合面
４に平行な面に電極５，６を有する発光ダイオードチツ
プ７をその電極５，６がリード線２，３に接触するよう
に挿入した平面図である。FIG. 1b shows a light emitting diode chip 7 having electrodes 5 and 6 on a plane parallel to the PN junction surface 4 between the IJ lead wires 2 and 3 in FIG. 1a. It is a top view inserted so that it may contact.
第１図ｃｏｄは第１図ｂのＡ−Ａ断面図である。FIG. 1 cod is a sectional view taken along the line AA in FIG. 1 b.
第１図に於いて、発光ダイオードチツプ７の厚さ、たて
、横の寸法は約０．５ Ｘ Ｉ Ｘ Ｏ．３ミリメート
ルのもので、これに対してリード１２ ，３の厚さも０
．３ミＩＪメートル程度の薄いものを使用するので、金
属フレーム１を薄くシ、対向するリード線２，３の間を
最小０．５ミＩＪメートル以下としなければならず、金
属フレーム１の加工が難しいだけでなく、歩留りが悪い
。In FIG. 1, the thickness, vertical and horizontal dimensions of the light emitting diode chip 7 are approximately 0.5 X I X O. 3 mm, whereas the thickness of leads 12 and 3 is also 0.
．． Since a thin piece of about 3 mm IJ meters is used, the metal frame 1 must be thin and the distance between the opposing lead wires 2 and 3 must be at least 0.5 mm IJ meters or less, making it difficult to process the metal frame 1. Not only is it difficult, but the yield is low.
さらに発光ダイオードチツプ７をリード線２，３の間に
挿入する際には、リード線２，３が細長く脆弱なので、
対向面が不整いとなって第１図ｄとなりやすく、チツプ
７を第１図Ｃの図に示す状態に挾持する事は難しい。Furthermore, when inserting the light emitting diode chip 7 between the lead wires 2 and 3, the lead wires 2 and 3 are long and fragile, so
The opposing surfaces tend to be uneven, resulting in the condition shown in FIG. 1D, and it is difficult to hold the chip 7 in the state shown in FIG. 1C.
リード線２，３が多少でもずれると、発光ダイオードチ
ツプ７が長方形であるため接触が小さくなり、銀ペース
ト等の導電接着剤やインジウム等の半田金属によって電
気的、機械的に固着する事が難しい。If the lead wires 2 and 3 are even slightly misaligned, the light-emitting diode chip 7 is rectangular, so the contact becomes small, and it is difficult to electrically and mechanically fix it with a conductive adhesive such as silver paste or a solder metal such as indium. .
第２図は本発明の実施例を示す図で、第２図ａはテープ
状電線８を示す斜視図である。FIG. 2 is a diagram showing an embodiment of the present invention, and FIG. 2a is a perspective view showing the tape-shaped electric wire 8. In FIG.
テープ状電線８は多数の細い導電線９をテープ状の絶縁
体１０によって保持しているもので、一般に基板間のコ
ネクターとして用いられているものである。The tape-shaped electric wire 8 has a large number of thin conductive wires 9 held by a tape-shaped insulator 10, and is generally used as a connector between boards.
図に於けるテープ状電線８は部分的にテープ状の絶縁体
１０を設けているもので、使用に際して点線の位置で切
断する。The tape-shaped electric wire 8 in the figure is partially provided with a tape-shaped insulator 10, and is cut at the dotted line position when used.
第２図ｂは第１図と同様に一対の導電線９間に発光ダイ
オードチツプ７をその電極５，６が接触するように挿入
したものである。In FIG. 2b, similarly to FIG. 1, a light emitting diode chip 7 is inserted between a pair of conductive wires 9 so that its electrodes 5 and 6 are in contact with each other.
テープ状の絶縁体１０が導電線９を強固に保持している
ので、発光ダイオードチツプ１を挿入する前に導電線９
を一部折曲げて導電線９間をせまくしてもそのままの状
態が維持されるので、発光ダイオードチツプＴは確実に
挾持される。Since the tape-shaped insulator 10 firmly holds the conductive wire 9, the conductive wire 9 must be removed before inserting the light emitting diode chip 1.
Even if the conductive wires 9 are partially bent to narrow the space between the conductive wires 9, the same state is maintained, so the light emitting diode chip T is reliably held.
また導電線９の断面が円形であるため導電線９が多少ず
れても間隔さえ適切であれば常に第２図Ｃと同一構戒に
なるので、導電接着剤または半田金属で固着する作業が
容易であり、固着面積１１が広くとれる。In addition, since the cross section of the conductive wire 9 is circular, even if the conductive wire 9 is slightly deviated, as long as the spacing is appropriate, the structure will always be the same as that shown in Fig. 2C, making it easy to fix with conductive adhesive or solder metal. Therefore, the fixing area 11 can be widened.
電気的、機械的に固着した後に発光ダイオードチツプ７
及び発光ダイオードチツプ７を挾持している導電線９の
一部分を透明な合成樹脂でモールドする。After being electrically and mechanically fixed, the light emitting diode chip 7
A part of the conductive wire 9 holding the light emitting diode chip 7 is molded with a transparent synthetic resin.
モールドする場合にはテープ状絶縁体１０によって連結
されている多数組の発光ダイオードチツプ１と導電線９
との組合せを同時にエボキシ樹脂材に浸漬する事によっ
て多数組のランプを形成することができる。In the case of molding, multiple sets of light emitting diode chips 1 and conductive wires 9 are connected by tape-shaped insulators 10.
A large number of sets of lamps can be formed by simultaneously immersing a combination of lamps into an epoxy resin material.
モールド後もテープ状の絶縁体１０によって多数のラン
プが連結されているので点灯チェックや保管及び運搬に
非常に便利である。Since a large number of lamps are connected by the tape-shaped insulator 10 even after molding, it is very convenient to check lighting, store, and transport.
使用時にはテープ状の絶縁体１０を各ランプ間で切断し
て用いる事ができ、なお各ランプの一対の導電線９は絶
縁体１０によって一体化されているので、従来のランプ
の根元に於ける短絡及び断線はなくなる。When in use, the tape-shaped insulator 10 can be cut between each lamp, and since the pair of conductive wires 9 of each lamp are integrated by the insulator 10, it can be used at the base of the conventional lamp. Short circuits and disconnections are eliminated.
またテープ状の絶縁体１０の一片に穴又は切欠きを予め
設けておく事によってランプをネジ等で固定する場合の
取付具とする事ができる。Further, by providing a hole or notch in advance in one piece of the tape-shaped insulator 10, it can be used as a fixture for fixing a lamp with a screw or the like.
上記例では導電線９は２本組でテープ状の絶縁体によっ
て保持されているが、各導電線９を均一な間隔で構威し
ても良いし、１本毎に太さを変えたり、一対の導電線９
の一方のテープ状の絶縁体１０上にマークをつける事に
よって導電線９の極性を示すことができる。In the above example, the conductive wires 9 are held in pairs by a tape-like insulator, but the conductive wires 9 may be arranged at uniform intervals, or the thickness may be changed for each conductive wire, A pair of conductive wires 9
The polarity of the conductive wire 9 can be indicated by making a mark on one of the tape-shaped insulators 10.
また上記例では導電線９間と発光ダイオードチツプ１の
厚さとが異なっているが、同一寸法のテープ状電線を形
或する事によってより簡便にランプを製造することがで
きる。Further, in the above example, the thickness between the conductive wires 9 and the thickness of the light emitting diode chip 1 are different, but by forming tape-shaped wires of the same size, the lamp can be manufactured more easily.
上述の如く、本発明は少なくとも２本の導電線をテープ
状の絶縁体によって保持してテープ状電線とし、ＰＮ接
合面に平行な面に電極を有して上記テープ状電線の一対
の導電線間にその電極面が接触するように発光ダイオー
ドチップを挿入し、電極と導電線とを電気的に接続した
後、発光ダイオードチップ及び発光ダイオードチップを
挾持している導電線の部分を透明な合成樹脂体で被覆し
てなるもので、製造しやすいだけでなく、電気的機械的
に安定したものが得られる。As described above, the present invention provides a tape-shaped electrical wire by holding at least two conductive wires with a tape-shaped insulator, and a pair of electrically conductive wires of the tape-shaped electrical wire having an electrode on a plane parallel to the PN junction surface. After inserting a light emitting diode chip between the LED chips so that their electrode surfaces are in contact with each other, and electrically connecting the electrode and the conductive wire, the light emitting diode chip and the conductive wire holding the light emitting diode chip are made into a transparent composite. Since it is coated with a resin body, it is not only easy to manufacture, but also electrically and mechanically stable.
第１図は従来例を示す図、第２図は本発明の実施例に係
る発光ダイオードランプを示す図である。
図において、７は発光ダイオードチップ、８はテープ状
電線、９は導電線、１０はテープ状の絶縁体である。FIG. 1 is a diagram showing a conventional example, and FIG. 2 is a diagram showing a light emitting diode lamp according to an embodiment of the present invention. In the figure, 7 is a light emitting diode chip, 8 is a tape-shaped electric wire, 9 is a conductive wire, and 10 is a tape-shaped insulator.
Claims (1)
て保持してテープ状電線とし、ＰＮ接合面に平行な面に
電極を有して上記テープ状電線の一対の導電線間にその
電極面が接触するように発光ダイオードチップを挿入し
、電極と導電線とを電気的に接続した後、発光ダイオー
ドチップ及び発光ダイオードチップを挾持している導電
線の部分を透明な合成樹脂体で被覆する事を特徴とする
発光ダイオードランプの製造方法。1 At least two conductive wires are held by a tape-shaped insulator to form a tape-shaped electric wire, and an electrode is provided on a plane parallel to the PN junction surface, so that the electrode surface is between the pair of conductive wires of the tape-shaped electric wire. After inserting the light emitting diode chip so that they are in contact and electrically connecting the electrode and the conductive wire, cover the light emitting diode chip and the part of the conductive wire holding the light emitting diode chip with a transparent synthetic resin body. A method of manufacturing a light emitting diode lamp characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58001534A JPS5847876B2 (en) | 1983-01-07 | 1983-01-07 | Manufacturing method of light emitting diode lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58001534A JPS5847876B2 (en) | 1983-01-07 | 1983-01-07 | Manufacturing method of light emitting diode lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58130583A JPS58130583A (en) | 1983-08-04 |
| JPS5847876B2 true JPS5847876B2 (en) | 1983-10-25 |
Family
ID=11504182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58001534A Expired JPS5847876B2 (en) | 1983-01-07 | 1983-01-07 | Manufacturing method of light emitting diode lamp |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5847876B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| PL2175457T3 (en) * | 2008-10-09 | 2012-09-28 | Joinset Co Ltd | Ceramic chip assembly |
-
1983
- 1983-01-07 JP JP58001534A patent/JPS5847876B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58130583A (en) | 1983-08-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100967192B1 (en) | Flexible rod light device formed of chip on board based led lamps and manufacturing method thereof | |
| US3694902A (en) | Electroluminescent display apparatus | |
| JPH11307820A (en) | Surface mount led and its manufacture | |
| JPH11163419A (en) | Light-emitting device | |
| US20040007981A1 (en) | Chained led light source structure | |
| JPH06177435A (en) | Light-emitting diode and its mounting method | |
| US11049849B2 (en) | Arrangement of LEDs on a leadframe | |
| JPS5847876B2 (en) | Manufacturing method of light emitting diode lamp | |
| JP2535786Y2 (en) | Light emitting display | |
| KR100592328B1 (en) | Method of manufacturing light emitting diode module and light emitting diode module | |
| US3867666A (en) | High density light emitting diode array | |
| JPH09214002A (en) | Surface packaged led device and its fabrication method | |
| JPH0465465U (en) | ||
| JPS63174379A (en) | Luminous display device | |
| JP2506452Y2 (en) | Side emitting display | |
| JPS5843235Y2 (en) | DHD type diode | |
| KR200181152Y1 (en) | Led lamp having female lead on pcb | |
| CN211084023U (en) | Insulation system of ceiling lamp | |
| JPS62134945A (en) | Molded transistor | |
| JPH10208515A (en) | Lighting fixture for vehicle | |
| JPS62106488A (en) | Display unit using light emitting diode | |
| KR820000835Y1 (en) | Dhd type diode | |
| JPH02191378A (en) | Photoelectric element, manufacture thereof and drive device therefor | |
| JPH0414944Y2 (en) | ||
| JPH0116125Y2 (en) |