JPS5847789B2 - Bubble package bias magnetic field setting method - Google Patents
Bubble package bias magnetic field setting methodInfo
- Publication number
- JPS5847789B2 JPS5847789B2 JP3785778A JP3785778A JPS5847789B2 JP S5847789 B2 JPS5847789 B2 JP S5847789B2 JP 3785778 A JP3785778 A JP 3785778A JP 3785778 A JP3785778 A JP 3785778A JP S5847789 B2 JPS5847789 B2 JP S5847789B2
- Authority
- JP
- Japan
- Prior art keywords
- magnetic field
- bubble
- package
- bias magnetic
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Description
【発明の詳細な説明】
本発明は、記憶装置等に利用される磁気バブル装置の特
に周辺回路を除く全体を樹脂でモールド或形したパッケ
ージタイプの磁気バブル装置（以下略してバブルパッケ
ージと称する）のバイアス磁界設定方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a package type magnetic bubble device (hereinafter simply referred to as a bubble package) in which the entire magnetic bubble device used in storage devices and the like is molded or shaped with resin except for the peripheral circuitry. The present invention relates to a bias magnetic field setting method.
磁気バブル装置は、情報処理システムにおけるファイル
メモリとして将来の適用が期待されている。Magnetic bubble devices are expected to be used in the future as file memories in information processing systems.
また一方では、一般の抵抗、トランジスタ等の電気部品
と同様に印刷配線板上に搭載される比較的小容量の所謂
バブルパッケージと称されるものの開発も進められてい
る。On the other hand, progress is being made in the development of a so-called bubble package, which has a relatively small capacity and is mounted on a printed wiring board in the same way as general electrical components such as resistors and transistors.
本発明は、後者のバブルパッケージに関するものである
。The present invention relates to the latter bubble package.
バブルパッケージは通常磁気バブルを保有し情報の蓄積
伝播を行なうバブルチップと、これを支持する搭載プレ
ーンと、バブルチップの面内方向において回転する回転
磁界発生用コイルと、さらにその外側にバブルチップ面
に対し垂直方向の磁界を印加するためのバイアス磁界発
生用永久磁石を備えて構戊される。Bubble packages usually include a bubble chip that stores and transmits information by holding magnetic bubbles, a mounting plane that supports this, a rotating magnetic field generating coil that rotates in the in-plane direction of the bubble chip, and a bubble chip surface outside the bubble chip. The structure includes a permanent magnet for generating a bias magnetic field for applying a magnetic field perpendicular to the magnetic field.
そしてさらにその外側にはシールドケースが配置される
。Further, a shield case is arranged outside of the shield case.
このように構或されてなるバブルパッケージは、印刷配
線板上に搭載されてパッケージ近傍に配置された回転磁
界発生回路、ゲート制御回路、タイミングクロツク制御
回路等からの信号を受けて所定の動作を行ない、所望の
信号を感知回路へ送出する。The bubble package constructed in this manner is mounted on a printed wiring board and receives signals from a rotating magnetic field generating circuit, a gate control circuit, a timing clock control circuit, etc. placed near the package to perform predetermined operations. and sends the desired signal to the sensing circuit.
さて、このバブルパッケージのバイアス磁界発生用永久
磁石は、バブルチップを挾む位置に設けられた強磁性体
を前述の各種構或部品が組立てられ、全体を樹脂でモー
ルドしたのちに着磁すること区よって得られる。Now, the permanent magnet for generating the bias magnetic field of this bubble package is made by assembling the above-mentioned ferromagnetic material between the bubble chips and molding the entire structure with resin, and then magnetizing it. Obtained by ward.
強磁性体の着磁は、モールド樹脂内に埋込まれた強磁性
体を外部から例えば１０キロガウス（ ＫＧａｕｓｓ
）程度の強磁界をかけて飽和させ、然る後に逆磁界を印
加してバブルチップに対して予め求められた最適バイア
ス磁界値近辺に設定されるよう制御して行なわれる。To magnetize a ferromagnetic material, the ferromagnetic material embedded in a molded resin is externally magnetized with, for example, 10 kilogauss (KGauss).
) is applied to saturate the bubble chip, and then a reverse magnetic field is applied to control the bubble chip so that it is set near the optimum bias magnetic field value determined in advance.
しかし、実際にはこの一回の着磁作業でバブルチップの
個々に適合した最適バイアス磁界値を設定することは事
実上不可能である。However, in reality, it is virtually impossible to set the optimum bias magnetic field value suitable for each bubble chip in this one-time magnetization operation.
そこで従来のバブルパッケージにおいては、先ず上述の
着磁作業を行なって目標とするバイアス磁界を概ね設定
した後、予めパッケージ内に組込まれた動作試験のため
のイニシャルコイルを用い、このイニシャルコイルに供
給する電流値を変化させることによってパッケージ個々
の最適バイアス磁界値を求め、この値をもとにバイアス
磁界を発生する強磁性体の着挾量を再び調整することが
行われている。Therefore, in conventional bubble packages, after first performing the above-mentioned magnetization work to roughly set the target bias magnetic field, an initial coil for operation tests that is built into the package in advance is used to supply electricity to this initial coil. The optimal bias magnetic field value for each package is determined by changing the current value, and the amount of the ferromagnetic material that generates the bias magnetic field is adjusted again based on this value.
しかし、この従来の方法は、本来パッケージ構或部品と
して不要なイニシャルコイルがバイアス磁界設定だけの
ためにパッケージに内蔵されており、構或部品の増加だ
けでなくパッケージ重量の増大を招来していた。However, in this conventional method, an initial coil, which is originally unnecessary as a component of the package structure, is built into the package only for setting the bias magnetic field, which not only increases the number of structural components but also increases the weight of the package. .
本発明の目的は上述の欠点を除去すること、すなわち小
型、軽量のバブルパッケージを実現することにある。The object of the invention is to eliminate the above-mentioned drawbacks, namely to realize a small and lightweight bubble package.
本発明の目的は、バブルチップと、該パブルチツプの搭
載プレーンと、該バブルチップの面内方向に回転する回
転磁界の発生用コイルと、該コイルの外側に配置され且
つ該バブルチップ面とほぼ垂直な方向のバイアス磁界を
印加する強磁性体を着磁して形威された永久磁石と、該
永久磁石の外側に配置されたシールドケースとを少なく
とも具備したバブルパッケージにおいて、前記パッケー
ジ組立後に前記パッケージ内の前記シールドケースと前
記バブルチップとの間で且つ前記搭載プレーンのチップ
搭載面とほぼ水平な方向の両側に、前記バブルチップを
挾むように対向配置された対の貫通孔を設けると共に、
前記バブルチップ面にほぼ垂直な方向に磁界を印加する
ための動作試験用線材を前記貫通孔を通して前記パッケ
ージに回装させた後、前記バブルチップを実際に作動さ
せながら該線材に供給する電流値を変化させて前記バブ
ルチップ面への垂直磁界値を変化させることにより、前
記バブルチップの動作マージン上限値と下限値との略中
央の最適バイアス磁界値を検知し、しかる後前記線材を
取り除くと共に検知された前記最適バイアス磁界値をと
もに再び前記強磁性体の着磁量を調整して前記パッケー
ジのバイアス磁界を設定することを特徴としたバブルパ
ッケージのバイアス磁界設定方法の提供により達或され
る。An object of the present invention is to provide a bubble chip, a mounting plane for the bubble chip, a coil for generating a rotating magnetic field that rotates in the in-plane direction of the bubble chip, and a coil disposed outside the coil and substantially perpendicular to the surface of the bubble chip. In the bubble package, the bubble package includes at least a permanent magnet formed by magnetizing a ferromagnetic material to which a bias magnetic field is applied in a direction, and a shield case disposed outside the permanent magnet. A pair of through holes are provided between the shield case and the bubble chip in the mounting plane and on both sides in a direction substantially horizontal to the chip mounting surface of the mounting plane, and are arranged oppositely so as to sandwich the bubble chip;
After an operation test wire for applying a magnetic field in a direction substantially perpendicular to the surface of the bubble chip is inserted into the package through the through hole, a current value is supplied to the wire while actually operating the bubble chip. By changing the perpendicular magnetic field value to the surface of the bubble chip, an optimum bias magnetic field value approximately in the middle between the upper and lower limit values of the operating margin of the bubble chip is detected, and then the wire is removed and This is achieved by providing a method for setting a bias magnetic field for a bubble package, characterized in that the bias magnetic field of the package is set by adjusting the amount of magnetization of the ferromagnetic material again based on the detected optimum bias magnetic field value. .
以下に本発明を図面を用いて詳述する。The present invention will be explained in detail below using the drawings.
第１図は本発明を適用したバブルパッケージを示し、同
図ａは斜視図、ｂは断面図、Ｃは側面図である。FIG. 1 shows a bubble package to which the present invention is applied; FIG. 1A is a perspective view, FIG. 1B is a sectional view, and C is a side view.
図において、１はバブルパッケージ、２は接続端子、３
は貫通孔、４はシールドケース、５はモールド樹脂であ
る。In the figure, 1 is a bubble package, 2 is a connection terminal, and 3 is a bubble package.
4 is a through hole, 4 is a shield case, and 5 is a molded resin.
また第２図は、本発明に適用される動作試験用線材の一
実施例である。Further, FIG. 2 shows an example of a wire for operation testing applied to the present invention.
図において、６は動作試験用線材、７はコの字形導体、
８はＩ字形導体である。In the figure, 6 is a wire for operation testing, 7 is a U-shaped conductor,
8 is an I-shaped conductor.
さらに第３図は、本発明に適用される動作試験用線材の
他の実施例であり、図中の番号は第２図のものを延用し
ている。Furthermore, FIG. 3 shows another embodiment of the wire rod for operation testing applied to the present invention, and the numbers in the figure are the same as those in FIG. 2.
第１図のバブルパッケージのバイアス磁界の設定は次の
ようにして行なわれる。The bias magnetic field of the bubble package shown in FIG. 1 is set as follows.
先ず、バブルパッケージ１のバブルチップを挾みバブル
チップ搭載面の同一面内の対向する２辺に形或された貫
通孔３に第２図に示す動作試験用線材６を挿入したのち
、コの字形導体７の一端に回動自在に接続された■字形
導体８を同図中矢印方向に回動させる。First, after holding the bubble chip of the bubble package 1 and inserting the operation test wire 6 shown in FIG. The square conductor 8 rotatably connected to one end of the square conductor 7 is rotated in the direction of the arrow in the figure.
然る後、図示されざる電流供給源に線材６の両端を接続
してバイアス磁界設定のためのバイアス磁界発生用電流
を流す。Thereafter, both ends of the wire 6 are connected to a current supply source (not shown), and a bias magnetic field generating current for setting a bias magnetic field is passed.
このとき既に前述のようにパッケージ１内のバイアス磁
界発生用の強磁性体は予め定められた目標のバイアス磁
界値に概ね着磁されていることは勿論である。At this time, it goes without saying that the ferromagnetic material for generating the bias magnetic field within the package 1 has already been magnetized to approximately the predetermined target bias magnetic field value as described above.
ここでバイアス磁界の設定の手順を第４図を用いて説明
する。Here, the procedure for setting the bias magnetic field will be explained using FIG. 4.
図中、横軸ＨＲ，は回転磁界を示し、縦軸ＨＢはバイア
ス磁界を示しており、同図は所謂動作マージン特性曲線
と呼ばれるものである。In the figure, the horizontal axis HR indicates the rotating magnetic field, and the vertical axis HB indicates the bias magnetic field, and the figure is what is called a so-called operating margin characteristic curve.
さて、そのバブルパッケージに最適なバイアス磁界を設
定する場合、前述した方法でパッケージ内の強磁性体を
着磁してある値、例えば図中番号１で示すＨＢ１にバイ
アス磁界を設定する。Now, when setting the optimum bias magnetic field for the bubble package, the ferromagnetic material in the package is magnetized by the method described above and the bias magnetic field is set to a certain value, for example, HB1 indicated by number 1 in the figure.
次に第２図に示す動作試験用線材６に対し、バイアス磁
界と逆方向の磁界が印加される方向に電流を供給しバブ
ルチップを実際に作動させながら除々にバイアス磁界値
を下げる。Next, a current is supplied to the operation test wire 6 shown in FIG. 2 in a direction in which a magnetic field in the opposite direction to the bias magnetic field is applied, and the bias magnetic field value is gradually lowered while actually operating the bubble chip.
バブルチップ内の磁気バブルが誤動作しなくなる点（図
中番号２点）をＨ さらにバイアス磁界値を下げ再
び誤動作Ｂ２％
し始める点く図中番号４点〕をＨＢ４とし、夫々を動作
マージンの上限値、下限値とする。The point at which the magnetic bubble in the bubble chip no longer malfunctions (numbered 2 points in the figure) is defined as H, and the point at which the bias magnetic field value is further lowered and the malfunction starts again (B2%) is defined as HB4, and each is defined as the upper limit of the operating margin. value, lower limit value.
ここで動作試験用線材の磁界効率を予め求めておけば、
バイアス磁界値ＨＢ１からどのくらい下げればバイアス
磁界値Ｈ １すなわち動作マージン曲線Ｂ３
の略中夫に設定できるかどうかを知ることができる。If the magnetic field efficiency of the operation test wire is determined in advance,
It is possible to know how much the bias magnetic field value HB1 needs to be lowered to set the bias magnetic field value H1, that is, approximately in the middle of the operating margin curve B3.
。そしてこの検知した結果に基いて再びパッケージ内の
バイアス磁界印加用の強磁性体の着磁量を調整すること
で、そのパッケージに最適のバイアス磁界を設定するこ
とができる。. Then, by adjusting the amount of magnetization of the ferromagnetic material for applying the bias magnetic field in the package again based on the detected result, it is possible to set the optimum bias magnetic field for the package.
本発明によれば、バイアス磁界設定のための動作試験用
線材は、上述のパッケージ動作試験終了後、パッケージ
１から除去される。According to the present invention, the operation test wire for setting the bias magnetic field is removed from the package 1 after the above-mentioned package operation test is completed.
動作試験用線材６に比較的小さな電流を供給したい場合
は、第３図に示すようにコの字形導体７，■字形導体８
を夫々多量に積層した導体を用意する。If you want to supply a relatively small current to the operation test wire 6, use the U-shaped conductor 7 and the ■-shaped conductor 8 as shown in Figure 3.
Prepare a conductor in which a large amount of each of these is laminated.
第３図に示す動作試験用線材は同図ｂから明らかなよう
に、最上層のコの字形導体の終端Ｂと次の層のコの字形
導体の始端Ｃを■字形導体で結び、同様にそのコの字形
導体の終端Ｄと次の層のコの字形導体の始端Ｅを次の層
の■字形導体で接続してらせん状導体を形戊している。As is clear from Figure 3b, the wire for the operation test shown in Figure 3 connects the terminal end B of the U-shaped conductor on the top layer and the starting end C of the U-shaped conductor on the next layer with a ■-shaped conductor, and similarly A spiral conductor is formed by connecting the terminal end D of the U-shaped conductor and the starting end E of the U-shaped conductor in the next layer with the ■-shaped conductor in the next layer.
多量のコの字形、■字形各導体は絶縁体層を介して多数
積層することで容易に製造できる。A large amount of U-shaped and ■-shaped conductors can be easily manufactured by laminating a large number of conductors with insulating layers interposed therebetween.
またコの字形導体の端部と■字形導体の端部の接続は、
例えば夫夫の導体層と絶縁体層に凹凸を設ける、あるい
は位置決め用基準孔を設ける等種々の手段を採り得る。Also, the connection between the end of the U-shaped conductor and the end of the ■-shaped conductor is as follows.
For example, various methods can be used, such as providing unevenness on the conductor layer and insulating layer of the husband, or providing reference holes for positioning.
第５図は、第１図に示すパッケージの中央断面図を示す
。FIG. 5 shows a central sectional view of the package shown in FIG.
図中９は磁気パ゜ブルチップ、１０はチップ搭載プレー
ンである。In the figure, reference numeral 9 indicates a magnetic double chip, and reference numeral 10 indicates a chip mounting plane.
以上説明したように、本発明によれば小型・軽量で且つ
動作マージンめ広い安定した高信頼性バブルパッケージ
を実現することができる。As described above, according to the present invention, it is possible to realize a stable and highly reliable bubble package that is small, lightweight, and has a wide operating margin.
第１図は本発明のバブルパッケージを示し、同図ａは斜
視図、同図ｂは断面図、同図Ｃは側面図である。
第２図、第３図は本発明のパフルパッケージに適用され
る動作試験用線材の各実施例、第４図はバイアス磁界設
定のための動作マージン特性曲線、第５図は第１図のパ
ッケージの中央断面図を示す。
図において、１はバブルパッケージ、２は接続端子、３
は貫通孔、４はシールドケース、５はモールド樹脂、６
は動作試験用線材である。FIG. 1 shows a bubble package of the present invention, in which FIG. 1A is a perspective view, FIG. 1B is a sectional view, and FIG. 1C is a side view. Figures 2 and 3 show examples of operation test wires applied to the puffle package of the present invention, Figure 4 shows the operating margin characteristic curve for bias magnetic field setting, and Figure 5 shows the package of Figure 1. shows a central sectional view of. In the figure, 1 is a bubble package, 2 is a connection terminal, and 3 is a bubble package.
is a through hole, 4 is a shield case, 5 is a molded resin, 6
is the wire for operation testing.
Claims (1)
、該バブルチップの面内方向に回転する回転磁界の発生
用コイルと、該コイルの外側に配置され且つ該バブルチ
ップ面とほぼ垂直な方向のバイアス磁界を印加する強磁
性体を着磁して形或された永久磁石と、該永久磁石の外
側に配置されたシールドケースとを少なくとも具備した
バブルパッケージにおいて、前記パッケージ内の前記シ
ールドケースと前記バブルチップとの間で且つ前記搭載
プレーンのチップ搭載面とほぼ水平な方向の両側に、前
記バブルチップを挾むように対向配置された対の貫通孔
を設けると共に、前記パツケージ組立後に前記バブルチ
ップ面にほぼ垂直な方向に磁界を印加するための動作試
験用線材を前記貫通孔を通して前記パッケージに回装さ
せた後、前記バブルチップを実際に作動させながら該線
材に供給する電流値を変化させて前記バブルチップ面へ
の垂直磁界値を変化させることにより、前記バブルチッ
プの動作マージン上限値と下限値との略中夫の最適バイ
アス磁界値を検知し、しかる後前記線材を取り除くと共
に検知された前記最適バイアス磁界値をもとに再び前記
強磁性体の着磁量を調整して前記パッケージのバイアス
磁界を設定することを特徴としたバブルパッケージのバ
イアス磁界設定方法。 ２ 特許請求の範囲第１項のバイアス磁界設定方法にお
いて、上記動作試験用線材はコの字形導体と、該コの字
形導体の一端に回動自在に支持されたＩ字形導体とより
構或されてなることを特徴とするバブルパッケージのバ
イアス磁界設定方法。 ３ 特許請求の範囲第２項記載のバイアス磁界設定方法
において、上記コの字形導体、■字形導体は多重に積層
されたらせん状導体で構戊されてなることを特徴とする
バブルパッケージのバイアス磁界設定方法。[Scope of Claims] 1. A bubble chip, a plane on which the bubble chip is mounted, a coil for generating a rotating magnetic field that rotates in the in-plane direction of the bubble chip, and a plane arranged outside the coil and connected to the surface of the bubble chip. In a bubble package, the bubble package includes at least a permanent magnet formed by magnetizing a ferromagnetic material that applies a bias magnetic field in a substantially perpendicular direction, and a shield case disposed outside the permanent magnet. A pair of through holes are provided between the shield case and the bubble chip and on both sides of the mounting plane in a direction substantially horizontal to the chip mounting surface, and are arranged oppositely so as to sandwich the bubble chip, and after the package cage is assembled, After an operation test wire for applying a magnetic field in a direction substantially perpendicular to the surface of the bubble chip is inserted into the package through the through hole, a current value is supplied to the wire while actually operating the bubble chip. By changing the perpendicular magnetic field value to the surface of the bubble chip, an optimum bias magnetic field value approximately halfway between the upper and lower limit values of the operating margin of the bubble chip is detected, and then the wire is removed. A method for setting a bias magnetic field for a bubble package, characterized in that the bias magnetic field of the package is set by adjusting the amount of magnetization of the ferromagnetic material again based on the optimum bias magnetic field value detected at the same time. 2. In the method for setting a bias magnetic field according to claim 1, the operation test wire comprises a U-shaped conductor and an I-shaped conductor rotatably supported at one end of the U-shaped conductor. A method for setting a bias magnetic field for a bubble package, which is characterized by the following: 3. The bias magnetic field setting method for a bubble package according to claim 2, wherein the U-shaped conductor and the ■-shaped conductor are composed of multiple laminated spiral conductors. Setting method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3785778A JPS5847789B2 (en) | 1978-03-31 | 1978-03-31 | Bubble package bias magnetic field setting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3785778A JPS5847789B2 (en) | 1978-03-31 | 1978-03-31 | Bubble package bias magnetic field setting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54129935A JPS54129935A (en) | 1979-10-08 |
| JPS5847789B2 true JPS5847789B2 (en) | 1983-10-25 |
Family
ID=12509205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3785778A Expired JPS5847789B2 (en) | 1978-03-31 | 1978-03-31 | Bubble package bias magnetic field setting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5847789B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5556607A (en) * | 1978-10-20 | 1980-04-25 | Nec Corp | Magnetizing method of magnetic bubble module and its magnetizing device |
-
1978
- 1978-03-31 JP JP3785778A patent/JPS5847789B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS54129935A (en) | 1979-10-08 |
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