JPS584141A - Photosensitive laminate and using method for it - Google Patents
Photosensitive laminate and using method for itInfo
- Publication number
- JPS584141A JPS584141A JP10260781A JP10260781A JPS584141A JP S584141 A JPS584141 A JP S584141A JP 10260781 A JP10260781 A JP 10260781A JP 10260781 A JP10260781 A JP 10260781A JP S584141 A JPS584141 A JP S584141A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- photosensitive
- photoresist
- film
- polyvinyl alcohol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、プリント配線板、平板印刷板等の製造に用い
られるフォトレジスト感光層を有する感光性積層体及び
その使用方法に係る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a photosensitive laminate having a photoresist photosensitive layer used for manufacturing printed wiring boards, lithographic printing plates, etc., and a method for using the same.
プリント配線板、平板印刷板等の製造に用いられる従来
のフォトレジスト感光層を有する感光性積層体に於いて
は、該感光層を支持し、オリジナルバメーンのネガティ
ブ像又はポジティブ像を密着露光後にこれらの像の攻り
外しを容易にし、且つ感光層が空気中に露出されて酸素
吸着による感光性材料の変質を防止する目的でフォトレ
ジスト感光層に対して接着性の余り大きくない支持層例
えばポリエチレンテレフタレートフィルムがフォトレジ
スト感光層の一方の面に接着して使用されている。又ス
オトレジスト感光層上にポリエチレンテレフタレート支
持層を設けた感光性積層体を積み重ね又はロール状に巻
いて保存する場合、感光性積層体のブロッキングを防止
する目的で、ポリオレフィン又はポリハロゲン化ビニリ
デン等のフィルムを保賎層として、ポリエチレンテレフ
タレートフィルム支持層がａｙｅｓれたフォトレジスト
感光層の他方の面に上記保護層を設けるか、又はポリエ
チレンテレフタレートフィルム支持層上に保護層を設け
たものが用いられて来た。In a photosensitive laminate having a conventional photoresist photosensitive layer used for manufacturing printed wiring boards, lithographic printing plates, etc., the photosensitive layer is supported and a negative or positive image of the original component is formed after contact exposure. In order to make it easier to transfer these images and to prevent the photosensitive layer from being exposed to the air and deteriorating the quality of the photosensitive material due to oxygen adsorption, a support layer that is not very adhesive to the photoresist photosensitive layer is used, for example. A polyethylene terephthalate film is used adhered to one side of the photoresist photosensitive layer. In addition, when storing a photosensitive laminate in which a polyethylene terephthalate support layer is provided on a photoresist photosensitive layer by stacking or winding it into a roll, a film of polyolefin or polyvinylidene halide is used to prevent blocking of the photosensitive laminate. As a protective layer, the above protective layer is provided on the other side of the photoresist photosensitive layer on which the polyethylene terephthalate film support layer is attached, or the protective layer is provided on the polyethylene terephthalate film support layer. Ta.
これら従来の感光性積層体においては、露光後に現像す
るに当って支持層であるポリエチレンテレフタレートフ
ィルムは剥離除去されていた。実際のプリント基板等の
製造工程では極めて多数のプリント基板等の１枚１枚か
ら前記支持フィルムを剥離してから現像液に投入される
ために、非常な手数を要し非能率的であり、又前記支持
フィルムの剥離時に露光された感光性樹脂面に傷が生じ
晶く、更に剥離した支持フィルムの廃棄処ＩＩＫ於いて
手数がかかり、現像作業の自動化が困難である等多くの
欠点があった。In these conventional photosensitive laminates, the polyethylene terephthalate film serving as the support layer was peeled off and removed during development after exposure. In the actual manufacturing process of printed circuit boards, etc., the support film is peeled off one by one from an extremely large number of printed circuit boards, etc., and then the supporting film is put into the developer, which is extremely time-consuming and inefficient. In addition, there are many drawbacks, such as scratches and crystallization on the exposed photosensitive resin surface when the support film is peeled off, and furthermore, it is time-consuming to dispose of the peeled support film, and it is difficult to automate the development process. Ta.
本発明は、従来の現像設備を大幅に変更することなく、
且つ支持フィルムをいちいち剥離する必要がないため現
像工程の自動化が可能である感光性積層体を提供するこ
とを目的とする。The present invention does not require major changes to conventional developing equipment.
Another object of the present invention is to provide a photosensitive laminate in which the development process can be automated since there is no need to peel off the support film one by one.
本発明の感光性積層体は、フォトレジスト感光層及び水
溶性支持層から成る。The photosensitive laminate of the present invention comprises a photoresist photosensitive layer and a water-soluble support layer.
本発明において使用するフォトレジスト感光層は従来公
知のソルベント！イブのものでよく、ベースポリマー、
光重合性不飽和化合物、光重合開始剤等を含有する。ベ
ースポリマーとしては、ポ゛リメチルメタクリレート、
塩素化ポリスチレン、セルロース誘導体、メタクリレー
ト−スチレン共重合体等が例示できる。光重合性不飽和
化合物としては、例えば、アクリレート、メタクリレー
トが例示できる。光重合開始剤としては、過酸化物、染
料等を添加し得る。The photoresist photosensitive layer used in the present invention is a conventionally known solvent! Eve's base polymer,
Contains a photopolymerizable unsaturated compound, a photopolymerization initiator, etc. Base polymers include polymethyl methacrylate,
Examples include chlorinated polystyrene, cellulose derivatives, and methacrylate-styrene copolymers. Examples of the photopolymerizable unsaturated compound include acrylate and methacrylate. Peroxides, dyes, etc. may be added as photopolymerization initiators.
本発明において使用する水溶性支持層は、ポリビニルア
ルコールフィルムから成り、咳フィルムは水溶性である
ために、フォトレジスト感光層から剥離せずに水洗除去
が可能である。The water-soluble support layer used in the present invention is made of a polyvinyl alcohol film, and since the cough film is water-soluble, it can be removed by washing with water without peeling off from the photoresist photosensitive layer.
前記水溶性ポリビニルアルコールフィルムは、ケン化度
９５〜９８−好ましくは９６〜９丁−で且つ重合度５０
０〜２５０Ｇ好ましくは１８００〜１８００である。本
発明の感光性積層体は、プリント配線板等の製造時画像
形成用固体表面に通常緊彊下加熱加圧接着により積層さ
れるため適度な引張強度を必要とする。上記範囲のケン
化度及び重合度を有するポリビニルアルコールフィルム
は、３３０〜４００ｋｇ／ｃｍの引張強度を有する。尚
この強度を１２０℃、相対湿度＠Ｓ−での値である。ケ
ン化度が９！Ｉ−未満であると、ｒ＆湿性が大きくなり
フィルム保存中に吸湿膨潤し強度低下をきたし、Ｓ＠哄
な超えると常温の水に博は難くなる。又、重合度力ｔｓ
ｏｏ ｆｇｓであると強度が弱くなり、２５０Ｇを超え
るとＩｍ！＃！性になる。尚この重合度は濃度４−のポ
リビニルアルコール＃１ＩＷＩＬの８０℃での粘度（ｃ
ｐｓ）から求められたものである。The water-soluble polyvinyl alcohol film has a degree of saponification of 95 to 98, preferably 96 to 9, and a degree of polymerization of 50.
0-250G, preferably 1800-1800. The photosensitive laminate of the present invention requires an appropriate tensile strength because it is usually laminated on a solid surface for image formation during manufacture of a printed wiring board or the like by heat-pressure adhesion under stress. A polyvinyl alcohol film having a degree of saponification and a degree of polymerization within the above ranges has a tensile strength of 330 to 400 kg/cm. Note that this strength is a value at 120°C and relative humidity @S-. Saponification degree is 9! If it is less than I, the r&humidity will increase and the film will absorb moisture and swell during storage, resulting in a decrease in strength.If it exceeds S@, it will be difficult to immerse in water at room temperature. In addition, the degree of polymerization force ts
If it is oo fgs, the strength will be weak, and if it exceeds 250G, Im! #! Become sexual. This degree of polymerization is determined by the viscosity (c
ps).
前記特性を有するポリビニルアルコールフィルムからな
る支持層は、前記フォトレジスト感光層に対して接着性
があり、ｍｌ、ｍｌ透過性が少なく、透明で紫外線透過
が良く、更に常温で水に可溶性であり且つ可撓性である
。The support layer made of a polyvinyl alcohol film having the above-mentioned characteristics has adhesiveness to the photoresist photosensitive layer, has low ml and ml permeability, is transparent and has good ultraviolet transmission, and is further soluble in water at room temperature. It is flexible.
支持層として使用される前記ポリビニルアルコールフィ
ルムの厚さは、支持層としての機能を果す範囲内ででき
るだけ薄い方が好まい１が、通常１０−５０μ好ましく
は２０〜３０μである。The thickness of the polyvinyl alcohol film used as a support layer is preferably as thin as possible within the range of functioning as a support layer, and is usually 10-50μ, preferably 20-30μ.
ソルベントタイプフォトレジスト感光層と前記ポリビニ
ルアルコールフィルム支持層とからなる感光性積層体を
槓み１ね、又はロール伏に壱〜１て保存する際に感光性
積層体がブロッキングを起すのを防止するためにフォト
レジスト感光層又は前記ポリビニルアルコールフィルム
支持層上の少すくともいずれか一方の面に保護層を設は
得る。To prevent blocking of the photosensitive laminate when storing the photosensitive laminate consisting of a solvent type photoresist photosensitive layer and the polyvinyl alcohol film support layer by rolling it or rolling it upside down. For this purpose, a protective layer may be provided on at least one side of the photoresist photosensitive layer or the polyvinyl alcohol film support layer.
保一層は後述のように画像形成用固体表面にフォトレジ
スト感光！−を槓１−する前、又は光像露光前に若しく
はポリビニルアルコールフィルム支持層の水洗除去前に
剥離する必要があるものであるから、前記フォトレジス
ト感光層又はポリビニル７にコールフィルム支持層と密
着性のない可撓性のフィルムであれば使用し得る。この
目的に適合するものとして、ポリエチレンテレフタレー
トフィルム、ポリオレフィンフィルム又はポリ／％クゲ
ン化ビニリデンフィルム等がある。前記ブロッキング防
止に特に有効なものはポリエチレンテレフタレートフィ
ルムである。Hoichilayer uses photoresist exposure on the solid surface for image formation as described below! Since it is necessary to peel off the photoresist photosensitive layer or the polyvinyl alcohol film support layer 7 before removing it, or before exposing the photoimage, or before removing the polyvinyl alcohol film support layer by washing with water, the photoresist photosensitive layer or the polyvinyl film support layer 7 is in close contact with the call film support layer. Any flexible, neutral film can be used. Examples suitable for this purpose include polyethylene terephthalate film, polyolefin film or poly/% vinylidene film. A polyethylene terephthalate film is particularly effective in preventing the blocking.
これらのフィルムが保護層として感光性積層体に適用さ
れるとぎは、保存時のプロツー？／グ及ｄ酸素吸着によ
るフォトレジスト感光層の変質が有羞に防止され得る。When these films are applied as a protective layer to photosensitive laminates, they are used during storage. Deterioration of the photoresist photosensitive layer due to oxygen adsorption can be significantly prevented.
本発明の感光性積層体は、フォトレジスト感光層をｉｊ
ｉ像形成用固体表面に積層し、＃Ｌｉ１ｉを介して活性
光で＃起フォトレジスト感光層を光像露光し、前記ポリ
ビニルアルコールフィルム支持層を剥離せずに水洗除去
し、その後前記フォトレジスト感光層な適当な溶媒でＭ
像して使用され得る。The photosensitive laminate of the present invention has a photoresist photosensitive layer ij
The photoresist photosensitive layer is laminated on the solid surface for image formation, and the photoresist photosensitive layer is imagewise exposed to active light through #Li1i, the polyvinyl alcohol film support layer is removed by washing with water without peeling, and then the photoresist is exposed to light. M with a suitable solvent
It can be used as an image.
この際、フォトレジスト感光層上に保護層を有する場合
は、フォトレジスト感光層を画像形成用固体表面に積層
する＃に１又、ポリビニルアルコールフィルム支持層上
に保１層を有する場合は、フォトレジスト感光層の光像
露光前に又は露光後前記ポリビニルアルコールフィルム
支持層の水洗前に、保護層を剥離して使用する。At this time, if a protective layer is provided on the photoresist photosensitive layer, the photoresist photosensitive layer is laminated on the solid surface for image formation, and if a protective layer is provided on the polyvinyl alcohol film support layer, the photoresist photosensitive layer is Before use, the protective layer is peeled off before the resist photosensitive layer is exposed to a photoimage, or after exposure and before the polyvinyl alcohol film support layer is washed with water.
本発明の感光性積層体の現像に使用される現像液は、ソ
ルベントタイプのフォトレジスト感光層を現像し得るも
のなら公矧のものが使用できるが、例えばアセトン、メ
チルエチルケトン、酢酸エチｋ、ｈａｌｆル、クロロホ
ルム、トリクロルエタン、トリクロロエチレン、 ｆｆ
ｉ塩（［２、ヘンゼン。As the developer used for developing the photosensitive laminate of the present invention, any publicly available developer can be used as long as it can develop a solvent-type photoresist photosensitive layer, and examples include acetone, methyl ethyl ketone, ethyl acetate, and , chloroform, trichloroethane, trichloroethylene, ff
i salt ([2, Hensen.
トルエン、エタノール、インプロパツール等から鴻宜選
択して使用すればよい。It may be selected from among toluene, ethanol, inproper tool, etc. and used.
従って、本発明の感光性積層体を１４揮する際には、既
存の現像装置に前処理Ｒ階として水洗設備を設置するだ
けで通用できる。更に、支持層をいちいち剥離する必要
がないため、現像の全工程を自動化でき技術的、経済的
＆Ｃ有利である。Therefore, when the photosensitive laminate of the present invention is to be processed for 14 days, it can be used simply by installing a water washing facility as a pre-treatment R floor in an existing developing device. Furthermore, since there is no need to peel off the support layer one by one, the entire development process can be automated, which is technically and economically advantageous.
以下に本発明を図面を参照し乍ら説明する。The present invention will be explained below with reference to the drawings.
第１図〜第３図には本発明の１つの具体例を示す。第１
図は本発明の感光性積層体の拡大断面図で、感光性積層
体はソルベントタイプフォトレジスト感光層１、ポリビ
ニルアル；−ルフィルム支持層２から成る。1 to 3 show one specific example of the present invention. 1st
The figure is an enlarged sectional view of the photosensitive laminate of the present invention, which comprises a solvent type photoresist photosensitive layer 1 and a polyvinyl alcohol film support layer 2.
落２図は本発明の感光性積層体をプリント配線基板又は
その類似物に積層した状態の拡大断面図である。プリン
ト配線基板は金属導電層４と基板５とからなる。プリン
ト配線基板への加熱加圧接着は従来と同様に行うことが
でき、接着温度は感光層の種類により異るが４０〜１５
０’Ｃの範囲で選択される。Figure 2 is an enlarged cross-sectional view of the photosensitive laminate of the present invention laminated on a printed wiring board or the like. The printed wiring board consists of a metal conductive layer 4 and a substrate 5. Heat and pressure adhesion to the printed wiring board can be performed in the same way as conventional methods, and the adhesion temperature varies depending on the type of photosensitive layer, but is 40 to 15
Selected in the range of 0'C.
第３図に示されるように％ポリビニルアルコールフィル
ム支持層２上のｙｉ、画フィルム６を通して活性光７で
光像露光する。As shown in FIG. 3, on the polyvinyl alcohol film support layer 2, the image is exposed to actinic light 7 through the image film 6.
露光されたプリント配線基板又はその類似物は水洗によ
りポリビニルアルコールフィルム支持層を除去する。そ
の後フォトレジスト層ｌの未露光部分をｉＡＳ液によっ
て溶解除去してフォトレジスト儂を形成する。The exposed printed wiring board or the like is washed with water to remove the polyvinyl alcohol film support layer. Thereafter, the unexposed portions of the photoresist layer 1 are dissolved and removed using an iAS solution to form a photoresist layer.
第４図に本発明のも５１つの具体例を示す。第４図は本
発明の感光性積層体の拡大断面図であり、感光性積層体
はンルベントタイプフォトレジスト感光層１、ポリビニ
ルアルコールフィルム支持層２、及びポリエチレンテレ
フタレートフィルムからなる保饅層３から成る。FIG. 4 shows 51 specific examples of the present invention. FIG. 4 is an enlarged cross-sectional view of the photosensitive laminate of the present invention, and the photosensitive laminate is composed of a bent type photoresist photosensitive layer 1, a polyvinyl alcohol film support layer 2, and a retention layer 3 made of a polyethylene terephthalate film. Become.
このサンドインチ構造を有する感光性積層体のポリエチ
レンテレフタレートフィルムからなる保一層３を剥離し
、前記第２図に示されるようにプリント配線基板又はそ
の類似物に接着する。接着方法及びプリント配線基板又
はその訓似荀の構成は前記具体例の場合と同様である。The protective layer 3 made of polyethylene terephthalate film of this photosensitive laminate having a sandwich structure is peeled off and adhered to a printed wiring board or the like as shown in FIG. 2 above. The adhesion method and the structure of the printed wiring board or its mounting plate are the same as in the above-described specific example.
第３図に示すように、ポリビニルアルコールフィルム支
持層２上に原画フィルム６が載せられ、活性光７でノル
ベントタイプフォトレジスト感光ノーが光像露光される
。ポリビニルアルコール７（ルム支持層の水洗除去□及
び未露光部分の溶解除去は前記具体例の場合と同様にし
て成就される。As shown in FIG. 3, an original film 6 is placed on a polyvinyl alcohol film support layer 2, and a norbento type photoresist is exposed to light image with active light 7. As shown in FIG. Polyvinyl alcohol 7 (removal of the lume support layer by washing with water □ and removal of the unexposed portion by dissolution are accomplished in the same manner as in the above specific example).
次に本発明を実施例により具体的に説明する。Next, the present invention will be specifically explained using examples.
実施例１
以下の化合物を含む溶液から７オトレジスト感光層（厚
さｓｉ声）を得た。Example 1 Seven photoresist photosensitive layers (thickness: 100 psi) were obtained from a solution containing the following compounds.
ポリメチルメタクリレート ｓｏｇトリメチ
ロールプ費パントリアクリレ−） ｚｏｇ２−エチ
ルアントラキノン −１ｇメチルバイオレッ
ト ０．２ｇメチルエチルケトン
２ｏｏｔこの感光層を厚さ２５μのポ
リビニルアルコールフィルム（ケン化度ＳＳ−＊ １合
度１５０Ｇ 、引張強度（２０℃、相対湿度ｓｓ％ ）
１４０ｋｇｍ” ）上に積層して本発明の感光性積層
体を得た。この感光性積層体を第２図に示すよ５に、プ
リント配線基板の銅箔４上に温度９０℃に加熱したロー
ラを用いて圧力８にシー雪で加圧積層した。Polymethyl methacrylate (sog trimethylol pantriacrylate) zog2-ethyl anthraquinone -1g methyl violet 0.2g methyl ethyl ketone
2ootThis photosensitive layer was coated with a 25μ thick polyvinyl alcohol film (saponification degree SS-*1 degree 150G, tensile strength (20℃, relative humidity ss%))
140 kgm") to obtain the photosensitive laminate of the present invention. As shown in FIG. Sea snow was laminated under pressure using a pressure 8.
次に、原画フィルム〇を載せ、超高圧水銀灯露光機（オ
ーク社製）を用いて”ＯｍＪ／ｍｌの露光をした。Ｉｌ
ｌ光後ボリビニルアルコールフイルムヲ３０℃の水でス
プレー水洗除去した。スプレー水洗でポリビニルアルコ
ールは完全に溶解除去された。Next, the original film 〇 was placed on it and exposed to light at ``OmJ/ml'' using an ultra-high pressure mercury lamp exposure machine (manufactured by Oak Co., Ltd.).
After 1 light, the polyvinyl alcohol film was removed by spray washing with water at 30°C. Polyvinyl alcohol was completely dissolved and removed by spray washing with water.
次いで、乾燥後トリクロルエタンで１分間ｆＡ儂して、
レジスト像を得た。これをエツチング処理したところ、
解像力の高い鮮明なプリント配線板が得られた。Then, after drying, rinse with trichloroethane for 1 minute,
A resist image was obtained. When this was etched,
A clear printed wiring board with high resolution was obtained.
実施例２ 以下の化合物を含む溶ｗｉ、ｔｌｌｌ製した。Example 2 A solution containing the following compounds was prepared.
スチレン−メチルメタクリレート共重合体 ８５ｇペン
タエリスリトールトリアクリレート ２０ｇ２−エ
チルアントラキノン ０１ｇビクトリアブ
ルー （１２ｇメチルエチルケト
ン ３００ｇこの溶液を厚さ４０μの
ポリエチレンテレフタレートフィルム上に塗布、乾燥し
て２０μの厚さの感光層を得た。この感光層を厚さ３０
μのポリビニルアルコールフィルム（ケｙ化度９８−１
重合度１７００ 、引張強度（２０℃、相対湿度６５％
） ３８０ｋｇＡｓ” ）上に積層して本発明の感光
性積層体を得た。この感光性積層体のポリエチレンテレ
フタレートフィルムを剥がしてから、第３図に示すよ５
に１プリント配線基板のアル建ニウム削土に温度９Ｉｓ
℃圧力２に１−で加圧積層した。Styrene-methyl methacrylate copolymer 85g Pentaerythritol triacrylate 20g 2-ethylanthraquinone 01g Victoria Blue (12g Methyl ethyl ketone 300g) This solution was coated on a 40μ thick polyethylene terephthalate film and dried to obtain a 20μ thick photosensitive layer. .This photosensitive layer has a thickness of 30 mm.
μ polyvinyl alcohol film (silicification degree 98-1
Degree of polymerization 1700, tensile strength (20℃, relative humidity 65%)
) 380 kgAs") to obtain a photosensitive laminate of the present invention. After peeling off the polyethylene terephthalate film of this photosensitive laminate, the laminate was laminated as shown in FIG.
Temperature 9Is for aluminum excavation of printed wiring board
Pressure lamination was carried out at a pressure of 2 to 1°C.
次に、原画フィルムを載せ、路光後、ポリビニルアルコ
ールフィルムラ２０℃の水でスプレー水洗除去した。次
いで、トリクｒｓａエチレンで現像してレジスト像を得
た。更にこれをエツチング処理して、実施例１と同様に
解像力の高い鮮明なプリント配線板が得られた。Next, an original film was placed on the film, and after being exposed to light, the polyvinyl alcohol film was sprayed and washed with water at 20°C. Next, a resist image was obtained by developing with tric-rsa ethylene. Further, this was subjected to an etching treatment, and as in Example 1, a clear printed wiring board with high resolution was obtained.
実施例３ 以下の化合物を含む溶液を調製した。Example 3 A solution containing the following compounds was prepared.
セルロースアセテートブチレート １５０ｇトリメ
チロールプロパントリアクリレート ２０ｇ２−メチ
ルアントラキノン １ｇビクトリアブルー
０５ｇメチルエチルケトン
３００ｇこのＳ＊を厚さ２５μのポリ
ビニルアルコールフィルム（ケン化度９７％ 、重合度
１８００ 、引張強度（２０℃、相対湿度６５％ ）
ａｓｏｋｇ／ｍ” ） 上Ｋｍ布乾燥後、上から厚さ２
０μのポリエチレンテレフタレートフィルムを積層して
全体の厚さ７０μのサンドイッチ構造の積層体を得た。Cellulose Acetate Butyrate 150g Trimethylolpropane Triacrylate 20g 2-Methylanthraquinone 1g Victoria Blue 05g Methyl Ethyl Ketone
300g of this S* was made into a 25μ thick polyvinyl alcohol film (degree of saponification 97%, degree of polymerization 1800, tensile strength (20℃, relative humidity 65%))
asokg/m") Upper Km After drying the cloth, thickness 2 from the top
A sandwich structure laminate having a total thickness of 70 μm was obtained by laminating 0 μm polyethylene terephthalate films.
この積層体のポリエチレンテレフタレートフィルムを剥
がしてから、第３図に示すよ５に、プリント配線基板の
＠削土に温度１１０℃で加圧積ノーシた。これに原画フ
ィルムを載せ、路光後、ポリビニルアルコールフィルム
を常温の水で水洗除去し、次いでアセトンで現像してレ
ジスト像を得た。更にこれをエツチング処理して実施例
１及び２と同様に解像力の高い鮮明なプリント配線板を
得た。After peeling off the polyethylene terephthalate film of this laminate, it was laminated under pressure at a temperature of 110° C. to the excavated soil of the printed wiring board as shown in FIG. An original film was placed on this, and after passing light, the polyvinyl alcohol film was removed by washing with water at room temperature, and then developed with acetone to obtain a resist image. Further, this was subjected to an etching treatment to obtain a clear printed wiring board with high resolution as in Examples 1 and 2.
第１図は本発明の具体例である感光性積層体の拡大断面
図、第２図は本発明の感光性積層体をプリント配線基板
類に積層した状態の拡大断面図、第３図は本発明の感光
性積層体を積層したプリント配線基板類を光像露光する
説明図、及び第４図は本発明のも５１つの具体例である
感光性積層体の拡大断面図である。
ｌ・・・ソルベントタイプフォトレジスト層、ト・・ポ
リビニルアルコールフィルム支持層、３・・・保鰻層、
４・・・金属導電層、５・・・基板、
６・・・原画フィルム、７・・・活性光。
ＩＦ５図
１２ｍ
１１４図FIG. 1 is an enlarged sectional view of a photosensitive laminate that is a specific example of the present invention, FIG. 2 is an enlarged sectional view of the photosensitive laminate of the present invention laminated on a printed wiring board, and FIG. 3 is an enlarged sectional view of the photosensitive laminate of the present invention. FIG. 4 is an explanatory diagram showing photoimage exposure of printed wiring boards on which the photosensitive laminate of the invention is laminated, and FIG. 4 is an enlarged cross-sectional view of the photosensitive laminate which is a specific example of the invention. 1...Solvent type photoresist layer, 3...Polyvinyl alcohol film support layer, 3...Eel protection layer,
4... Metal conductive layer, 5... Substrate,
6... Original film, 7... Active light. IF5 Figure 12m Figure 114
Claims (1)
、ケン化度９ｓ〜嘗＄−１重合度ＳＯＯ〜！Ｉ００であ
り且つ３１０〜４００ｋｇ／ｉ−の引張強度を有するポ
リビニルアルコールフィルムからなる支持層とを積層し
てなる感光性積層体。 （匍 ケン化度が９６〜９７−である特許請求の範囲第
（１）項に記載の感光性積層体。 Ｕ） 重合度が１！！００〜１８００である特許請求の
範囲第（１１項又は第（２）項に記載の感光性積層体。 （Ｊ ＠記フォトレジスト感光層及び前記ポリビニル
アルコールフィルム支持層の少なくとも一方の層上に保
鏝層を有することを特徴とする特許請求の範囲第（１）
項乃至第（３）項のいずれかに記載の感光性積層体。 （５）前記保一層がポリエチレンテレフタレートフィル
ム、ポリオレアインフィルム及びポリハロゲン化ビニリ
デンフィルムからなるグループから選択されることを特
徴とする特許請求の範囲第（４１項に記載の感光性積層
体。 （６） 特許請求の範囲第（１）項に記載の感光性積
層体のフォトレジスト感光層を画像形成用固体表面に積
層し、原画を介して活性光で前記フォトレジスト感光層
を光像路光し、前記ポリビニルアルコールフィルム支持
層を水洗除去し、その後前記フォトレジスト感光層を現
像することを特徴とする前記感光性積層体の使用方法。 （７） 前記感光性積層体が前記フォトレジスト感光
層上に保饅層を有する場合、前記フォトレジスト感光層
を画像形成用固体ａｍに積層する前に、前記保繰層を剥
離することをｌＩ＃徴とする特許請求の範囲第（６）項
に記載の方法。 体）前記感光性積層体が前記ポリビニルアルコールフィ
ルム支持層上に保線層を有する場合、前記フォトレジス
ト感光層の光蒙旙光前に又は露光後前記ポリビニルアル
コールフィルム支持層の水洗前に１前記保鏝層を剥離す
ることを特徴とする特許請求の範囲第（６）項に記載の
方法。[Claims] (!) Solvent type 7 photoresist photosensitive layer and saponification degree of 9s~$-1 polymerization degree SOO~! A photosensitive laminate comprising a support layer made of a polyvinyl alcohol film having a tensile strength of I00 and 310 to 400 kg/i-. (U) The photosensitive laminate according to claim (1), which has a degree of saponification of 96 to 97. U) A degree of polymerization of 1! ! 00 to 1800. The photosensitive laminate according to claim 11 or (2). Claim No. (1) characterized in that it has a trowel layer.
The photosensitive laminate according to any one of Items to Items (3). (5) The photosensitive laminate according to claim 41, wherein the protective layer is selected from the group consisting of polyethylene terephthalate film, polyoleain film, and polyvinylidene halide film. 6) A photoresist photosensitive layer of the photosensitive laminate according to claim (1) is laminated on a solid surface for image formation, and the photoresist photosensitive layer is exposed to optical image path light through an original image using actinic light. A method for using the photosensitive laminate, characterized in that the polyvinyl alcohol film support layer is removed by washing with water, and then the photoresist photosensitive layer is developed. (7) The photosensitive laminate is the photoresist photosensitive layer. In the case where the photoresist photosensitive layer has a preservation layer thereon, the preservation layer is peeled off before laminating the photoresist photosensitive layer on the image forming solid am. The method described above.) When the photosensitive laminate has a line-keeping layer on the polyvinyl alcohol film support layer, before or after exposure of the photoresist photosensitive layer and before washing the polyvinyl alcohol film support layer with water. The method according to claim (6), characterized in that: (1) the protective trowel layer is peeled off.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10260781A JPS584141A (en) | 1981-07-01 | 1981-07-01 | Photosensitive laminate and using method for it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10260781A JPS584141A (en) | 1981-07-01 | 1981-07-01 | Photosensitive laminate and using method for it |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS584141A true JPS584141A (en) | 1983-01-11 |
Family
ID=14331919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10260781A Pending JPS584141A (en) | 1981-07-01 | 1981-07-01 | Photosensitive laminate and using method for it |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS584141A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7312389B2 (en) | 2004-02-16 | 2007-12-25 | Yamaha Corporation | Snare strainer |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52110010A (en) * | 1976-03-12 | 1977-09-14 | Unitika Ltd | Method of preventing adhesion of photosensitive resin |
| JPS5418732A (en) * | 1977-07-12 | 1979-02-13 | Asahi Chemical Ind | Image formation |
| JPS5617348A (en) * | 1979-07-20 | 1981-02-19 | Fujitsu Ltd | Exposing method |
| JPS57205737A (en) * | 1981-06-12 | 1982-12-16 | Nippon Synthetic Chem Ind Co Ltd:The | Photosensitive laminate structure |
-
1981
- 1981-07-01 JP JP10260781A patent/JPS584141A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52110010A (en) * | 1976-03-12 | 1977-09-14 | Unitika Ltd | Method of preventing adhesion of photosensitive resin |
| JPS5418732A (en) * | 1977-07-12 | 1979-02-13 | Asahi Chemical Ind | Image formation |
| JPS5617348A (en) * | 1979-07-20 | 1981-02-19 | Fujitsu Ltd | Exposing method |
| JPS57205737A (en) * | 1981-06-12 | 1982-12-16 | Nippon Synthetic Chem Ind Co Ltd:The | Photosensitive laminate structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7312389B2 (en) | 2004-02-16 | 2007-12-25 | Yamaha Corporation | Snare strainer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3770438A (en) | Photopolymerizable transfer elements | |
| US4530896A (en) | Photosensitive laminate | |
| US4360582A (en) | Photopolymerizable element comprising a soluble or dispersible oriented film support | |
| EP0260590B1 (en) | Lamination of photopolymerizable film onto a substrate employing an intermediate nonphotosensitive liquid layer | |
| JPS5830748A (en) | Photopolymerizing print composition suitable for production of photoresist layer | |
| US4318975A (en) | Dry film multilayer photoresist element | |
| JPH06228504A (en) | Multilayer image forming permanent coating capable of aqueous treatment and usable for printed circuit | |
| CN101836162A (en) | Film type transfer material | |
| US3376138A (en) | Photosensitive prepolymer composition and method | |
| JPS63197942A (en) | Photosensitive laminate and image formation | |
| JP2750431B2 (en) | Image forming method | |
| JPS584141A (en) | Photosensitive laminate and using method for it | |
| US6207345B1 (en) | Laminate film and processes for preparing printed wiring board | |
| US4447519A (en) | Solid photoresist and method of making photoresist | |
| JP3241144B2 (en) | Photosensitive resin composition laminate, method for producing resist pattern, method for producing substrate, printed wiring board, printed wiring board and equipment | |
| JP2003050459A (en) | Photosensitive resin composition, photosensitive element, method for producing resist pattern and method for producing printed wiring board | |
| US20090191491A1 (en) | Method of Creating an Image in a Photoresist Laminate | |
| JPS5997138A (en) | Photosensitive film | |
| JPS5836331B2 (en) | Formation method of resist image | |
| JPS6410056B2 (en) | ||
| JP3409947B2 (en) | Lamination method and laminated film | |
| JPS6410055B2 (en) | ||
| KR930008133B1 (en) | Composition for sensitizer | |
| JPS593589Y2 (en) | Laminate for printed circuit formation | |
| JP3166985B2 (en) | Support for polyurethane-based photosensitive resin printing plate and polyurethane-based photosensitive resin printing plate using the support |