JPS5837991A - Device for mounting flat package electronic part - Google Patents
Device for mounting flat package electronic partInfo
- Publication number
- JPS5837991A JPS5837991A JP56136401A JP13640181A JPS5837991A JP S5837991 A JPS5837991 A JP S5837991A JP 56136401 A JP56136401 A JP 56136401A JP 13640181 A JP13640181 A JP 13640181A JP S5837991 A JPS5837991 A JP S5837991A
- Authority
- JP
- Japan
- Prior art keywords
- cage
- positioning
- electronic component
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
この発明はＩＣ、ＬＳＩ 等のフ２ットパックーゾ形
電子部品を印刷配線板に位置決め装着するフラット・臂
ツケージ形電子部品の実装装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a mounting device for flat-arm cage-type electronic components, which positions and mounts foot-pack-type electronic components such as ICs and LSIs on printed wiring boards.
フン、ドパ、ケージ形電子部品は、モールド成形した本
体部とこの周−囲に突出する多数のリード端子とから形
成されておシ、これらリード端子のピッチは非常に小さ
く小さいものでは１．２ ？ 、 ０．８ 、０．６−
等があり、リード端子の本ａ線多いものでｔｉ１辺に１
０本〜２０本以上ある。The electronic parts of the fan, dopa, and cage type are formed from a molded main body and a large number of lead terminals protruding around the main body, and the pitch of these lead terminals is very small. 2? , 0.8, 0.6-
etc., and if there are many main A wires of the lead terminal, there is one per side of ti.
There are 0 to 20 or more.
このような小形で精密に形成されたフン、）パッケージ
形電子部品を印刷配線板のΔターンに位置決めすること
は、肉眼では不可能でｓｂ、従来は顕微鏡または拡大鏡
で覗きな一１ｉｂ各リード端子をパターンに位置合せを
したのち仮止めしている。したがって、位置合せ作業に
多くの労力を費やし、リード端子が変形しているような
場合にはその修正が非常に困難であシ、作業能率が悪い
という事情があった。Positioning such a small, precision-formed, packaged electronic component in the delta turn of a printed wiring board is impossible with the naked eye, but conventionally it is impossible to see with a microscope or magnifying glass. After aligning the terminals with the pattern, they are temporarily fastened. Therefore, a lot of labor is spent on alignment work, and if the lead terminal is deformed, it is very difficult to correct it, resulting in poor work efficiency.
この発明は上記事情に着目してなされたもので、その目
的とするところは、位置決め治具を用いて７う、トパッ
ケージ形電子部品を印刷配線板の／中ターンに正確かつ
容易に位置決めすることによシ作業能率の向上と自動化
を図ることができるフック）／譬Ｆケージ形電子部品の
実装装置を提供しようとするものである。This invention was made in view of the above-mentioned circumstances, and its purpose is to accurately and easily position a packaged electronic component in the middle turn of a printed wiring board using a positioning jig. It is an object of the present invention to provide a mounting device for hook-type/F-cage type electronic components that can particularly improve work efficiency and achieve automation.
以下、この発明を図面に示す一実施例にもとづいて説明
する。第１図中１はＩＣ、ＬＳＩ 等のフンｙ ） ／
ｌ ｙケージ形電子部品（以下単に電子部品という）を
示すもので、これはモールド成形された矩形状の本体部
２とこの本体部２の各辺から突出する多数本のリード端
子３・・・とから形成されている。４は印刷配線板で、
この表面には上記電子部品１の形状と同様のフン、トノ
奢、ケージノ臂ターン（以下単にパターンという）５が
形成されるとともに、とのノ々ターン５の周囲にはノリ
ーン５の設計時に基準とした４個の位置決め穴６・・・
が穿設されている。第２図および第３図は上記電子部品
１を印刷配線板４に装着するための実装装置を示すもの
である。７は印刷配線板４を載設したｘｙＹテーブルｉ
ｂ、このＸＹテーブルｒ上には昇降自在な装着機構８が
設けられている。そして、この装着機構８とＸＹテーブ
ル１とは一つの二二、トに構成され、ＸＹテーブル１の
作動と連動して装着機構８が高速に精度よく作動するよ
うになっている。The present invention will be described below based on an embodiment shown in the drawings. 1 in Figure 1 indicates IC, LSI, etc.) /
This is a cage-type electronic component (hereinafter simply referred to as an electronic component), which consists of a molded rectangular main body 2 and a large number of lead terminals 3 protruding from each side of the main body 2. It is formed from. 4 is a printed wiring board,
On this surface, the same shape as the above-mentioned electronic component 1 is formed with a fin, a tonneau, and a cage turn (hereinafter simply referred to as a pattern) 5, and the area around the top turn 5 is based on the criteria used when designing the noreen 5. Four positioning holes 6...
is drilled. FIGS. 2 and 3 show a mounting apparatus for mounting the electronic component 1 on the printed wiring board 4. As shown in FIG. 7 is an xyY table i on which a printed wiring board 4 is mounted.
b. A mounting mechanism 8 that can be raised and lowered is provided on this XY table r. The mounting mechanism 8 and the XY table 1 are constructed as one piece, and the mounting mechanism 8 operates at high speed and with high accuracy in conjunction with the operation of the XY table 1.
装着機構８にはプレート９を有したホル〆１０が設けら
れ、このホルダ１０には位置決め治具１１が上下動自在
に支持されている。さらに、この位置決め治具１１の上
面には一対のガイドビン１２．１１が突設され、これら
ガイドピン１２．１２は上記プレート９をスライド自在
に貫通している。また、ガイドピン１２，１１１におけ
る位置決め治具１１とプレート９との間にはコイルスプ
リング１３．１３が介在されており、位置決め治具１１
の緩衝機構１４を形成している。さらに、位置決め治具
１１の下面には上記電子部品１と嵌合する嵌合部１５が
設けられている。この嵌合部ＩＪは中央部に設けられ電
子部品１の本体部２と嵌合する凹所１６とこの凹所ＩＣ
の各辺に連続して設けられリード端子３・・・と嵌合す
る多数の溝１１・・・とから形成されている。さらに、
この位置決め治具１１の下面には上記印刷配線板４の位
置決め穴６・・・に挿入する位置決めビン１８・・・が
突設されている。The mounting mechanism 8 is provided with a holder 10 having a plate 9, and a positioning jig 11 is supported on the holder 10 so as to be vertically movable. Further, a pair of guide pins 12.11 are protruded from the upper surface of the positioning jig 11, and these guide pins 12.12 extend through the plate 9 in a slidable manner. Further, coil springs 13 and 13 are interposed between the positioning jig 11 and the plate 9 on the guide pins 12 and 111, and the positioning jig 11
A buffer mechanism 14 is formed. Furthermore, a fitting portion 15 that fits into the electronic component 1 is provided on the lower surface of the positioning jig 11. This fitting part IJ includes a recess 16 that is provided in the center and that fits into the main body part 2 of the electronic component 1, and this recess IC.
It is formed from a large number of grooves 11 that are continuously provided on each side of the board and that fit with the lead terminals 3. moreover,
Positioning pins 18 to be inserted into the positioning holes 6 of the printed wiring board 4 are protruded from the lower surface of the positioning jig 11.
また、位置決め治Ａ１１の中央部には真空吸着横溝１ｇ
を形成する真空吸引孔２０が設けられ、その下端は上記
凹所１６と連通し、上端は通孔２１を介して真空ｌンプ
（図示しない）と連通している。さらに、この真空吸引
孔２０には上下動自在な押えｅン２２が挿入されており
、これはスプリング２３によって常に下方すなわち凹所
１＃内に突出する方向に付勢されている。In addition, there is a vacuum suction horizontal groove 1g in the center of the positioning jig A11.
A vacuum suction hole 20 is provided, the lower end of which communicates with the recess 16, and the upper end of which communicates with a vacuum pump (not shown) via a through hole 21. Further, a vertically movable presser foot e is inserted into the vacuum suction hole 20, and this presser foot e is always urged downward by a spring 23, that is, in a direction to project into the recess 1#.
つぎに、上記実施例の作用について説明する。Next, the operation of the above embodiment will be explained.
印刷配線板４に装着されるべき電子部品１は位置決め治
具１１の嵌合部１５に対向すると、真空吸引作用によっ
てその本体部２が凹所１６内に嵌合され、これに伴って
リード端子３・・・は溝１７・・・に１本づつ嵌合され
る。このように電子部品１を保持した装着機構８はＸＹ
テーブル７の作動に連動し、予めプロゲラＺングしであ
る座標にもとづいて下降すると、位置決め治具１１の位
置決めビン１８・・・は印刷配線板４の位置決め穴６・
・・に挿入される。したがって、電子部品１の本体部２
は印刷配線板４に予め塗布されている接着剤２４によっ
て仮固定され、各リード端子３・・・はその後任意のは
んだ付は手段によジノ々ターフ５にコーティングされた
半田層２５に接合される。このとき、位置決め治具１１
は緩衝機構１４の作用によって印刷配線板４との衝撃が
緩和されるとともに印刷配線板４と弾性的り
に４接されるため、リード端子３・・・が変形していて
も矯正されることになる。このようにして電子部品１の
仮固定が完了すると、真空吸引作用は解除され、装着機
構８が上昇するが、このとき押えビン２２はスプリング
２３の復元力によって、凹所ＩＣ内へ突出する。したが
って、電子部品１の本体部２は押えビン２２によりて印
刷配線板４に押え付けられ、位置決め治具１１の上昇時
に電子部品１が同時に浮き上がることはなく、仮固定位
置に保持されることになる。When the electronic component 1 to be mounted on the printed wiring board 4 faces the fitting part 15 of the positioning jig 11, the main body part 2 is fitted into the recess 16 by the vacuum suction action, and the lead terminal 3... are fitted into the grooves 17 one by one. The mounting mechanism 8 holding the electronic component 1 in this way is
In conjunction with the operation of the table 7, the positioning pins 18 of the positioning jig 11 are moved down by the positioning holes 6 of the printed wiring board 4.
... will be inserted. Therefore, the main body 2 of the electronic component 1
are temporarily fixed with an adhesive 24 applied to the printed wiring board 4 in advance, and each lead terminal 3... is then joined to the solder layer 25 coated on the Gino-Turf 5 by any soldering method. Ru. At this time, the positioning jig 11
The impact with the printed wiring board 4 is alleviated by the action of the buffer mechanism 14, and the lead terminals 3 are in elastic contact with the printed wiring board 4, so even if the lead terminals 3 are deformed, they can be corrected. become. When the temporary fixation of the electronic component 1 is completed in this way, the vacuum suction action is released and the mounting mechanism 8 is raised, but at this time, the holding pin 22 is projected into the recess IC by the restoring force of the spring 23. Therefore, the main body 2 of the electronic component 1 is pressed against the printed wiring board 4 by the holding pin 22, and the electronic component 1 is not lifted up at the same time when the positioning jig 11 is raised, and is held at the temporarily fixed position. Become.
この発明は以上説明したように、印刷配線板に対して昇
降自在に設けた位置決め治具の下面に、フラットノイッ
ケージ形電子部品の本体部およびリード端子と嵌合する
嵌合部を位置決めビンを設け、位置決め治具の下降時に
上記位置決めビンが印刷配線板の位置釆め穴に挿入する
ようにしたことにより、フラットパツクージ形電子部品
を印刷配線板の所定位置に正確かつ自動的に装着するこ
とができ、作業能率の向上を図ることができる。さらに
、リード端子が変形していても嵌合部に嵌合した際に矯
正されるためリード端子を・ダターンと確実に接合し、
接触不良を招くことがないという効果を奏する。As explained above, the present invention has a positioning pin on the bottom surface of a positioning jig that is movable up and down with respect to a printed wiring board, and a fitting part that fits with the main body and lead terminal of a flat neu-cage type electronic component. The above-mentioned positioning pin is inserted into the positioning hole of the printed wiring board when the positioning jig is lowered, so that the flat pack type electronic component can be accurately and automatically placed at the specified position on the printed wiring board. It can be installed and work efficiency can be improved. Furthermore, even if the lead terminal is deformed, it will be corrected when it is fitted into the fitting part, so the lead terminal can be reliably joined to the data turn.
This has the effect of not causing poor contact.
図面はこの発明の一実施例を示すもので、第１図は電子
部品と印刷配線板との斜視図、第２図は実装装置の一部
切欠した正面図、第３図は位置決め治具の下面図である
。
１・・・７う、ドパ、ケージ形電子部品、２・・・本体
部、３・・・リード端子、４・・・印刷配線板、５・・
・フラットノ、ケージノ々ターン、６・・・位置決め穴
、１１・・・位置決め治具、Ｊｊ−・・嵌合部、ＺＳ・
・・位置決めビン、１９・・・真空吸着機構。
出願人代理人 弁理士 鈴 江 武 廖第１図
第２図
３
第３図The drawings show an embodiment of the present invention; FIG. 1 is a perspective view of an electronic component and a printed wiring board, FIG. 2 is a partially cutaway front view of a mounting device, and FIG. 3 is a diagram of a positioning jig. It is a bottom view. 1...7 U, Dopa, cage type electronic component, 2... Main body, 3... Lead terminal, 4... Printed wiring board, 5...
・Flat no., cage no. turn, 6.. positioning hole, 11.. positioning jig, Jj-.. fitting part, ZS.
...Positioning bottle, 19...Vacuum suction mechanism. Applicant's agent Patent attorney Suzu Jiang Wu Liao Figure 1 Figure 2 Figure 3 Figure 3
Claims (1)
決め穴を有した印刷配線板に、そのフン、トパッケージ
パターンに対応してフラット／寺ッケージ形電子部品を
装着する実装装置において、上記印刷配線板に対して昇
降自在に設けた位置決め治具の下面に上記フラットノ量
、ケージ形電子部品の本体部およびリード端子と嵌合す
る嵌合部と上記位置決め穴に挿入する位置決めピンを設
けるとともに、上記嵌合部に７２．トーノ譬ッケーゾ形
電子部品を嵌合吸着する真空吸着機構を設け、上記嵌合
部に７う、トノ々、ケージ形電子部品を吸着した位置決
め治具の位置決めピンを印刷配線板の位置決め穴に挿入
して位置決めし、フン、）Ａ、ケージ形電子部品を７ラ
ツトパ、ケージパターンに合致させて装着することを特
徴とするフン、トノ母、ケージ形電子部品の実装装置。In a mounting device that mounts flat/temperature package type electronic components onto a printed wiring board having a flat motherboard f-turn and positioning holes around it in accordance with the package pattern, A fitting part that fits with the main body and lead terminal of the cage-shaped electronic component, and a positioning pin that is inserted into the positioning hole are provided on the bottom surface of the positioning jig, which is movable up and down. 72. A vacuum suction mechanism is provided to fit and adsorb the cage-type electronic component, and the positioning pin of the positioning jig that adsorbs the cage-type electronic component is inserted into the positioning hole of the printed wiring board. A mounting device for cage-shaped electronic components, characterized in that the mounting device positions the cage-shaped electronic components by aligning them with the cage pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56136401A JPS5837991A (en) | 1981-08-31 | 1981-08-31 | Device for mounting flat package electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56136401A JPS5837991A (en) | 1981-08-31 | 1981-08-31 | Device for mounting flat package electronic part |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2115883A Division JPH02290100A (en) | 1990-05-07 | 1990-05-07 | Method and device for mounting flat package type electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5837991A true JPS5837991A (en) | 1983-03-05 |
Family
ID=15174299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56136401A Pending JPS5837991A (en) | 1981-08-31 | 1981-08-31 | Device for mounting flat package electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5837991A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03152484A (en) * | 1989-11-10 | 1991-06-28 | Shin Meiwa Ind Co Ltd | Socket board for automatic mounting |
| JPH0448699U (en) * | 1990-08-30 | 1992-04-24 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53109174A (en) * | 1977-03-07 | 1978-09-22 | Hitachi Ltd | Mechanism for positioning multiple lead parts |
| JPS569743B2 (en) * | 1975-10-14 | 1981-03-03 |
-
1981
- 1981-08-31 JP JP56136401A patent/JPS5837991A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS569743B2 (en) * | 1975-10-14 | 1981-03-03 | ||
| JPS53109174A (en) * | 1977-03-07 | 1978-09-22 | Hitachi Ltd | Mechanism for positioning multiple lead parts |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03152484A (en) * | 1989-11-10 | 1991-06-28 | Shin Meiwa Ind Co Ltd | Socket board for automatic mounting |
| JPH0448699U (en) * | 1990-08-30 | 1992-04-24 |
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