JPS5836111Y2 - relay device - Google Patents
relay deviceInfo
- Publication number
- JPS5836111Y2 JPS5836111Y2 JP12189277U JP12189277U JPS5836111Y2 JP S5836111 Y2 JPS5836111 Y2 JP S5836111Y2 JP 12189277 U JP12189277 U JP 12189277U JP 12189277 U JP12189277 U JP 12189277U JP S5836111 Y2 JPS5836111 Y2 JP S5836111Y2
- Authority
- JP
- Japan
- Prior art keywords
- relay
- wiring board
- frame
- base
- fitted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
【考案の詳細な説明】
この考案は配線基板に電子部品とともにリレーを組み込
んだ遅延リレーなどのようなリレー装置の改良に関する
ものである。[Detailed Description of the Invention] This invention relates to an improvement of a relay device such as a delay relay in which a relay is incorporated together with electronic components on a wiring board.
電子機器の小型化にともないこの種装置においても小型
コンパクト化を図ることが要望されている。As electronic devices become smaller, there is a demand for smaller and more compact devices of this type.
このため従来、電子部品とともにリレーが組み込まれる
配線基板として薄肉状のフレキシブルなものを用いるこ
とにより高さ寸法を抑制して上記要請に対応させたもの
があるが、この構成では薄手の配線基板上に設定された
リレーの固定が不安定であり、耐振動、耐衝撃性に劣る
といった不具合を生じる。For this reason, conventionally, the height dimension has been suppressed by using a thin and flexible wiring board on which the relay is incorporated together with the electronic components to meet the above requirements. The fixation of the relay set to 1 is unstable, resulting in problems such as poor vibration resistance and impact resistance.
したがって、この考案は枠体に固定した配線基板の下面
側に一部を突出させてリレーを組み込んで、上記枠体を
保持するベースとベースに嵌着されるケースの相方に形
成した突起で上記リレーを位置決め保持させることによ
り、薄手の配線基板を活用して小型化が図れるとともに
、リレーの固定状態が安定するリレー装置を提供するこ
とを目的とする。Therefore, this invention incorporates a relay by making a part of the circuit board protrude from the bottom side of the wiring board fixed to the frame, and uses the projections formed on the base that holds the frame and the case that is fitted to the base. It is an object of the present invention to provide a relay device that can be downsized by utilizing a thin wiring board by positioning and holding a relay, and in which the fixed state of the relay is stable.
以下、この考案の実施例を図面にしたがって説明する。Embodiments of this invention will be described below with reference to the drawings.
第１図、第２図において、１は箱形のベース、２はベー
ス１に嵌着保持される枠体で、複数の外部端子３が固設
されている。In FIGS. 1 and 2, 1 is a box-shaped base, 2 is a frame body that is fitted and held on the base 1, and a plurality of external terminals 3 are fixedly installed.
４はＵ字状に折曲されたフレキシブルなプリント配線基
板で、上記外部端子３の一端に接続固定することにより
、上記枠体２に固定されるようになっている。Reference numeral 4 denotes a flexible printed wiring board bent into a U-shape, and is fixed to the frame 2 by being connected and fixed to one end of the external terminal 3.
５，６は上記配線基板４に組み込まれた電子部品および
リレーであす、リレー６は上記配線基板４の水平面部４
ａに形成された透孔７にその一部が嵌入されており、こ
の嵌入した沈下位置において、その端子６ａ〜６ｅが上
記配線基板４の一方の垂直面部４ｂの所定個所に半田付
で電気的に固定されている。Reference numerals 5 and 6 are electronic components and relays incorporated into the wiring board 4, and the relay 6 is mounted on the horizontal surface portion 4 of the wiring board 4.
A part of the terminals 6a to 6e are fitted into the through hole 7 formed in the hole 7a, and in the sunken position where the terminals 6a to 6e are soldered to predetermined positions on one vertical surface portion 4b of the wiring board 4, electrical connections are made. Fixed.
上記端子６ａ〜６ｄのうちの一部６ａおよび６ｂ、６Ｃ
と配線基板４との半田接続部Ｐ１およびＰ２．Ｐ３は枠
体２に固定された際、この枠体２に形成された透孔８お
よび９に嵌入されるようになっている。Some of the terminals 6a to 6d 6a and 6b, 6C
and the wiring board 4 at solder connection portions P1 and P2. When P3 is fixed to the frame 2, it is fitted into through holes 8 and 9 formed in the frame 2.
１０は上記ベース１に嵌着されるケースであり、このケ
ース１０の頂部壁内面１０ａと上記ベース１の底壁部内
面１ａとには、ケース１０の嵌着状態で上記リレー６の
外面に当接してこのリレー６を位置決め保持させる突起
１１および１２がそれぞれ形成されている。Reference numeral 10 denotes a case that is fitted to the base 1, and the top wall inner surface 10a of the case 10 and the bottom wall inner surface 1a of the base 1 have a case that contacts the outer surface of the relay 6 when the case 10 is fitted. Projections 11 and 12 are formed in contact with each other to position and hold the relay 6.
１３．１４はベース１の側壁外面とケース１０の側壁部
内面とに形成された両者１，１０の保合部である。Reference numerals 13 and 14 designate retaining parts 1 and 10 formed on the outer side wall of the base 1 and the inner side wall of the case 10.
上記構成から明らかなように、配線基板４に形成した透
孔７にリレー６を嵌入させた位置で配線基板４に組み込
むから、従来に比し、上記嵌入によるリレー６の沈下量
ｔ１（第２図）だけ高さ寸法が短縮されて小型になる。As is clear from the above configuration, since the relay 6 is assembled into the wiring board 4 at the position where the relay 6 is fitted into the through hole 7 formed in the wiring board 4, the sinking amount t1 (the second The height dimension is shortened by the amount shown in the figure, making it more compact.
しかも上記リレー６をベース１側の突起１２とケース１
０側の突起１１とで位置決め保持させるから、配線基板
４に組み込まれたリレー６の固定が堅固になる。Moreover, the relay 6 is connected to the protrusion 12 on the base 1 side and the case 1.
Since the relay 6 is positioned and held by the projection 11 on the 0 side, the relay 6 incorporated in the wiring board 4 can be firmly fixed.
換言すれば薄肉状の配線基板４を積極的に使用して一層
高さ寸法を短縮できるうえ、薄肉状の配線基板４に組み
込まれたリレー６を振動や衝撃に左右されることなく安
定的に保持させることができる。In other words, the height dimension can be further reduced by actively using the thin wiring board 4, and the relay 6 incorporated in the thin wiring board 4 can be stably operated without being affected by vibrations or shocks. can be retained.
さらにこの実施例ではリレーの端子接続部Ｐ１〜Ｐ３が
枠体２の透孔８，９に嵌入されるから、巾方向の長さｔ
２（第２図）も短縮される。Furthermore, in this embodiment, since the terminal connecting parts P1 to P3 of the relay are fitted into the through holes 8 and 9 of the frame body 2, the length in the width direction is t.
2 (FIG. 2) is also shortened.
つまり、上記透孔８，９がない場合には、上記端子接続
部Ｐ１〜Ｐ３を妨げないように配線基板４と枠体２との
間に第３図のようなギャップＧを存在させる必要がある
が、上記透孔８，９に端子接続部Ｐ１〜Ｐ３を嵌入させ
ることにより、ギャップＧが不要となり、一層重型化に
対応させることができる。In other words, if there are no through holes 8 and 9, it is necessary to provide a gap G between the wiring board 4 and the frame 2 as shown in FIG. 3 so as not to obstruct the terminal connection parts P1 to P3. However, by fitting the terminal connecting portions P1 to P3 into the through holes 8 and 9, the gap G becomes unnecessary and the device can be made even heavier.
なお、上記実施例では配線基板４をＵ字状に形成して、
リレー６の高さにほぼ同等の高さの垂直面部に電子部品
５を取り付けるようにしたものであるが、平面状やＬ字
状の配線基板を用いてもよい。In addition, in the above embodiment, the wiring board 4 is formed into a U-shape,
Although the electronic component 5 is attached to a vertical surface portion having a height substantially equal to the height of the relay 6, a planar or L-shaped wiring board may also be used.
この考案は以上のように配線基板に形成した透孔にリレ
ーを嵌入させて組み込むことにより装置の小型化を図り
、配線基板を保持するベースとの底壁部内面とベースに
嵌着されるケースの頂部壁内面とに形成した突起で上記
リレーを位置決め保持させることにより、薄肉状の配線
基板でもリレーを安定して保持させ耐振動・耐衝撃性に
優れたリレー装置を提供することができる。This idea aims to miniaturize the device by fitting and incorporating the relay into the through hole formed in the wiring board as described above, and the case is fitted to the inner surface of the bottom wall of the base that holds the wiring board and to the base. By positioning and holding the relay using the projections formed on the inner surface of the top wall, it is possible to stably hold the relay even on a thin wiring board, thereby providing a relay device with excellent vibration and shock resistance.
第１図（よこの考案に係るリレー装置の一例を示す分解
斜視図、第２図は同組立状態を示す断面図、第３図はリ
レーの端子と配線基板との接続部と枠体との間のギャッ
プの説明図である。
１・・・・・・ベース、１ａ・・・・・・底部壁内面、
２・・・・・・枠体、４・・・・・・配線基板、６・・
・・・・リレー、６ａ〜６ｅ・・・・・・リレーの端子
、７，８．９・・・・・・透孔、１０・・・・・・ケー
ス、１０ａ・・・・・・頂部壁内面、１１．１２・・・
・・・突起、Ｐｌ、Ｐ２．Ｐ３・・・・・・接続部。Fig. 1 is an exploded perspective view showing an example of a relay device according to the invention, Fig. 2 is a sectional view showing the assembled state, and Fig. 3 shows the connection between the relay terminal and wiring board and the frame. It is an explanatory view of the gap between 1...Base, 1a...Bottom wall inner surface,
2...Frame body, 4...Wiring board, 6...
...Relay, 6a-6e...Relay terminal, 7, 8.9...Through hole, 10...Case, 10a...Top Inside wall, 11.12...
...Protrusion, Pl, P2. P3...Connection part.
Claims (2)
透孔にリレーを嵌入させた状態でこのリレーを上記配線
基板に組み込み、上記枠体を保持するベースの底壁部内
面とこのベースに嵌着されるケースの頂部壁内面とに上
記リレーを位置決め保持する突起をそれぞれ形成したこ
とを特徴とするリレー装置。(1) A through hole is formed in the wiring board fixed to the frame, a relay is fitted into the through hole, and the relay is assembled into the wiring board, and the inner surface of the bottom wall of the base that holds the frame A relay device characterized in that projections for positioning and holding the relay are formed on the inner surface of the top wall of the case fitted to the base.
せる透孔を上記枠体に形成してなる実用新案登録請求の
範囲第１項記載のリレー装置。(2) The relay device according to claim 1, which is a registered utility model, wherein a through hole is formed in the frame into which a connecting portion between the terminal of the relay and the wiring board is inserted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12189277U JPS5836111Y2 (en) | 1977-09-09 | 1977-09-09 | relay device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12189277U JPS5836111Y2 (en) | 1977-09-09 | 1977-09-09 | relay device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5448328U JPS5448328U (en) | 1979-04-04 |
| JPS5836111Y2 true JPS5836111Y2 (en) | 1983-08-15 |
Family
ID=29079477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12189277U Expired JPS5836111Y2 (en) | 1977-09-09 | 1977-09-09 | relay device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5836111Y2 (en) |
-
1977
- 1977-09-09 JP JP12189277U patent/JPS5836111Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5448328U (en) | 1979-04-04 |
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