JPS583037U - bonding equipment - Google Patents

bonding equipment

Info

Publication number
JPS583037U
JPS583037U JP1981096269U JP9626981U JPS583037U JP S583037 U JPS583037 U JP S583037U JP 1981096269 U JP1981096269 U JP 1981096269U JP 9626981 U JP9626981 U JP 9626981U JP S583037 U JPS583037 U JP S583037U
Authority
JP
Japan
Prior art keywords
lead frame
bonding equipment
hot air
bonding
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981096269U
Other languages
Japanese (ja)
Inventor
大井　正孝
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP1981096269U priority Critical patent/JPS583037U/en
Publication of JPS583037U publication Critical patent/JPS583037U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

・　第１図及び第２図は本考案の一実施例を示す断面図
及び平面図である。 図中、１はヒータ部、４はリードフレーム、９は熱風供
給部、１０は熱風の吹き付は口である。- Figures 1 and 2 are a sectional view and a plan view showing an embodiment of the present invention. In the figure, 1 is a heater part, 4 is a lead frame, 9 is a hot air supply part, and 10 is a mouth for blowing hot air.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ヒータ部にリードフレームを載置し、該リードフレーム
にチップ又はワイヤーをボンディングするボンディング
装置において、該ヒータ部に前記リードフレームに熱風
を吹きつける熱風供給部を、　　設けてなることを特徴
とするボンディング装置。A bonding apparatus for placing a lead frame on a heater section and bonding a chip or a wire to the lead frame, characterized in that the heater section is provided with a hot air supply section that blows hot air onto the lead frame. Device.
JP1981096269U 1981-06-29 1981-06-29 bonding equipment Pending JPS583037U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981096269U JPS583037U (en) 1981-06-29 1981-06-29 bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981096269U JPS583037U (en) 1981-06-29 1981-06-29 bonding equipment

Publications (1)

Publication Number Publication Date
JPS583037U true JPS583037U (en) 1983-01-10

Family

ID=29891141

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981096269U Pending JPS583037U (en) 1981-06-29 1981-06-29 bonding equipment

Country Status (1)

Country Link
JP (1) JPS583037U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6112037A (en) * 1984-06-27 1986-01-20 Oki Electric Ind Co Ltd Die-bonding method
JPH06334100A (en) * 1993-05-25 1994-12-02 Seiko Epson Corp Semiconductor device and lead frame thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6112037A (en) * 1984-06-27 1986-01-20 Oki Electric Ind Co Ltd Die-bonding method
JPH06334100A (en) * 1993-05-25 1994-12-02 Seiko Epson Corp Semiconductor device and lead frame thereof

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