JPS5829844U - Heat dissipation structure of electronic components - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の発熱部品の放熱構造を示す平面図、第２
図は第１図の側面図、第３図は本考案に係る電子部品の
放熱構造の一実施例を示す平面図、　　　−第４図は第
３図の側面−、第５図は第３図の要部説明分解斜視図で
ある。 １・・・・・・プリント基板、２．４・・・・・・発熱
部品、１０．１１・・・・・・補強金具、１２．１３・
・・・・・絶縁部材、１７・・・・・・支持板、２０．
２５・・・・・・放熱器、３０〜３３・・・・・・バネ
、１４，１５，４０．４１・・・・・・ネジ。−Figure 1 is a plan view showing the heat dissipation structure of a conventional heat generating component.
The figures are a side view of Fig. 1, Fig. 3 is a plan view showing an embodiment of the heat dissipation structure for electronic components according to the present invention, - Fig. 4 is a side view of Fig. 3, and Fig. 5 is a side view of Fig. 3. FIG. 1... Printed circuit board, 2.4... Heat generating parts, 10.11... Reinforcement fittings, 12.13.
...Insulating member, 17... Support plate, 20.
25...Radiator, 30-33...Spring, 14,15,40.41...Screw. −

Claims (4)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）プリント基板の両側部に固設した補強金具に当該
プリント基板に実装した発熱電子部品の真上を渡した支
持板を固定し、この支持板と前記発熱電子部品に密着載
置した放熱器との間にバネを介在させ、このバネ圧によ
り前記放熱器を係止保持するようにしたことを特徴とす
る電子部品の放熱構造。(1) A support plate that extends directly above the heat-generating electronic components mounted on the printed circuit board is fixed to reinforcing metal fittings fixed on both sides of the printed circuit board, and the heat dissipation is placed in close contact with the support plate and the heat-generating electronic components. 1. A heat radiation structure for an electronic component, characterized in that a spring is interposed between the heat sink and the heat sink, and the spring pressure locks and holds the heat sink. （２）補強金具は略コ字状をなし、−側部をプリント基
板に固定し、他側部に支持板を固定させるようにしたこ
とを特徴とする実用新案登録請求の範囲第１項記載の電
子部品の放熱構造。(2) The reinforcing metal fitting has a substantially U-shape, and the - side is fixed to the printed circuit board, and the other side is fixed to the support plate, as stated in claim 1 of the utility model registration claim. heat dissipation structure for electronic components. （３）支持板にはプリント基板に実装された発熱電子部
品と対向する位置に穴を穿設し、この穴に放熱器の放熱
フィンを挿通させるようにしたことを特徴とする実用新
案登録請求の範囲第１項記載の電子部品の放熱構造。(3) Request for registration of a utility model characterized in that the support plate is provided with a hole at a position facing a heat-generating electronic component mounted on a printed circuit board, and a heat radiation fin of a heat sink is inserted through this hole. A heat dissipation structure for an electronic component according to scope 1. （４）放熱器の両側部に支柱を設け、この支柱にコイル
バネを遊嵌させ、当該コイルバネを放熱器と支持板間に
介在させるようにしたことを特徴とする実用新案登録請
求の範囲第１項記載の電子部品の放熱構造。(4) Utility model registration claim 1, characterized in that struts are provided on both sides of the radiator, a coil spring is loosely fitted into the struts, and the coil spring is interposed between the radiator and the support plate. Heat dissipation structure of electronic components described in section.