JPS5828339A - Bonding method for dielectric film - Google Patents

Bonding method for dielectric film

Info

Publication number
JPS5828339A
JPS5828339A JP56113281A JP11328181A JPS5828339A JP S5828339 A JPS5828339 A JP S5828339A JP 56113281 A JP56113281 A JP 56113281A JP 11328181 A JP11328181 A JP 11328181A JP S5828339 A JPS5828339 A JP S5828339A
Authority
JP
Japan
Prior art keywords
films
bonded
film
energy
buffer layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56113281A
Other languages
Japanese (ja)
Other versions
JPS6233937B2 (en
Inventor
Masaji Wako
和光　正司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Business Innovation Corp
Original Assignee
Fuji Xerox Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Xerox Co Ltd filed Critical Fuji Xerox Co Ltd
Priority to JP56113281A priority Critical patent/JPS5828339A/en
Publication of JPS5828339A publication Critical patent/JPS5828339A/en
Publication of JPS6233937B2 publication Critical patent/JPS6233937B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
    • B29C66/7314—Electrical and dielectric properties
    • B29C66/73143—Dielectric properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To obtain a smooth bonded surface which has no stepped difference of two thermally fusible dielectric films by providing a buffer layer on the superposed parts of the films when bonding the films, placing the films and the layer on a lower bearer with the layer side disposed downside and applying supersonic energy and pressure to them. CONSTITUTION:To thermally fusible dielectric films 2, 2' to be bonded and a buffer layer 4 are held between a supersonic horn 1 and a lower bearer 3, and supersonic energy is applied to them. Thus, the energy is first converted to frictional head between the films 2, 2' to be bonded, and the films 2, 2' are bonded. Subsequently, the energy is converted to frictional head between the film 2 thus bonded and a buffer layer substance 4, heat energy is further applied to the bonded surfaces of the film, thereby causing the surface contacted with the horn 1 of the film 2 to be smoothened. Cellophane, polyester film or the like is preferably adapted for the layer 4.

Description

【発明の詳細な説明】 本発明は熱接着性な持つ誘電体フィルムを接合する方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of bonding dielectric films having thermal adhesive properties.

従来、熱接着性高分子誘電体フィルムの接着には超音波
振動を利用した超音波接合法が一般的に用いられている
。この方法は第１図に示すように超音波ホーン１と下受
は台３の関に接合すべきフィルム２ｔ−一定の圧力をか
けて保持し。Conventionally, an ultrasonic bonding method using ultrasonic vibration has been generally used to bond thermally adhesive polymer dielectric films. In this method, as shown in FIG. 1, the ultrasonic horn 1 and the lower support are held in place by applying a constant pressure to the film 2t to be bonded to the base 3.

超音波エネルギーを与えて熱融着させるものである。超
音波による接合では、接合されるべきフィルム同志の超
音波振動によるこすり合いによる阜擦熱で熱融着させる
ものであり、接合向は第２図に断面図な示すように段差
のある形状になる。Ultrasonic energy is applied to thermally fuse the material. In ultrasonic bonding, the films to be bonded are thermally fused by rubbing heat caused by ultrasonic vibrations between the films to be bonded, and the bonding direction is in a stepped shape as shown in the cross-sectional view of Become.

この段差は一般に接合するフィルム膜厚のＪ−程度のか
なり高い値を示す。この原因はある程度熱融着すると振
動が停止し摩擦を生じなくなるためである。従ってこの
接合法は接合面が平滑性を要求されるものＫは適用でき
ないという欠点を持っていることになる。This level difference generally has a considerably high value, about J-thickness of the film to be bonded. The reason for this is that once heat fused to a certain extent, vibration stops and friction no longer occurs. Therefore, this bonding method has the disadvantage that it cannot be applied to materials K that require smoothness of the bonded surface.

本発明の目的は、前述した欠点を除去し、平滑な接合面
の得られる改良接合法を提供することにある。An object of the present invention is to provide an improved bonding method that eliminates the above-mentioned drawbacks and provides a smooth bonding surface.

本発明の目的は第３図に示す如く熱融着性を持つフィル
ム２，２′同志を接合する時に超音波な与える手段１と
、接合されるフィルムを保持するために上記超音波を与
える手段に対向して設けられた下受台３とで構成される
手段に於て。As shown in FIG. 3, the object of the present invention is to provide a means 1 for applying ultrasonic waves when bonding films 2 and 2' having heat-fusible properties, and a means for applying ultrasonic waves to hold the films to be bonded. In the means constituted by a lower pedestal 3 provided opposite to the lower pedestal 3.

接合されるべきフィルムと下受台との間に超音波エネル
ギーを一時的に留める緩衝層を設けて接合する方法によ
り達成される。This is achieved by a method of bonding by providing a buffer layer between the film to be bonded and the lower pedestal to temporarily retain the ultrasonic energy.

すなわち、本発明の方法は超音波ホーン、接合フィルム
、緩衝層及び下受は台な順次設置し、超音波ホーンと下
受は台の間に一定圧力を力・け、接合フィルムと緩衝層
を保持しつつ超音波エネルギーをかけることを特徴とす
る。That is, in the method of the present invention, an ultrasonic horn, a bonding film, a buffer layer, and a lower support are installed one after the other, and a constant pressure is applied between the ultrasonic horn and the supporter to separate the bonding film and buffer layer. It is characterized by applying ultrasonic energy while holding it.

本発明の方法な更に詳しく説明すると、第３図に示す様
に、超音波ホー／ｌと下受は台３とで接合フィルムと緩
衝層を保持し超音波エネルギーな印加する。To explain the method of the present invention in more detail, as shown in FIG. 3, an ultrasonic hoop/l and a base 3 hold the bonding film and the buffer layer and apply ultrasonic energy.

超音波エネルギーは、先ず接合フィルム同志での摩擦熱
に変換され、フィルムを第２図に示す様な状態にまで接
合する。接合面が第２図の状ＩＩＫ、なるＥフィルム同
志の摩擦は止まってしまうが、超音波エネルギーは５次
にフィルムと緩衝層物質との間に摩擦を起して熱エネル
ギーに変換されるに従りて、フィルム接合面に更に熱エ
ネルギー°が加わり、第４図に示す様にフィルムの超音
波ホーンに接した面が平滑化される。The ultrasonic energy is first converted into frictional heat between the bonded films, and the films are bonded to the state shown in FIG. 2. The bonding surfaces become IIK and E as shown in Figure 2. The friction between the films stops, but the ultrasonic energy causes friction between the film and the buffer layer material in the 5th order and is converted into thermal energy. Therefore, further heat energy is applied to the bonding surface of the film, and the surface of the film in contact with the ultrasonic horn is smoothed as shown in FIG.

本発明の接合方法が適用されるフィルムは熱伝導性の良
いものが望ましく、例えばポリエステルフィルム、ポリ
グロビレンフイルム、ポリイミドフィルム、高分子ポリ
アミドフィル人等を用いる仁とができる。It is desirable that the film to which the bonding method of the present invention is applied has good thermal conductivity, and for example, polyester film, polyglobylene film, polyimide film, polymeric polyamide film, etc. can be used.

又緩衝層としてはセロファン又は他の通常のポリエステ
ルフィルム、ボリグロビレンフイルム、ポリイミド、高
分子ポリアミド等フィルム状態に成形し得るものであれ
ばどの様な高分子フィルムでも用いることができる。As the buffer layer, any polymeric film that can be formed into a film, such as cellophane or other ordinary polyester film, polyglopylene film, polyimide, or polymeric polyamide, can be used.

実施例 巾３００曽、厚み１００μ、長さ６０Ｇ−のポリエステ
ルフィルムを２−重ね合わせ、この重ね合わせ部分に、
ベースフィルムがセロファン５Ｄｐで粘着性接着層３０
＃を有する接着用セロテープを緩衝層として貼付した。Example Two polyester films with a width of 300 mm, a thickness of 100 μm, and a length of 60 G− are overlapped, and in this overlapped portion,
Base film is cellophane 5Dp with adhesive adhesive layer 30
# adhesive cellophane tape was applied as a buffer layer.

この試料をセロテープ面が下にくるように下受台の上に
載置した。This sample was placed on a lower pedestal with the cellophane tape facing down.

下面の巾２０■、長手方向の巾３００箇の超音波ホーン
を用いて、押付圧２！／−で１０秒間押付けたところホ
ーンの作用面で接合部の段差は数声以下となり、良好な
接合面が得られた。Using an ultrasonic horn with a width of 20 mm on the bottom surface and a width of 300 mm in the longitudinal direction, the pressing pressure is 2! /- for 10 seconds, the difference in level at the joint on the working surface of the horn was less than a few tones, and a good joint surface was obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の超音＃ｌ接合法の説明図であり。 第２図は第１図の方法で得られる接合面の断面図であり
、第３図は本発明の詳細な説明図であり、第４図は第３
図の方法で得られる接合面の断面図である。 １・・・超音波ホーン；　２，２／・・・フィルム；３
・−・下受台；４・−・緩衝層。 （はカ１３石Ｊ 第　　１　　図 第　　２　　図 第　　３　　図 手続補正書 昭和５７年１月２日 昭和５６年特許願第　１１３２８／号ゝ２、発明の名称 一電体フイルムの接合方法 ３、補正をする者 事件との関係：特許出願人 名称　富士ゼロックス株式会社 ７、補正の対象 明細書の発明の詳細な説明の欄 ８、補正の内容 明細書第２頁９行目の「要求されるものには」を「要求
されるもの（例えばブレード等のクリーニング材を使用
するプロセス等に用いる誘電記録体又は電子写真記録体
等）Ｋは」に補正する。FIG. 1 is an explanatory diagram of the conventional ultrasonic #l bonding method. FIG. 2 is a sectional view of the joint surface obtained by the method shown in FIG. 1, FIG. 3 is a detailed explanatory diagram of the present invention, and FIG.
FIG. 3 is a cross-sectional view of a bonded surface obtained by the method shown in the figure. 1... Ultrasonic horn; 2, 2/... Film; 3
・-・Lower pedestal; 4・-・Buffer layer. (Haka 13 Stone J Figure 1 Figure 2 Figure 3 Figure Procedure Amendment January 2, 1981 Patent Application No. 11328/No. 2, Title of the Invention Method of Joining Monoelectric Film 3, Amendment Relationship with the case: Patent applicant name: Fuji Xerox Co., Ltd. 7, Detailed explanation of the invention column 8 of the specification subject to amendment, Contents of the amendment, page 2, line 9 of the specification, ``What is required?''"What is required (for example, a dielectric recording material or an electrophotographic recording material used in a process using a cleaning material such as a blade)" is changed to "K".

Claims (1)

【特許請求の範囲】[Claims] ２枚の熱融着性を持つ誘電体フィルムの接合する部＋上
型ね合わせ、この重ね合わせ部分に緩衝層を設け、この
緩衝層側の面を下にして下受台上に載設して超音波ホー
ンにより超音波エネルギーと圧力を加えることを特徴と
する誘電体フィルムの接合方法。A buffer layer is provided at the joining part of the two heat-adhesive dielectric films and the upper mold, and the buffer layer is placed on the lower pedestal with the side of the buffer layer facing down. A dielectric film bonding method characterized by applying ultrasonic energy and pressure using an ultrasonic horn.
JP56113281A 1981-07-20 1981-07-20 Bonding method for dielectric film Granted JPS5828339A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56113281A JPS5828339A (en) 1981-07-20 1981-07-20 Bonding method for dielectric film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56113281A JPS5828339A (en) 1981-07-20 1981-07-20 Bonding method for dielectric film

Publications (2)

Publication Number Publication Date
JPS5828339A true JPS5828339A (en) 1983-02-19
JPS6233937B2 JPS6233937B2 (en) 1987-07-23

Family

ID=14608196

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56113281A Granted JPS5828339A (en) 1981-07-20 1981-07-20 Bonding method for dielectric film

Country Status (1)

Country Link
JP (1) JPS5828339A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5461545A (en) * 1977-10-26 1979-05-17 Hitachi Ltd Optically scanning location
JPS63233875A (en) * 1987-03-23 1988-09-29 General Kk Production of loop form ink ribbon
JPH03156781A (en) * 1989-11-14 1991-07-04 Fuji Photo Film Co Ltd Floppy disk jacket and its manufacture
JPH05138739A (en) * 1991-08-30 1993-06-08 Shin Etsu Polymer Co Ltd Connection of long tapes
JPH06320626A (en) * 1993-02-12 1994-11-22 Signode Corp Method of smoothing joint of plastic sheet
GB2370806A (en) * 2001-01-09 2002-07-10 Ford Global Tech Inc Fabric placed between a workpiece and an anvil and/or ultrasonic welding tool

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536744Y2 (en) * 1988-05-09 1993-09-17

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5461545A (en) * 1977-10-26 1979-05-17 Hitachi Ltd Optically scanning location
JPS6113207B2 (en) * 1977-10-26 1986-04-12 Hitachi Seisakusho Kk
JPS63233875A (en) * 1987-03-23 1988-09-29 General Kk Production of loop form ink ribbon
JP2532447B2 (en) * 1987-03-23 1996-09-11 ゼネラル株式会社 Endless ink ribbon manufacturing method
JPH03156781A (en) * 1989-11-14 1991-07-04 Fuji Photo Film Co Ltd Floppy disk jacket and its manufacture
JPH05138739A (en) * 1991-08-30 1993-06-08 Shin Etsu Polymer Co Ltd Connection of long tapes
JPH06320626A (en) * 1993-02-12 1994-11-22 Signode Corp Method of smoothing joint of plastic sheet
GB2370806A (en) * 2001-01-09 2002-07-10 Ford Global Tech Inc Fabric placed between a workpiece and an anvil and/or ultrasonic welding tool
GB2370806B (en) * 2001-01-09 2004-08-25 Ford Global Tech Inc An apparatus for ultrasonic welding
DE10200554B4 (en) * 2001-01-09 2012-03-08 Ford Global Technologies, Llc (N.D.Ges.D. Staates Delaware) Method for ultrasonic welding of metal sheets

Also Published As

Publication number Publication date
JPS6233937B2 (en) 1987-07-23

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