JPS58202587A - Method of producing printed circuit board - Google Patents
Method of producing printed circuit boardInfo
- Publication number
- JPS58202587A JPS58202587A JP8608682A JP8608682A JPS58202587A JP S58202587 A JPS58202587 A JP S58202587A JP 8608682 A JP8608682 A JP 8608682A JP 8608682 A JP8608682 A JP 8608682A JP S58202587 A JPS58202587 A JP S58202587A
- Authority
- JP
- Japan
- Prior art keywords
- metal conductor
- conductor foil
- mount
- manufacturing
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明はプリント配線板の製造方法、特に大電流を必要
とする回路基板、あるいは音響用として一段と高性能表
回路基板を得るために、従来より厚みのある金属導体箔
を有するプリント配線板を製造する方法に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a printed wiring board, particularly a circuit board that requires a large current, or a printed circuit board for acoustic use, in which a thicker metal conductor foil is used. The present invention relates to a method of manufacturing a printed wiring board having the following.
従来のプリント配線板の製造方法としては種々のものが
あるが、力かでも導体の厚みが３５ミクロン程度の銅箔
を、フェノール樹脂基板に接着剤等により貼り合せ、必
要な回路パターンをエツチング法等によって形成する方
法が代表的なものとして挙げられる。There are various methods for manufacturing conventional printed wiring boards, but one method involves bonding copper foil with a conductor thickness of about 35 microns to a phenolic resin board with an adhesive, and then etching the necessary circuit pattern. A typical example is a method of forming the film by, for example,
上記のよう攻従来のプリント配線板の製癒方法において
は、その製法上の制約から導体箔の−みを厚くすること
が峻しいため、十分な電流容量が得られず、したがって
岑電流を必要とする６回路、あるいは音響用等の高性能
、高品質が要求される回路用としては最適のものではな
かった。As mentioned above, in the conventional manufacturing method for printed wiring boards, it is difficult to increase the thickness of the conductor foil due to the limitations of the manufacturing method, so sufficient current capacity cannot be obtained, and therefore a small current is required. It was not optimal for circuits that require high performance and quality, such as six circuits for use in audio applications, or for circuits that require high performance and quality.
本発明は上記０ような従″Ｊ−０も″）″欠点を除去す
るためになされたもので、金属導体箔を回路パターンの
反転形状に打抜き、これを保持用の台紙で受けて貼り合
せ、−万絶縁基板に感熱または感圧接着剤を回路パター
ン状に形成して、その接着剤層に上記金属導体箔の一路
構、成部分が接するように配置し、加熱または加圧して
接着するとともに、台紙および金属導体箔の不要部分を
除去することにより、１００ミクロン程度以上の厚みを
もつ金属導体からなる回路部分を有するプリント配線板
を、比較的安価に製造することができるプリント配４６
１＆の製造方法を提供することを目的としている。The present invention has been made in order to eliminate the drawbacks of the above-mentioned J-0. ,-A heat-sensitive or pressure-sensitive adhesive is formed in a circuit pattern on an insulating substrate, and the metal conductor foil is placed in contact with the adhesive layer and bonded by heating or pressure. In addition, by removing unnecessary parts of the mount and metal conductor foil, it is possible to manufacture a printed wiring board having a circuit part made of a metal conductor with a thickness of about 100 microns or more at a relatively low cost.
The purpose of this invention is to provide a manufacturing method for 1&.
以下本発明の一実施例を図について説明する。An embodiment of the present invention will be described below with reference to the drawings.
第１図ないし第５図はそれぞれスピーカー装置のデパ４
−ディングネットワーク回路用のプリント配線板を製造
する場合の実施例における各製造工程を示す垂直断面図
であり、第１図は刃型で打抜きプレスした金属導体箔を
台紙で受けて貼り合せる状態、第２図はその貼り合せた
状態、第３図は絶縁基板にパターン状に接着剤を塗布し
た状態、第４図は台紙によって保持された金属導体箔を
絶縁基板に仮接着した状態、第５図はさらに台紙および
金属導体箔の不要部分を除去して本接着し、プリント配
線板として完成した状態を示す。図において、（１）は
金属導体箔、（２）は打抜き用の刃型、（３）は上記金
属導体箔（１）保持用の台紙、（４）は金属導体箔（１
）の回路構成部分、（５）はその残りの不要部分、ｆ６
Ｊ ｉｔ絶縁基板、（力は感熱または感圧接着剤である
。Figures 1 to 5 show the speaker device's department 4.
- FIG. 1 is a vertical cross-sectional view showing each manufacturing process in an example of manufacturing a printed wiring board for a digital network circuit, and FIG. Figure 2 shows the state in which they are pasted, Figure 3 shows the state in which the adhesive is applied in a pattern to the insulating substrate, Figure 4 shows the state in which the metal conductor foil held by the mount is temporarily adhered to the insulating board, and Figure 5 The figure shows the completed printed wiring board after removing unnecessary parts of the mount and metal conductor foil and finally gluing them together. In the figure, (1) is the metal conductor foil, (2) is the punching blade, (3) is the mount for holding the metal conductor foil (1), and (4) is the metal conductor foil (1).
), (5) is the remaining unnecessary part, f6
Jit insulating substrate, (force is heat sensitive or pressure sensitive adhesive.
製造方法はまず第１図に示すように、金属導体箔（１）
を刃型（２）により回路を構成するパターンの反転形状
に打抜き、これを保持用の台紙（３）で受けて、第２図
に示すように貼９合せる。このとき刃型（２）によって
分離された金属導体箔（１）は回路構成部分（４）と不
要部分（５）とに分けられる。つぎに第３図に示すよう
に、絶縁基板（６）の片面に第１図および第２図におけ
る打抜きパターンを台紙（３）側から見た形状と同一形
状になるような回路パターン状に、感熱まｆＣは感圧接
着剤（７）を印刷等の方法によル塗布し、接着剤（７）
層を形成する。続いて第４図に示すように、台紙（３）
によって保持されている金属導体箔（１）を反転し、そ
の金属導体箔（１）の回路構成部分（４）が絶縁基板（
６）上の接着剤（７）に接するように配置し、台紙（３
）側から人力向に、加熱プレスまたはプレスにより加熱
あるいは加圧し、予備接着する。The manufacturing method begins with metal conductor foil (1) as shown in Figure 1.
This is punched out using a blade die (2) into an inverted shape of the pattern constituting the circuit, received by a holding mount (3), and pasted together (9) as shown in FIG. At this time, the metal conductor foil (1) separated by the blade mold (2) is divided into a circuit component part (4) and an unnecessary part (5). Next, as shown in FIG. 3, on one side of the insulating substrate (6), the punching patterns shown in FIGS. For heat-sensitive fC, apply pressure-sensitive adhesive (7) by printing or other method.
form a layer. Next, as shown in Figure 4, mount (3)
Invert the metal conductor foil (1) held by the insulating substrate (
6) Place it so that it is in contact with the adhesive (7) on the top, and
) side manually and heat or pressurize with a hot press or press to pre-bond.
この段階では接着剤（７）は半硬化の状態になっている
。つぎに第５図に示すように、台紙（３）と金属導体箔
（１）の不要部分（５）を除去、し、回路構成部分（４
）のみを残して、再度金属導体箔（１）側からＢ方向に
加熱または加圧すると、接着剤（７）Ｆｉ完全硬化の状
態となり、金属導体箔（１）の回路構成部分（４）が接
着剤（７）により絶縁基板（６）に完全に接着し、一連
の工程を完了する。At this stage, the adhesive (7) is in a semi-cured state. Next, as shown in FIG.
), and heat or pressurize again from the metal conductor foil (1) side in direction B, the adhesive (7) Fi will be completely cured, and the circuit component part (4) of the metal conductor foil (1) will be completely cured. The adhesive (7) completely adheres to the insulating substrate (6), completing a series of steps.
なお、前記実施例では、第４図に示すように、金属導体
箔（１）と絶縁基板（６）とを仮接着した後、金属導体
箔（１，）の不要部分（５）を除去し、第５図に示すよ
うに、本接着するようになっているが、第２−に示すよ
うに、台紙（３）と金属導体箔（１）ｔ−貼９合せた直
後に金属導体箔（１）の不要部分（５）を除去し、第４
図に示す工程に移行することも可能である。また、この
場合には、第３図において接着剤（力を絶縁基板（６）
の片面または全面にわたって塗布し、あるいはシート状
にして貼９合せることもできる。In the above embodiment, as shown in FIG. 4, after the metal conductor foil (1) and the insulating substrate (6) are temporarily bonded, the unnecessary portion (5) of the metal conductor foil (1,) is removed. As shown in Fig. 5, the main bonding is performed, but as shown in Fig. 2, immediately after pasting the mount (3) and the metal conductor foil (1), the metal conductor foil ( Remove unnecessary part (5) of 1) and
It is also possible to proceed to the steps shown in the figure. In addition, in this case, in Figure 3, the adhesive (force) is applied to the insulating substrate (6).
It can also be applied over one side or the entire surface of the sheet, or can be laminated in the form of a sheet.
さらに第１図において、接着剤層の金属導体箔（１）を
パターンの反転形状に打抜き、その接着剤のついていな
い面を台紙（３）で受けて接着剤（力および台紙（３）
付のパターン状金属導体箔（１）を作り、第４図に示す
工程に移行すること・も可能である。Further, in Fig. 1, the metal conductor foil (1) of the adhesive layer is punched out in the inverted shape of the pattern, the surface without adhesive is supported by the mount (3), and the adhesive layer (1) is
It is also possible to make a patterned metal conductor foil (1) with the attached pattern and move on to the process shown in FIG.
以上のように、本発明によれば、金属導体箔を回路パタ
ーンの反転形状に打抜き、これを保持用の台紙で受けて
貼り合せ、一方絶縁基板に感熱または感圧接着剤を回路
パターン状に形成して、その接着剤層に上記金属導体箔
の回路構成部分が接するように配置し、加熱または加圧
して接着するとともに、台紙および金属導体箔の不要部
分を除去する大うに構成したので、比較的厚い金属導体
箔からなる回路パターンを有するプリント配線板をエツ
チング等の化学処理によらず製造でき、製造方法が容易
であり、また製造設備についてもグイスタンプ法などの
ような高価な専用設備を導入する必要がないため、製造
コストが比較的安価であり、性能の優れたプリント配線
板が得られるなどの効果がある、As described above, according to the present invention, a metal conductor foil is punched out in the shape of an inverted circuit pattern, this is received and bonded with a holding mount, and a heat-sensitive or pressure-sensitive adhesive is applied to an insulating substrate in the shape of a circuit pattern. The circuit component part of the metal conductor foil is placed in contact with the adhesive layer, and is bonded by heating or pressurizing, and unnecessary parts of the mount and the metal conductor foil are removed. Printed wiring boards with circuit patterns made of relatively thick metal conductor foil can be manufactured without chemical processing such as etching, and the manufacturing method is easy, and the manufacturing equipment does not require expensive specialized equipment such as the Guistamp method. Because there is no need to introduce it, manufacturing costs are relatively low, and printed wiring boards with excellent performance can be obtained.
第１図ないし第５図はそれぞれ本発明の一実施例による
プリント配線板の製造方法の各工程を示す垂直断面図で
ある。
図において、（１）は金属導体箔、（２）は刃型、（３
）は台紙、（４）は回路構成部分、（５）は不要部分、
（６）は絶縁基板、（力は感熱または感圧接着剤である
。
なお、各図中、同一符号は同一または相当部分を示す。
代理人葛 野 信 −（外１名）
（７）
第１図
第２図
第３図
第４図
第５図1 to 5 are vertical cross-sectional views showing each step of a method for manufacturing a printed wiring board according to an embodiment of the present invention. In the figure, (1) is a metal conductor foil, (2) is a blade shape, and (3) is a metal conductor foil.
) is the mount, (4) is the circuit component part, (5) is the unnecessary part,
(6) is an insulating substrate (the force is a heat-sensitive or pressure-sensitive adhesive. In each figure, the same reference numerals indicate the same or corresponding parts. Agent Shin Kuzuno - (1 other person) (7) No. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5
Claims (4)
これを保持用の台紙で受けて貼シ合せる工程と、これと
は別に絶縁基板の一方の面に感熱または感圧接着剤層を
回路パターン状に形成する工程と、これらの台紙付金属
導体箔および接着剤付絶縁基板を、その回路構成部分と
接着剤が接するように配置し、台紙の上から加熱または
加圧して回路構成部分および絶縁基板を接着する工程と
、台紙および金属導体箔の不要部分を除去する工程とか
らなることを特徴とするプリント配線板の製造方法。(1) Punching metal conductor foil into the inverted shape of the circuit pattern,
There is a process of receiving this with a holding mount and pasting it together, and a separate process of forming a heat-sensitive or pressure-sensitive adhesive layer in the shape of a circuit pattern on one side of the insulating substrate, and a process of forming a metal conductor foil with these mounts. and a process of arranging an insulating board with adhesive so that the circuit component and the adhesive are in contact with each other, and bonding the circuit component and the insulating board by heating or applying pressure from above the mount, and eliminating the need for the mount and metal conductor foil. A method for manufacturing a printed wiring board, comprising the step of removing a portion.
行うことを特徴とする特許請求の範囲第１項゛ 記載
のプリント配線板の製造方法。(2) The method for manufacturing a printed wiring board according to claim 1, wherein unnecessary portions of the metal conductor foil are removed immediately after bonding.
に行うことを特徴とする特許請求の範囲第１狽記載のプ
リント配線板の製造方法。(3) The method for manufacturing a printed wiring board according to claim 1, wherein the unnecessary portion of the metal conductor foil is removed at the same time as the mount is removed.
除去前の仮接着ならびに除去後の本接着からなることを
特徴とする特許請求の範囲第１項ないし第３項のいずれ
かく記載のプリント配線板の製造方法。(4) The print according to any one of claims 1 to 3, wherein the step of bonding the metal conductor foil and the insulating substrate includes temporary bonding before removing the mount and main bonding after removal. Method of manufacturing wiring boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8608682A JPS58202587A (en) | 1982-05-21 | 1982-05-21 | Method of producing printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8608682A JPS58202587A (en) | 1982-05-21 | 1982-05-21 | Method of producing printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58202587A true JPS58202587A (en) | 1983-11-25 |
Family
ID=13876891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8608682A Pending JPS58202587A (en) | 1982-05-21 | 1982-05-21 | Method of producing printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58202587A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4920019A (en) * | 1989-03-24 | 1990-04-24 | Eveready Battery Company, Inc. | Battery pack assembly having a circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52143483A (en) * | 1976-05-25 | 1977-11-30 | Nippon Electric Co | Method of forming circuit pattern |
| JPS5388163A (en) * | 1977-01-14 | 1978-08-03 | Esu Kei Kk | Method of producing printed circuit board |
| JPS53138069A (en) * | 1977-05-09 | 1978-12-02 | Toshio Iguma | Method of producing printed circuit board |
| JPS54114762A (en) * | 1978-02-28 | 1979-09-07 | Kyoritsu Kogyo | Method of producing printed circuit board |
-
1982
- 1982-05-21 JP JP8608682A patent/JPS58202587A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52143483A (en) * | 1976-05-25 | 1977-11-30 | Nippon Electric Co | Method of forming circuit pattern |
| JPS5388163A (en) * | 1977-01-14 | 1978-08-03 | Esu Kei Kk | Method of producing printed circuit board |
| JPS53138069A (en) * | 1977-05-09 | 1978-12-02 | Toshio Iguma | Method of producing printed circuit board |
| JPS54114762A (en) * | 1978-02-28 | 1979-09-07 | Kyoritsu Kogyo | Method of producing printed circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4920019A (en) * | 1989-03-24 | 1990-04-24 | Eveready Battery Company, Inc. | Battery pack assembly having a circuit board |
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