JPS5819472U - electronic circuit module - Google Patents

electronic circuit module

Info

Publication number
JPS5819472U
JPS5819472U JP1981113137U JP11313781U JPS5819472U JP S5819472 U JPS5819472 U JP S5819472U JP 1981113137 U JP1981113137 U JP 1981113137U JP 11313781 U JP11313781 U JP 11313781U JP S5819472 U JPS5819472 U JP S5819472U
Authority
JP
Japan
Prior art keywords
electronic circuit
circuit module
flange
board
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981113137U
Other languages
Japanese (ja)
Inventor
五十嵐　友衛
俊巳 溝口
五朗 石賀
Original Assignee
東光株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東光株式会社 filed Critical 東光株式会社
Priority to JP1981113137U priority Critical patent/JPS5819472U/en
Publication of JPS5819472U publication Critical patent/JPS5819472U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の電子回路モジュールの一部の正面断面図
、第２図は本考案によ電子回路モジ、１−ルの一実施例
を示す正面図、第３図は同下面図、第４図は端子の拡大
斜視図、第５図は第２図及び第３図に示した電子回路モ
ジュールの一部の拡大正面断面図である。 ２・・・・・・プリント配線、３・・・・・・基板、３
ａ・・回置通孔、６・７・・・・・・回路素子、１０・
・曲端子、１０ａ・・・・・・フランジ、１０ｂ・・・
・・・ローレット部。Fig. 1 is a front sectional view of a part of a conventional electronic circuit module, Fig. 2 is a front view showing an embodiment of the electronic circuit module according to the present invention, and Fig. 3 is a bottom view of the same; 4 is an enlarged perspective view of a terminal, and FIG. 5 is an enlarged front sectional view of a part of the electronic circuit module shown in FIGS. 2 and 3. 2... Printed wiring, 3... Board, 3
a... Turning hole, 6, 7... Circuit element, 10...
・Bent terminal, 10a...Flange, 10b...
...knurling part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント配線が施され回路素子を装着した基板に貫通孔
を設け、該貫通孔に入出力用の端子を挿入固定してなる
電子回路モジュールにおいて、該端子は、基板の上面に
当接するフランジを有し、かつフランジの直下の基板に
嵌合した部分力釦−レソト加工されていることを特徴と
する電子回路モジュール。In an electronic circuit module in which a through hole is provided in a board on which printed wiring is applied and a circuit element is mounted, and an input/output terminal is inserted and fixed in the through hole, the terminal has a flange that comes into contact with the top surface of the board. An electronic circuit module characterized in that a partial force button fitted to a substrate directly under the flange is machined in Lesotho.
JP1981113137U 1981-07-30 1981-07-30 electronic circuit module Pending JPS5819472U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981113137U JPS5819472U (en) 1981-07-30 1981-07-30 electronic circuit module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981113137U JPS5819472U (en) 1981-07-30 1981-07-30 electronic circuit module

Publications (1)

Publication Number Publication Date
JPS5819472U true JPS5819472U (en) 1983-02-05

Family

ID=29907446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981113137U Pending JPS5819472U (en) 1981-07-30 1981-07-30 electronic circuit module

Country Status (1)

Country Link
JP (1) JPS5819472U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63114085A (en) * 1986-06-17 1988-05-18 バーグ・テクノロジー・インコーポレーテッド Method of fitting clean contact surface to substrate and substrate provided with such contact surface

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63114085A (en) * 1986-06-17 1988-05-18 バーグ・テクノロジー・インコーポレーテッド Method of fitting clean contact surface to substrate and substrate provided with such contact surface

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