JPS58190047A - Preparation of resin mold type electronic parts - Google Patents
Preparation of resin mold type electronic partsInfo
- Publication number
- JPS58190047A JPS58190047A JP7355082A JP7355082A JPS58190047A JP S58190047 A JPS58190047 A JP S58190047A JP 7355082 A JP7355082 A JP 7355082A JP 7355082 A JP7355082 A JP 7355082A JP S58190047 A JPS58190047 A JP S58190047A
- Authority
- JP
- Japan
- Prior art keywords
- jig
- resin
- electrode
- electronic parts
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 本発明は樹脂モールド型電子部品の製造方法に関する。[Detailed description of the invention] The present invention relates to a method for manufacturing resin molded electronic components.
最近、小形の電子回路装置を実現するために、リードレ
ス電子部品が実用されている。Recently, leadless electronic components have been put into practical use in order to realize small-sized electronic circuit devices.
第１図はり一ドレス電子部品、例えばダイオードの一例
を示すもので、ｌは両面に電極を形成した電子部品本体
（ダイオードペレット）、２ａ、２ｂは−・対のリード
で、一方のり一ド２ａにペレット１を載置固定している
。８はペレットｌの上面電極と他のり一ド２ｂとを電気
的に接続する金属細線、４はペレットｌを含む主要部分
を樹脂材で被覆した樹脂モール１部を示す。Figure 1 shows an example of a beam-dressed electronic component, such as a diode, where l is an electronic component body (diode pellet) with electrodes formed on both sides, 2a and 2b are a pair of leads, one of which is glued 2a. Pellet 1 is placed and fixed on. Reference numeral 8 indicates a thin metal wire that electrically connects the upper surface electrode of the pellet 1 to the other glue 2b, and 4 indicates a portion of the resin molding 1 in which the main portion including the pellet 1 is coated with a resin material.
第２図はこのダイオードの製造に用いられるリードフレ
ームの一例を示すもので、リード２ａ、２ｂの端部を連
結片２Ｃ１２Ｃで連結し、さらに連結片２Ｃ１２Ｃの両
端部を連結片２ｄにて連結し一体化したもので、２ｅは
位置決め及び移送用のガイド穴を示す。FIG. 2 shows an example of a lead frame used in manufacturing this diode, in which the ends of leads 2a and 2b are connected by a connecting piece 2C12C, and both ends of the connecting piece 2C12C are connected by a connecting piece 2d. In the integrated structure, 2e indicates a guide hole for positioning and transfer.
このダイオードはリードフレームのり一ド２ａ端部にペ
レットｌを順次載置固定するマウント工程、ペレット１
の」−面電極とり一ド２ｂとを金属細線３にて接続する
ワイヤボンデインク工程、ペレット１を含む主要部分を
樹脂材にて被覆し外装する外装工程、タイバ２Ｃ１２Ｃ
を切断除去し、個々のダイオードに分離する分離工程、
ダイオ−ドの電気的特性外観等を検査する工程等を経て
製造される。This diode is manufactured through a mounting process in which pellets 1 are sequentially placed and fixed on the end of the lead frame glue 2a.
Wire bonding process of connecting the ``-plane electrode with one side 2b with a thin metal wire 3, Exterior process of covering the main part including the pellet 1 with a resin material, Tie bar 2C12C
a separation process in which the diodes are removed and separated into individual diodes;
It is manufactured through a process of inspecting the electrical characteristics, appearance, etc. of the diode.
ところで、このダイオードは一つのリードフレームに複
数組のダイオードを構成できるのであるが、複数のダイ
オードを一括して製造することができなかった。例えば
、ワイヤボンデインク工程では、リード間隔が狭いため
ワイヤボンダを複数配置することができなかった。By the way, although a plurality of sets of diodes can be constructed on one lead frame, it has not been possible to manufacture a plurality of diodes all at once. For example, in the wire bonding process, it was not possible to arrange multiple wire bonders because the lead spacing was narrow.
また、製造工程が多いため、工程間の移し替え作業等も
煩雑であった。Furthermore, since there are many manufacturing steps, transfer work between steps is also complicated.
本発明は上記間額点に鑑み提案されたもので、複数の電
子部品を一括製造でき、製造工程を短縮できる製造方法
を提供する。The present invention has been proposed in view of the above-mentioned cost points, and provides a manufacturing method that can manufacture a plurality of electronic components at once and shorten the manufacturing process.
以下、本発明をダイオードの製造に適用し、第３図乃至
第１１図より説明する。第３図は電極体５を示し、図示
例では角形の平板部５ａのコーナ部より４つの脚片５ｂ
を同一方向に起立している。The present invention will be applied to the manufacture of diodes and will be explained below with reference to FIGS. 3 to 11. FIG. 3 shows the electrode body 5, and in the illustrated example, four leg pieces 5b are connected to the corners of a rectangular flat plate part 5a.
are standing in the same direction.
第４図及び第５図は本発明による製造に用いる治具６の
一例を示すもので、７は一方の電極体５を支持する下治
具で、脚片５ｂの端面を支持する段部７ａと、段部より
突出し、側面が脚片５ｂの内面と接触し上面が平板部５
ａと空隙をもって対向する突部７ｂと、突部７ｂの両側
より平行に延びる側壁部７Ｃ１７Ｃとを有する。８は上
治具で、側壁部７Ｃ１７Ｃを除き下治具７と−に下対称
形状を有する。また側壁７Ｃに樹脂を注入するゲート７
ｄを穿設している。９，１０は下治具７と上治具８の間
に配置された可動治具で、水平方向にスライドし、下金
型７及びに金型８の突部７ｂ、８ｂ側壁部の脚片５ｂ、
５ｂを押圧する突部９ａ、９ｂ。FIGS. 4 and 5 show an example of a jig 6 used for manufacturing according to the present invention, and 7 is a lower jig that supports one electrode body 5, and a stepped portion 7a that supports the end surface of the leg piece 5b. and protrudes from the stepped portion, the side surface contacts the inner surface of the leg piece 5b, and the upper surface contacts the flat plate portion 5.
It has a protrusion 7b facing a with a gap, and side wall parts 7C17C extending in parallel from both sides of the protrusion 7b. 8 is an upper jig which has a downwardly symmetrical shape with respect to the lower jig 7 except for the side wall portions 7C and 17C. Gate 7 for injecting resin into side wall 7C
d is drilled. Reference numerals 9 and 10 denote movable jigs arranged between the lower jig 7 and the upper jig 8, which slide horizontally and move the legs of the side walls of the lower mold 7 and the protrusions 7b and 8b of the mold 8. 5b,
Projections 9a and 9b that press 5b.
ｌＯａ、ｌＯｂを設は突部９ａ、９ｂ聞及び１０４．１
０ｂ間に溝部９Ｃ１１０Ｃを設けている。lOa and lOb are set between protrusions 9a and 9b and 104.1.
A groove portion 9C110C is provided between 0b.
以下、この動作を第６図乃〒第９図より説明する。This operation will be explained below with reference to FIGS. 6 to 9.
先ず第６図に示すように、−に治具８を取りはずし、可
動治具９．１０を左右にスライドさせて、下治具７の突
部７ｂに一方の電極体５を装着する。First, as shown in FIG. 6, the jig 8 is removed, the movable jig 9 and 10 are slid left and right, and one electrode body 5 is mounted on the protrusion 7b of the lower jig 7.
そして図示（７ないが、」二冶貝８の突部８ｂにも他方
の電極体５を装着する。Then, the other electrode body 5 is also attached to the protrusion 8b of the second shell 8 (although not shown in the figure).
そｌ〜で次に第７図に示すように、可動治具９．１０を
スライドさせて、下治具７の突部７ｂと可動治具９、ｌ
Ｏの突部９ｉ７，１０７２とで電極体５の脚片５ｂを圧
接固定し、さらに電極体５の平板部５ａ七にペレット１
を供給する。Then, as shown in FIG.
The leg piece 5b of the electrode body 5 is fixed in pressure contact with the projections 9i7 and 1072 of the
supply.
そ１７て第８図に示すように、下治具７、可動治具９、
］０で四重れた凹部内に上治具８の突部８ｂを挿入する
。この時、上治具８に装着された電極体５は」二治具８
で脚片５ｂが押圧された状態で、ペレッＩ−１に平板部
５ａを圧接ｌ−１可動冶具９．１０の突部９ｂ、１０ｂ
と上治具８の突部８ｂで脚片５ｂが挾持される。17. As shown in FIG. 8, the lower jig 7, the movable jig 9,
] Insert the protrusion 8b of the upper jig 8 into the quadruple concave portion at 0. At this time, the electrode body 5 mounted on the upper jig 8 is
With the leg piece 5b being pressed, the flat plate part 5a is pressed against the pellet I-1 by the protrusions 9b and 10b of the movable jig 9.10.
The leg piece 5b is held by the protrusion 8b of the upper jig 8.
このようにして電極体５．５間にペレノｌ−ｉを圧接挾
持した状態で、第９図に示すように治具６を樹脂注入装
置に供給する。１１は治具６を載置する底部、Ｉ２は底
部ｌｌ上で治具６を位置決めするための突壁、１３は底
部ｌｌ上で位置決めされた治具６のゲート７ｄと対応し
−に面に開口したランナで、図示しないが樹脂材を供給
するｌポット部に連通している。１４は底部１１に冶具
６を押圧する第１の押圧体、１５は突壁１２に治具６＝
５−
を押圧する第２の抑圧体である。この樹脂注入装置によ
り樹脂材１６がランナ１８からゲート７ｄを通り下治具
７と上治具８で四重れた空間内に注入される。この状態
で冶具６を加熱して樹脂材１６を硬化させると、第１θ
図に示すダイオードが得られる。このタイオードの電極
体５の脚片５ｂを第１１図に示すように樹脂モールド部
３の外面に沿って屈曲成形することによって樹脂モール
ド型ダイオードを得る。With Pereno l-i held in pressure contact between the electrode bodies 5.5 in this manner, the jig 6 is supplied to the resin injection device as shown in FIG. 11 is the bottom on which the jig 6 is placed, I2 is a projecting wall for positioning the jig 6 on the bottom ll, and 13 corresponds to the gate 7d of the jig 6 positioned on the bottom ll. It is an open runner and communicates with an l-pot section (not shown) for supplying resin material. 14 is a first pressing body that presses the jig 6 against the bottom portion 11; 15 is a jig 6 that presses the jig 6 on the projecting wall 12;
5- is the second suppressing body that presses down. This resin injection device injects the resin material 16 from the runner 18 through the gate 7d into the space quadrupled by the lower jig 7 and the upper jig 8. When the jig 6 is heated in this state to harden the resin material 16, the first θ
The diode shown in the figure is obtained. A resin molded diode is obtained by bending the leg pieces 5b of the electrode body 5 of this diode along the outer surface of the resin molded portion 3 as shown in FIG.
この製造方法によれば、電極体５の脚片５ｂをその軸方
向に押圧して平板部５ａにてペレットｌを弾性的に押圧
しているため、ボンデインクが不１要で治具６内で電極
体５．５とペレ’７’ ｌ−１を複数組、組立てた状態
で直ちに一括して樹脂モールドできるから作業性が向」
ニする。According to this manufacturing method, since the leg piece 5b of the electrode body 5 is pressed in the axial direction and the pellet 1 is elastically pressed by the flat plate part 5a, bonding ink is not required and the pellet 1 can be stored in the jig 6. Workability is improved because multiple sets of electrode body 5.5 and Pelle '7' l-1 can be resin molded all at once in the assembled state.
d.
またペレット１を破損することなく電極体５．５で圧接
挾持でき、電極体５の両面に樹脂材１６を充填できるか
ら樹脂硬化後横脂材１６が収縮し電極体５とペレ、１−
１の接触圧が低下するという問題もない。Further, since the pellet 1 can be clamped by the electrode body 5.5 without being damaged, and the resin material 16 can be filled on both sides of the electrode body 5, the side resin material 16 shrinks after the resin hardens, and the electrode body 5 and the pellet 1-
There is also no problem that the contact pressure of No. 1 decreases.
６ −
尚、本発明は−１−記実施例にのみ限定されることなく
、例えば、電極体５は単独のものを用いるだけでなく、
第１２図に示すように脚片５ｂの端部を連結片】７で連
結し、複数の電極体５を一体化してもよく、これにより
作業性を一層向上できる。6 - Note that the present invention is not limited only to the embodiments described in -1-, for example, the electrode body 5 may not only be used alone, but also
As shown in FIG. 12, the ends of the leg pieces 5b may be connected by a connecting piece 7 to integrate a plurality of electrode bodies 5, thereby further improving workability.
また電極体５の平板部５ａに電子部品本体ｌを収容する
凹部や電極と接触する凸部を設けてもよい。Further, the flat plate portion 5a of the electrode body 5 may be provided with a concave portion for accommodating the electronic component main body 1 and a convex portion that comes into contact with the electrode.
さらにダイオード゛だけでなく、抵抗やコンデンーリー
等他の電子部品の製造にも適用できる。Furthermore, it can be applied not only to the manufacture of diodes, but also to the manufacture of other electronic components such as resistors and capacitors.
第１図は電子部品の一例を示す側断面図、第２図は第１
図電子部品の製造に用いられるリードフレームの平面図
、第３図は電極体の一例を示す斜視図、第４図は本発明
による製造方法を説明するための治具の断面図、第５図
は第４図Ａ−Ａ面図、第６図乃至第９図は第４図治具の
各Ｔ程毎の断面図、第１Ｏ図は本発明により製造された
電、子部品の斜視図、第１１図はリード成型した電子部
品の斜視図、第１２図は電極体の他の例を示す斜視図で
ある。
■・・・・・電子部品本体、
３−・・・・・樹脂モールＦ部、
５ ・・・電極体、
５ａ・ 平板部、
５ｂ・・ 脚片、
６−・ ・・・ 治具１．
１ ６ −・・ ・ 的１）１旨ＩＡ 。
第３図 、ｂ
第６図
第７図Figure 1 is a side sectional view showing an example of an electronic component, and Figure 2 is a side sectional view showing an example of an electronic component.
3 is a perspective view showing an example of an electrode body, FIG. 4 is a sectional view of a jig for explaining the manufacturing method according to the present invention, and FIG. 5 is a plan view of a lead frame used for manufacturing electronic components. is a plane view taken along the line A-A in FIG. 4, FIGS. 6 to 9 are cross-sectional views of the jig in FIG. FIG. 11 is a perspective view of an electronic component with lead molding, and FIG. 12 is a perspective view showing another example of an electrode body. ■...Electronic component body, 3-...Resin molding F part, 5...Electrode body, 5a/flat plate part, 5b...leg piece, 6-...Jig 1. 1 6 -... ・ Target 1) 1 IA. Figure 3, b Figure 6 Figure 7
Claims (1)
電極を有する電子部品本体とを、四部を有する治具内に
脚片を反対方向に向けかつ平板部にて電子部品本体を挾
んで収容し、電子部品本体を電極体にて圧接した状態で
治具凹部内に樹脂材を充填し、電子部品本体を含む要部
を外装したことを特徴とする樹脂モールド型電子部品の
製造方法。A pair of electrode bodies with legs erected from the ends of a flat plate and an electronic component main body having electrodes on both sides are placed in a jig having four parts with the legs facing in opposite directions and the electronic component main body with the flat plate part. Manufacture of a resin-molded electronic component, characterized in that the main parts including the electronic component body are packaged by sandwiching and housing the electronic component body, filling the recess of the jig with a resin material while pressing the electronic component body with an electrode body. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7355082A JPH0230578B2 (en) | 1982-04-30 | 1982-04-30 | JUSHIMOORUDOGATADENSHIBUHINNOSEIZOHOHO |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7355082A JPH0230578B2 (en) | 1982-04-30 | 1982-04-30 | JUSHIMOORUDOGATADENSHIBUHINNOSEIZOHOHO |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58190047A true JPS58190047A (en) | 1983-11-05 |
| JPH0230578B2 JPH0230578B2 (en) | 1990-07-06 |
Family
ID=13521451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7355082A Expired - Lifetime JPH0230578B2 (en) | 1982-04-30 | 1982-04-30 | JUSHIMOORUDOGATADENSHIBUHINNOSEIZOHOHO |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0230578B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5049526A (en) * | 1989-06-07 | 1991-09-17 | Motorola, Inc. | Method for fabricating semiconductor device including package |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0545333U (en) * | 1991-11-21 | 1993-06-18 | エヌオーケー株式会社 | Oil seal |
-
1982
- 1982-04-30 JP JP7355082A patent/JPH0230578B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5049526A (en) * | 1989-06-07 | 1991-09-17 | Motorola, Inc. | Method for fabricating semiconductor device including package |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0230578B2 (en) | 1990-07-06 |
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