JPS58189576U - Printed board - Google Patents

Printed board

Info

Publication number
JPS58189576U
JPS58189576U JP8850182U JP8850182U JPS58189576U JP S58189576 U JPS58189576 U JP S58189576U JP 8850182 U JP8850182 U JP 8850182U JP 8850182 U JP8850182 U JP 8850182U JP S58189576 U JPS58189576 U JP S58189576U
Authority
JP
Japan
Prior art keywords
printed board
resist
solder lands
removed portion
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8850182U
Other languages
Japanese (ja)
Inventor
和弘 君塚
服部 貞美
Original Assignee
パイオニア株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パイオニア株式会社 filed Critical パイオニア株式会社
Priority to JP8850182U priority Critical patent/JPS58189576U/en
Publication of JPS58189576U publication Critical patent/JPS58189576U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のプリント基板におけるパターンの部分を
示す平面図、第2図はこの考案のプリント基板の一実施
例におけるパターンの部分を示す平面図、第3図はこの
考案のプリント基板の他の実施例におけるパターンの部
分の平面図である。 1・・・パターン、2a、2b・・・半田ランド、3・
・・レジスト、3a・・・接合部、3b・・・レジスト
除去部分。
FIG. 1 is a plan view showing a pattern part in a conventional printed circuit board, FIG. 2 is a plan view showing a pattern part in an embodiment of a printed circuit board of this invention, and FIG. 3 is a plan view showing a pattern part of an embodiment of a printed circuit board of this invention. FIG. 3 is a plan view of a portion of a pattern in the embodiment. 1... Pattern, 2a, 2b... Solder land, 3.
...Resist, 3a...Joint portion, 3b...Resist removed portion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 同一のレジスト除去部分内において2個所以上の半田ラ
ンドを有し、この隣接する半田ランドをレジストで接合
するとともに、上記レジスト除去部分において隣接する
半田ランドのパターンをつないで導通させたことを特徴
とするプリント基板。
It is characterized by having two or more solder lands in the same resist-removed portion, and connecting these adjacent solder lands with a resist, and connecting patterns of adjacent solder lands in the resist-removed portion to make them conductive. printed circuit board.
JP8850182U 1982-06-14 1982-06-14 Printed board Pending JPS58189576U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8850182U JPS58189576U (en) 1982-06-14 1982-06-14 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8850182U JPS58189576U (en) 1982-06-14 1982-06-14 Printed board

Publications (1)

Publication Number Publication Date
JPS58189576U true JPS58189576U (en) 1983-12-16

Family

ID=30097167

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8850182U Pending JPS58189576U (en) 1982-06-14 1982-06-14 Printed board

Country Status (1)

Country Link
JP (1) JPS58189576U (en)

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