JPS58187346A - Manufacture of laminated board - Google Patents

Manufacture of laminated board

Info

Publication number
JPS58187346A
JPS58187346A JP6989282A JP6989282A JPS58187346A JP S58187346 A JPS58187346 A JP S58187346A JP 6989282 A JP6989282 A JP 6989282A JP 6989282 A JP6989282 A JP 6989282A JP S58187346 A JPS58187346 A JP S58187346A
Authority
JP
Japan
Prior art keywords
resin
copper
phenolic resin
drying oil
paper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6989282A
Other languages
Japanese (ja)
Other versions
JPH0145416B2 (en
Inventor
中村 俊麿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Shin Kobe Electric Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Kobe Electric Machinery Co Ltd filed Critical Shin Kobe Electric Machinery Co Ltd
Priority to JP6989282A priority Critical patent/JPS58187346A/en
Publication of JPS58187346A publication Critical patent/JPS58187346A/en
Publication of JPH0145416B2 publication Critical patent/JPH0145416B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明は、積層板あるいは銅張り積層板の製造法に関す
る。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing laminates or copper-clad laminates.

従来、フェノール樹脂積層板あるいは銅張り積層板の製
造に際しては、レゾール型フェノール樹脂をメタノール
、アセトン、トルエン、メチルエチルケトンなどの有機
溶剤に希釈したフェスを、リンター紙、クラフト紙など
の積層品用基材に含浸した後熱風循還乾燥炉中で前記有
機溶剤を揮散、乾燥させていた。このため、多量の有機
溶剤を必要とじ、有機溶剤の揮散、乾燥のためのエネル
ギーコストおよび廃ガス処理コストを要していた。また
、溶剤は可燃性のため危険な作業環境にあった。
Conventionally, when manufacturing phenolic resin laminates or copper-clad laminates, a fest made by diluting resol-type phenolic resin with an organic solvent such as methanol, acetone, toluene, or methyl ethyl ketone is used as a base material for laminates such as linter paper or kraft paper. After impregnation, the organic solvent was volatilized and dried in a hot air circulation drying oven. Therefore, a large amount of organic solvent is required, and energy costs for volatilization and drying of the organic solvent and waste gas processing costs are required. Additionally, the solvent was flammable, creating a dangerous work environment.

本発明は、上記の従来の欠点を除去し、溶剤の使用と乾
燥工程を削減することによって、製造−■−程を効率化
した積層板あるいは銅張り積層板の製造方法を提供する
ことを目的とする。
An object of the present invention is to provide a method for manufacturing a laminate or a copper-clad laminate that eliminates the above-mentioned conventional drawbacks and streamlines the manufacturing process by reducing the use of solvents and drying steps. shall be.

上記目的を達成するために本発明は、フェノニル樹脂初
期縮合物を含浸したセルローズ系紙基材に乾性油変性ノ
ボラック型フェノール樹脂とへキサメチレンテトラミン
からなる樹脂組成物を加熱溶融状態で塗付し、この基材
の複数枚を重ね合せて加熱加圧成形することを特徴とす
るものである。。
In order to achieve the above object, the present invention applies a resin composition consisting of a drying oil-modified novolac type phenol resin and hexamethylenetetramine in a heated molten state to a cellulose paper base material impregnated with a phenonyl resin initial condensate. , is characterized in that a plurality of sheets of this base material are superimposed and molded under heat and pressure. .

本発明で用いるフェノール樹脂初期縮合物は、フェノー
ル類とホルムアルデヒド類を苛性ソーダ、苛性カリ、水
酸化バリウムなどの金属アルカリ、トリメチルアミン、
トリエチルアミン、ツメチルアミン、ジエチルアミンな
どのアミン化合物に代表される塩基性触媒下で反応させ
て得た1〜2核体の初期縮合物である。この初期縮合物
をリンター紙、またはクラフト紙などのセルローズ系紙
基材に含浸させると親水性があるため基材内部まで浸透
する。
The phenolic resin initial condensate used in the present invention can be prepared by combining phenols and formaldehyde with caustic soda, caustic potash, metal alkalis such as barium hydroxide, trimethylamine, etc.
It is an initial condensation product of mono- or dinuclear bodies obtained by reaction under a basic catalyst represented by an amine compound such as triethylamine, trimethylamine, or diethylamine. When this initial condensate is impregnated into a cellulose paper base material such as linter paper or kraft paper, it penetrates into the interior of the base material due to its hydrophilic properties.

本発明に用いる乾性油変性ノボラック型フェノール樹脂
は、フェノール類と乾性油を酸性触媒存在下で反応させ
て得られる乾性油−フエノール類付加物にホルムアルデ
ヒド類を反応させるか、あるいはフェノール類とホルム
アルデヒド類を酸性触媒存在下で反応させて得られるノ
ボラック型うエノール樹脂に乾性油を反応させて得る。
The drying oil-modified novolac type phenolic resin used in the present invention can be obtained by reacting formaldehyde with a drying oil-phenol adduct obtained by reacting phenols and drying oil in the presence of an acidic catalyst, or by reacting formaldehyde with a drying oil-phenol adduct obtained by reacting phenols and drying oil in the presence of an acidic catalyst. It is obtained by reacting a novolac-type enol resin obtained by reacting the following in the presence of an acidic catalyst with a drying oil.

乾性油変性ノボラック型フェノール樹脂の軟化点は、こ
れを基材に加熱溶融状態で塗付する工程に於いてゲル化
を防ぐため、100℃以下が望ましい。
The softening point of the dry oil-modified novolac type phenolic resin is desirably 100° C. or lower in order to prevent gelation during the process of applying it to a substrate in a heated molten state.

本発明に於いては、乾性油変性ノボラック型フェノール
樹脂に硬化剤としてヘキサメチレンテトラミンを添加す
るが、添加量は乾性油変性ノボラック型フェノール樹脂
100重量部に対し3〜15重量部が適当である。基材
1こ塗付するに際し、乾性油変性ノボラック型フェノー
ル樹脂−へキサメチレンテトラミン混合組成物の加熱溶
融温度は110 ”C以下が望ましい。
In the present invention, hexamethylenetetramine is added as a curing agent to the drying oil-modified novolac type phenolic resin, and the appropriate amount of addition is 3 to 15 parts by weight per 100 parts by weight of the drying oil-modified novolak type phenolic resin. . When coating one substrate, the heating and melting temperature of the drying oil-modified novolac type phenol resin-hexamethylenetetramine mixed composition is preferably 110''C or less.

実施例 フェノ ル680g、桐油350gにパラトルエンスル
フォン酸0.5jlを加え80〜85℃にて120分間
反応させた後、854バラフォルムアルデヒド195g
を加え70〜75℃にて1′30分間反応させた。減圧
脱水後、軟化点65°Cの桐油変性ノボラック型フェノ
ール樹脂を得た。得られた桐油変性ノボラック型フェノ
ール樹脂を85°Cに加熱溶融し、ヘキサメチレノテト
ラミンを桐油変性ノボラック型フヱノール樹脂100重
量部に対し10重量部添加して撹拌混合した後、これを
、予めフェノール樹8m初期砺合物を10fl量憾含浸
乾燥したクラフト紙に塗付した。得られた塗工紙の樹脂
付着量は52重量係であった。
Example 0.5 jl of para-toluene sulfonic acid was added to 680 g of phenol and 350 g of tung oil, and the mixture was reacted at 80 to 85°C for 120 minutes, followed by 195 g of 854 rose formaldehyde.
was added and reacted at 70 to 75°C for 1'30 minutes. After dehydration under reduced pressure, a tung oil-modified novolac type phenol resin with a softening point of 65°C was obtained. The obtained tung oil-modified novolak phenol resin was heated and melted at 85°C, 10 parts by weight of hexamethylenenotetramine was added to 100 parts by weight of the tung oil-modified novolak phenol resin, and the mixture was stirred and mixed. A 10 fl volume of the initial 8m wood composite was applied to kraft paper which had been impregnated and dried. The resin adhesion amount of the obtained coated paper was 52% by weight.

l・1塗T紙8枚とその片側表面薔こ35μ厚銅箔を重
ね合わせた構成物を王力1t o Kg/cd。
A composition consisting of 8 sheets of l.1 coated T paper and a 35μ thick copper foil layered on one side has a weight of 1 ton Kg/cd.

温度170℃で55分間成形し銅張り積層板を得た 比較例 フェノール5s01桐油350g1こバラトルエンスル
フォン酸o、sy、メタノール50gを加え80〜85
’Cにて120分間反応させた11.25%アンモニア
水209.85繋パラフオルムアルデヒド250#を加
え80〜85°Cにて270分間反応させた。次いで、
減圧脱水した後トルエンで希釈し樹脂濃度50重量%の
桐油変性フェノール樹脂ワニスを得た。予めフェノール
樹脂初期縮合物を10i1i量チ含浸乾燥したクラフト
紙に前記桐油変性フェノール樹脂ワニスを含浸乾燥して
樹脂付着量51重量慢の塗工紙を得た。
A comparative example in which a copper-clad laminate was obtained by molding at a temperature of 170°C for 55 minutes.
209.85 # of 11.25% ammonia water and 250 # of paraformaldehyde, which had been reacted for 120 minutes at 80-85°C, were added and reacted for 270 minutes at 80-85°C. Then,
After dehydration under reduced pressure, the mixture was diluted with toluene to obtain a tung oil-modified phenolic resin varnish with a resin concentration of 50% by weight. A kraft paper which had been previously impregnated and dried with a phenolic resin initial condensate in an amount of 10×10 was impregnated with the tung oil-modified phenolic resin varnish and dried to obtain a coated paper with a resin adhesion amount of 51 g.

上記塗工紙8枚とその片側表面に35μ厚銅箔を重ね合
せた構成物をIF力110KP/cs1.温度170℃
で55分間成形し銅張り積層板を得た。
A composition consisting of eight sheets of the above coated paper and a 35μ thick copper foil laminated on one side of the paper was coated with an IF force of 110KP/cs1. Temperature 170℃
The molding process was performed for 55 minutes to obtain a copper-clad laminate.

実施例および比較例の銅張り積層板の性能を@1表に示
す。
The performance of the copper-clad laminates of Examples and Comparative Examples is shown in Table 1.

第  1  表 第1表から明らかなように、本発明による銅張り積層板
の性能は、従来製造法の銅張り積層板に比べて加熱収縮
率は小さく、曲げ強さ、絶縁抵抗、吸水量、打抜加工性
は同等である。
Table 1 As is clear from Table 1, the performance of the copper-clad laminate according to the present invention is that the heat shrinkage rate is lower than that of the copper-clad laminate manufactured using conventional methods, and the performance of the copper-clad laminate according to the present invention is lower in terms of bending strength, insulation resistance, water absorption, and The punching workability is the same.

本発明によれば、乾性油変性フェノール樹脂の塗工工程
では溶剤を使用せず、加熱溶融状態で塗付を行なうので
乾燥工程が不用となる。また、これに伴ってエネルギー
コストおよび廃ガス処理コストを削減てきる。更に従来
のレゾール型樹脂と異なりノボラック型樹脂を使用する
ため、硬化収縮および硬化過程での揮発分発生が少な(
、従って、加熱による寸法変化および反り、ねじれの少
ない積層板が得られる。
According to the present invention, no solvent is used in the coating process of the drying oil-modified phenolic resin, and the coating is carried out in a heated molten state, thereby eliminating the need for a drying process. Additionally, energy costs and waste gas treatment costs can be reduced accordingly. Furthermore, unlike conventional resol-type resins, novolac-type resins are used, so there is less curing shrinkage and less volatile matter generation during the curing process (
Therefore, a laminate with less dimensional change, warping, and twisting due to heating can be obtained.

特許出願人 新神戸電機株式会社 代表取締役 石 垣 武三部 219−patent applicant Shin-Kobe Electric Co., Ltd. Representative Director Takesanbe Ishigaki 219-

Claims (1)

【特許請求の範囲】 フェノール樹脂初期縮合物を含浸した七lレローズ系紙
基材に、乾性油変性ノボラック型フェノール樹i旨とへ
キサメチレンテトラミンからな  ′る樹脂組成物を加
熱溶融状態で塗付し、この基宸 材の複数1数を重ね合せて加熱加圧成形することを特徴
とする積層板あるいは銅張り積層板の製造法。
[Scope of Claims] A resin composition consisting of a drying oil-modified novolac type phenol resin and hexamethylenetetramine is applied in a heated molten state to a 7L rerose paper base material impregnated with a phenolic resin initial condensate. A method for producing a laminate or a copper-clad laminate, characterized in that a plurality of these basic materials are superimposed and molded under heat and pressure.
JP6989282A 1982-04-26 1982-04-26 Manufacture of laminated board Granted JPS58187346A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6989282A JPS58187346A (en) 1982-04-26 1982-04-26 Manufacture of laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6989282A JPS58187346A (en) 1982-04-26 1982-04-26 Manufacture of laminated board

Publications (2)

Publication Number Publication Date
JPS58187346A true JPS58187346A (en) 1983-11-01
JPH0145416B2 JPH0145416B2 (en) 1989-10-03

Family

ID=13415824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6989282A Granted JPS58187346A (en) 1982-04-26 1982-04-26 Manufacture of laminated board

Country Status (1)

Country Link
JP (1) JPS58187346A (en)

Also Published As

Publication number Publication date
JPH0145416B2 (en) 1989-10-03

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