JPS58182466U - circuit board - Google Patents

circuit board

Info

Publication number
JPS58182466U
JPS58182466U JP1982080436U JP8043682U JPS58182466U JP S58182466 U JPS58182466 U JP S58182466U JP 1982080436 U JP1982080436 U JP 1982080436U JP 8043682 U JP8043682 U JP 8043682U JP S58182466 U JPS58182466 U JP S58182466U
Authority
JP
Japan
Prior art keywords
circuit board
conductive pattern
eyelets
soldering
mechanically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982080436U
Other languages
Japanese (ja)
Inventor
宏泰 相馬
Original Assignee
株式会社セコニツク
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社セコニツク filed Critical 株式会社セコニツク
Priority to JP1982080436U priority Critical patent/JPS58182466U/en
Publication of JPS58182466U publication Critical patent/JPS58182466U/en
Pending legal-status Critical Current

Links

Landscapes

  • Multi-Conductor Connections (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案による回路基板の一実施例の要部断面図
、第2図は上記実施例の要部平面図、第3図、第4図及
び第5図は夫々第二、第三及び第四の実施例の要部断面
図である。 1・・・フレキシブル回路基板、2・・・可撓性基板、
3・・・導体パターン1,4・・・保護膜、5・・・貫
通孔、6・・・ハード回路基板、7・・・剛性基板、8
・・・導体パターン、9・・・半田。
FIG. 1 is a sectional view of a main part of an embodiment of a circuit board according to the present invention, FIG. 2 is a plan view of a main part of the above embodiment, and FIGS. and FIG. 7 is a sectional view of a main part of a fourth embodiment. 1...Flexible circuit board, 2...Flexible board,
3... Conductor patterns 1, 4... Protective film, 5... Through hole, 6... Hard circuit board, 7... Rigid board, 8
...Conductor pattern, 9...Solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 片面に導電パターンを有するフレキシブル回路基板に、
片面に導体パターンを有する他の回路基板を重ね′て両
回路基板に半田付又は鳩目等により機械的且つ電気的に
接続して成る回路基板。
A flexible circuit board with a conductive pattern on one side,
A circuit board formed by overlapping another circuit board having a conductive pattern on one side and mechanically and electrically connecting both circuit boards by soldering or eyelets.
JP1982080436U 1982-05-31 1982-05-31 circuit board Pending JPS58182466U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982080436U JPS58182466U (en) 1982-05-31 1982-05-31 circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982080436U JPS58182466U (en) 1982-05-31 1982-05-31 circuit board

Publications (1)

Publication Number Publication Date
JPS58182466U true JPS58182466U (en) 1983-12-05

Family

ID=30089582

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982080436U Pending JPS58182466U (en) 1982-05-31 1982-05-31 circuit board

Country Status (1)

Country Link
JP (1) JPS58182466U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62103278U (en) * 1985-12-18 1987-07-01

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62103278U (en) * 1985-12-18 1987-07-01

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