JPS58178616A - Production of filter for surface acoustic wave - Google Patents
Production of filter for surface acoustic waveInfo
- Publication number
- JPS58178616A JPS58178616A JP6144482A JP6144482A JPS58178616A JP S58178616 A JPS58178616 A JP S58178616A JP 6144482 A JP6144482 A JP 6144482A JP 6144482 A JP6144482 A JP 6144482A JP S58178616 A JPS58178616 A JP S58178616A
- Authority
- JP
- Japan
- Prior art keywords
- surface acoustic
- acoustic wave
- wave filter
- tape
- filter element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、無線機器に使用される弾性表面波フィルタの
高信頼性を保ち、安価に提供することの−できる弾性表
面波フィルタの製造法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a surface acoustic wave filter for use in wireless equipment, which maintains high reliability and can be provided at low cost.
従来のこの種の弾性表面波フィルタは第１図及び第２図
に示すように、プリント基板１にリード端子２を接続し
たものに弾性表面波フィルタ素子３′ｆ：エポキシ樹脂
１１で取付けてマウントし、素子３の入出力櫛形電極４
と導電パターン５とをリード線６で配線後、上記素子３
を覆うように被せたキャップ７を接着剤８でプリント基
板１に接着した後、全体を樹脂９でモールドしていた。As shown in FIGS. 1 and 2, a conventional surface acoustic wave filter of this kind is mounted by attaching a surface acoustic wave filter element 3'f to a printed circuit board 1 with lead terminals 2 connected to it using epoxy resin 11. and the input/output comb-shaped electrode 4 of the element 3
After wiring the conductive pattern 5 with the lead wire 6, the above element 3
After the cap 7 was attached to cover the printed circuit board 1 with adhesive 8, the whole was molded with resin 9.
また、１０は上記素子３上に塗布された不要波を吸収す
るための吸収剤である。Further, 10 is an absorbent coated on the element 3 to absorb unnecessary waves.
このような従来例では、プリント基板やキャップを使用
しているために高価なものとなり、安価Ｏてして信頼性
の高い製造法が望まれていた。In such conventional examples, the use of printed circuit boards and caps makes them expensive, and a manufacturing method that is inexpensive and highly reliable has been desired.
本発明は上記のような点に鑑みてなされたものであり、
以下その一実施例について第３図〜第６図と共に説明す
る。The present invention has been made in view of the above points,
One embodiment will be described below with reference to FIGS. 3 to 6.
まず、本発明ではリードフレーム１２に弾性表面波、フ
ィルタ素子１３をエポキシ樹脂１４で取付けてマウント
し、上記素子１３の入出力櫛形電極１５と上記リードフ
レーム１２とを金線、アルミ線等のリード線１６で電気
的に接続する。ここで、上記素子１３の表面波の伝播部
分、すなわち入出力櫛形電極１５間に物体が接触すると
表面波が減衰される。そのため上記表面波の伝播部分は
空間が保持されなければならない。本発明では弾性表面
波フィルタ素子１３の端部に入出力櫛形電極１５からそ
の素子端部に伝播する不要波を吸収するための吸収剤１
７を厚く塗布し、そして上記素子１３の周囲（表裏）１
−表面波が伝播する部分に接しないように熱融着テープ
１８で償う。その後、弾性表面波フィルタ素子１３の周
囲が気密を保つように上記熱融着テープ１８の周辺部を
熱融着し、全体を樹脂１９でモールドすることにより製
造は転子する。First, in the present invention, a surface acoustic wave filter element 13 is mounted on a lead frame 12 using an epoxy resin 14, and the input/output comb-shaped electrodes 15 of the element 13 and the lead frame 12 are connected using leads such as gold wire or aluminum wire. Electrical connection is made by wire 16. Here, when an object comes into contact with the surface wave propagation portion of the element 13, that is, between the input and output comb-shaped electrodes 15, the surface wave is attenuated. Therefore, space must be maintained in the propagation portion of the surface wave. In the present invention, an absorber 1 is used at the end of the surface acoustic wave filter element 13 to absorb unnecessary waves propagating from the input/output comb-shaped electrode 15 to the end of the element.
7 thickly, and around the element 13 (front and back) 1
- Use heat-adhesive tape 18 to prevent contact with areas where surface waves propagate. Thereafter, the periphery of the heat-adhesive tape 18 is heat-sealed so as to maintain airtightness around the surface acoustic wave filter element 13, and the entire structure is molded with resin 19, thereby completing the manufacturing process.
上記実施例における熱融着テープ１８の代りに粘着テー
プまたは熱硬化性樹脂を塗布したテープを使用し、粘着
テープの周辺部を接着したり、熱硬化性樹脂を塗布した
テープの周辺部を熱硬化して接着したりして、弾性表面
波フィルタ素子１３の周囲を密封するようにしてもよい
ものである。An adhesive tape or a tape coated with a thermosetting resin is used instead of the heat-sealing tape 18 in the above embodiment, and the peripheral part of the adhesive tape is adhered, or the peripheral part of the tape coated with a thermosetting resin is heated. The periphery of the surface acoustic wave filter element 13 may be sealed by curing and adhering.
以上のように本発明の製造法によれば、従来のように弾
性表面波フィルタ素子を保持するプリント基板やキャッ
プを使用せずに、フィルタ素子表面に空間を保持するこ
とができ、安価で量産性に供することができるものであ
る。As described above, according to the manufacturing method of the present invention, it is possible to maintain space on the surface of the filter element without using a printed circuit board or a cap that holds the surface acoustic wave filter element as in the past, and mass production is possible at low cost. It is something that can be offered for sex.
第１図は従来例における弾性表面波フィルタの正面より
見た断面図、第２図は同側面より見た断面図、第３図は
本発明の製造法により得られた弾性表面波フィルタの一
実施例を示す正面より見た断面図、第４図は同側面より
見た断面図、第６図は向上面より見た断面図である。
１２・・・・・リードフレーム、１３・・・・・・弾性
表面波フィルタ素子、１８・・・・・・熱融着テープ（
粘着テープ、熱硬化性樹脂を塗布したテープ）、１９・
・・・・・樹脂。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
第２図
第３図FIG. 1 is a sectional view of a conventional surface acoustic wave filter seen from the front, FIG. 2 is a sectional view of the surface acoustic wave filter seen from the same side, and FIG. 3 is a surface acoustic wave filter obtained by the manufacturing method of the present invention. FIG. 4 is a cross-sectional view of the embodiment as seen from the front, FIG. 4 is a cross-sectional view as seen from the same side, and FIG. 6 is a cross-sectional view as seen from the upper side. 12... Lead frame, 13... Surface acoustic wave filter element, 18... Heat fusion tape (
adhesive tape, tape coated with thermosetting resin), 19.
·····resin. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 Figure 3
Claims (1)
子の少なくとも弾性表面波が伝播する面上に空間を保持
するように熱融着テープまたは粘着テープあるいは熱硬
化性樹脂を塗布したテープで上記素子を覆って熱融着さ
せ密封した後、全体を樹脂でモールドすることを特徴と
する弾性表面波フィルタの製造法。The surface acoustic wave filter element mounted on the lead frame is covered with a heat-sealing tape, an adhesive tape, or a tape coated with a thermosetting resin so as to maintain a space on at least the surface where the surface acoustic waves propagate. A method of manufacturing a surface acoustic wave filter, which is characterized by heat-sealing and sealing, and then molding the entire surface with resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6144482A JPS58178616A (en) | 1982-04-12 | 1982-04-12 | Production of filter for surface acoustic wave |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6144482A JPS58178616A (en) | 1982-04-12 | 1982-04-12 | Production of filter for surface acoustic wave |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58178616A true JPS58178616A (en) | 1983-10-19 |
Family
ID=13171237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6144482A Pending JPS58178616A (en) | 1982-04-12 | 1982-04-12 | Production of filter for surface acoustic wave |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58178616A (en) |
-
1982
- 1982-04-12 JP JP6144482A patent/JPS58178616A/en active Pending
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