JPS58175661U - Highly integrated hybrid integrated circuit - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

図面は本考案に係る高集積混成集積回路の実施例を示す
もので、第１図は高集積混成集積回路の正面断面図、第
２図は同一部破断外観斜視図である。The drawings show an embodiment of a highly integrated hybrid integrated circuit according to the present invention. FIG. 1 is a front sectional view of the highly integrated hybrid integrated circuit, and FIG. 2 is a partially cutaway external perspective view of the same.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 長方形セラミック基板の上面に、該上面に形成される第
１のパターンと接続させて半導体素子を搭載し、前記セ
ラミック基板の上面に前記半導体素子を密閉するセラミ
ックケースを取り付けるとともに、前記セラミック基板
の側面に、該側面に−前記第１の回路と接続して形成さ
れた第２のパターンと接続させて密閉を必−としない回
路部品を搭載し、さらに前記セラミック基板の下部に、
前記第２のパターンと接続される実装用接続部を設けた
ことを特徴とする高集積混成集積回路。A semiconductor element is mounted on the upper surface of a rectangular ceramic substrate in connection with a first pattern formed on the upper surface, a ceramic case for sealing the semiconductor element is attached to the upper surface of the ceramic substrate, and a side surface of the ceramic substrate is mounted. A circuit component that does not require sealing is mounted on the side surface of the ceramic substrate by being connected to a second pattern formed in connection with the first circuit, and further, a circuit component that does not require sealing is mounted on the lower part of the ceramic substrate.
A highly integrated hybrid integrated circuit characterized in that a mounting connection part is provided to be connected to the second pattern.