JPS58171315U - Resin mold equipment - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の半導体装置の横断面図、第２図は第１図
の側断面図、第３図は樹脂モールド方法を説明するため
の側断面図、第４図は第１図の下面図、第５図は本案の
一実施例を示す側断面図、第６図は上部金型の下面図、
第７図〜第８図は樹脂モールド方法の説明図であって、
第７図は半導　　□体装置構成体の平面図、第８図は上
部金型、下部金型へのセット状態番示す側断面図である
。 図中、１は上部金型、２，６はキャビティ、３はパイプ
、３ａは下端、５は下部金型、１２はエヤベントである
。Fig. 1 is a cross-sectional view of a conventional semiconductor device, Fig. 2 is a side sectional view of Fig. 1, Fig. 3 is a side sectional view for explaining the resin molding method, and Fig. 4 is a bottom view of Fig. 1. Figure 5 is a side sectional view showing an embodiment of the present invention, Figure 6 is a bottom view of the upper mold,
FIG. 7 to FIG. 8 are explanatory diagrams of the resin molding method,
FIG. 7 is a plan view of the semiconductor device assembly, and FIG. 8 is a side sectional view showing the state of setting in the upper mold and the lower mold. In the figure, 1 is an upper mold, 2 and 6 are cavities, 3 is a pipe, 3a is a lower end, 5 is a lower mold, and 12 is an air vent.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 上部金型と下部金型とからなり、上部金型又は下部金型
のキャビティ内壁面の所望部所に弾性部材よりなるパイ
プを、下端が若干突出するように植設したことを特徴と
する樹脂モールド装置。A resin comprising an upper mold and a lower mold, and characterized in that a pipe made of an elastic member is implanted at a desired location on the inner wall surface of the cavity of the upper mold or the lower mold so that the lower end slightly protrudes. mold equipment.