JPS58171315U - Resin mold equipment - Google Patents
Resin mold equipmentInfo
- Publication number
- JPS58171315U JPS58171315U JP6884282U JP6884282U JPS58171315U JP S58171315 U JPS58171315 U JP S58171315U JP 6884282 U JP6884282 U JP 6884282U JP 6884282 U JP6884282 U JP 6884282U JP S58171315 U JPS58171315 U JP S58171315U
- Authority
- JP
- Japan
- Prior art keywords
- resin mold
- mold equipment
- mold
- equipment
- upper mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の半導体装置の横断面図、第2図は第1図
の側断面図、第3図は樹脂モールド方法を説明するため
の側断面図、第4図は第1図の下面図、第5図は本案の
一実施例を示す側断面図、第6図は上部金型の下面図、
第7図〜第8図は樹脂モールド方法の説明図であって、
第7図は半導 □体装置構成体の平面図、第8図は上
部金型、下部金型へのセット状態番示す側断面図である
。
図中、1は上部金型、2,6はキャビティ、3はパイプ
、3aは下端、5は下部金型、12はエヤベントである
。Fig. 1 is a cross-sectional view of a conventional semiconductor device, Fig. 2 is a side sectional view of Fig. 1, Fig. 3 is a side sectional view for explaining the resin molding method, and Fig. 4 is a bottom view of Fig. 1. Figure 5 is a side sectional view showing an embodiment of the present invention, Figure 6 is a bottom view of the upper mold,
FIG. 7 to FIG. 8 are explanatory diagrams of the resin molding method,
FIG. 7 is a plan view of the semiconductor device assembly, and FIG. 8 is a side sectional view showing the state of setting in the upper mold and the lower mold. In the figure, 1 is an upper mold, 2 and 6 are cavities, 3 is a pipe, 3a is a lower end, 5 is a lower mold, and 12 is an air vent.
Claims (1)
のキャビティ内壁面の所望部所に弾性部材よりなるパイ
プを、下端が若干突出するように植設したことを特徴と
する樹脂モールド装置。A resin comprising an upper mold and a lower mold, and characterized in that a pipe made of an elastic member is implanted at a desired location on the inner wall surface of the cavity of the upper mold or the lower mold so that the lower end slightly protrudes. mold equipment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6884282U JPS58171315U (en) | 1982-05-11 | 1982-05-11 | Resin mold equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6884282U JPS58171315U (en) | 1982-05-11 | 1982-05-11 | Resin mold equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58171315U true JPS58171315U (en) | 1983-11-16 |
JPH036408Y2 JPH036408Y2 (en) | 1991-02-19 |
Family
ID=30078593
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6884282U Granted JPS58171315U (en) | 1982-05-11 | 1982-05-11 | Resin mold equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58171315U (en) |
-
1982
- 1982-05-11 JP JP6884282U patent/JPS58171315U/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH036408Y2 (en) | 1991-02-19 |
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