JPS58158448U - semiconductor heat dissipation device - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の半導体放熱装置、ａ図は斜視図、ｂはａ
の直線Ａ−Ａ’における断面図、第２図は本考案の半導
体放熱装置の一部破断斜視図、第３図は第２図の直線Ｂ
−Ｂ’における断面図、第４図は接続金属端子の正面図
、を示す。 １：Ｉｃ、２：半導体素子、３：■Ｃリード端子、４：
ＩＣケース、５．６＝放熱フィン体、６−１：放熱フィ
ン体基板、６〜２＝放熱フイン、６−３：平面部、６−
４：絶縁ブロック体の装着孔、７：接続用金属端子、７
−１：あご部、８：絶縁ブロック体、８−１：端子挿入
孔、８−２：係止段部、９：印刷配線板、１０ニスルー
ホール。Figure 1 is a conventional semiconductor heat dissipation device, figure a is a perspective view, figure b is a
FIG. 2 is a partially cutaway perspective view of the semiconductor heat dissipation device of the present invention, and FIG. 3 is a cross-sectional view taken along straight line A-A' in FIG.
-B' is a sectional view, and FIG. 4 is a front view of the connecting metal terminal. 1: Ic, 2: Semiconductor element, 3: ■C lead terminal, 4:
IC case, 5.6=radiation fin body, 6-1: radiation fin body board, 6-2=radiation fin, 6-3: flat part, 6-
4: Mounting hole of insulating block body, 7: Metal terminal for connection, 7
-1: Jaw portion, 8: Insulating block body, 8-1: Terminal insertion hole, 8-2: Locking step portion, 9: Printed wiring board, 10 Varnish through hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 放熱フィン体基板の中央に平面部を、前記平面部の左右
に放熱フィンおよび前記平面部に２個の絶縁ブロック体
の装着孔を設けた放熱フィン体とＩＣＩＪ−ド線端子を
挿入する内部に係止段部を設けた端子挿入孔を穿設した
絶縁ブ冶ツク体を設け、前記装着孔に前記絶縁ブロック
体を装着固定し、あご部を有する接続用金属端子を前記
端子挿入孔に挿入し、係止段部にあご部を係止して放熱
フィン体部を構成し、印刷配線板のスルホールに前記放
熱フィン体部の接続用金属端子を挿入して放熱フィン体
部を印刷配線板に載置し、前記端子挿入孔にＩＣＩＪ−
ド線端子を挿入し、ＩＣＩＪ−Ｆ線端子と接続用金属端
子を機械的、電気的に接続してなる半導体放熱装置。The heat dissipation fin body has a flat part in the center of the board, heat dissipation fins on the left and right sides of the flat part, and mounting holes for two insulating blocks in the flat part, and an inside into which the ICIJ-wire terminal is inserted. An insulating block body is provided with a terminal insertion hole provided with a locking step, the insulating block body is installed and fixed in the mounting hole, and a connecting metal terminal having a jaw portion is inserted into the terminal insertion hole. The heat dissipating fin body is constructed by locking the jaws to the locking steps, and the connecting metal terminals of the heat dissipating fin body are inserted into the through holes of the printed wiring board to connect the heat dissipating fin body to the printed wiring board. and insert the ICIJ- into the terminal insertion hole.
A semiconductor heat dissipation device in which an ICIJ-F wire terminal is inserted and the ICIJ-F wire terminal and a connecting metal terminal are mechanically and electrically connected.