JPS58155734A - Wafer probing device - Google Patents
Wafer probing deviceInfo
- Publication number
- JPS58155734A JPS58155734A JP3853682A JP3853682A JPS58155734A JP S58155734 A JPS58155734 A JP S58155734A JP 3853682 A JP3853682 A JP 3853682A JP 3853682 A JP3853682 A JP 3853682A JP S58155734 A JPS58155734 A JP S58155734A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- probe
- scope
- fiberscope
- monitor television
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
この発明に、半導体のウェハブロービング装置(以下ウ
ニハブルーバと称す)にi学システムを付設した装置に
関するものである〇
従来この種の装置として111図に示すものがあった。[Detailed Description of the Invention] This invention relates to a semiconductor wafer probing device (hereinafter referred to as a unihub louver) equipped with an i-science system. Conventionally, there was a device of this type as shown in Fig. 111. .
図において、(l)は全体を構成するウニハブルーバ、
l!lt!多数のプローブ(3)を扶植したプローブカ
ード、+41t;[被測定牛導体つェハ以下つエノ1と
称す、(6)ニウエハ載置台、+61Hプ四−プとウェ
ハ上の電極管観察する顕微鏡、(7)に自動的に゛ウエ
ノ1をローディング又はアンローディングするカセット
である。In the figure, (l) is the Unihub Louver that makes up the whole;
l! lt! Probe card with a large number of probes (3) implanted, +41t; (6) wafer mounting table, +61H and a microscope for observing electrode tubes on the wafer; , (7) is a cassette that automatically loads or unloads Ueno 1.
次に動作について説明する。ウェハ+41の各チップの
電極上にウニハブルーバ(1)に設置したプローブカー
V (21に扶植した多数の金属探針(プローブ)13
1 K’接触させ、試験装置から電圧、電aめるい框信
号を印カロし試験が行なわれる。連続してウェハ上の各
チップを試験するためには、条件の異なった新品種毎に
轍初框つエハプローバ111に取付けられた顕微鏡(6
)により肉眼でチップの電極上へ多数のプローブが全a
接触する様に位置合せ會行い、この条件tウニハブルー
バl’l lのCPU内のメモリに記憶させる。以降に
自動的に各チップに移動し電極に箒触してウェハを試験
する。Next, the operation will be explained. A large number of metal probes (probes) 13 are placed on the probe car V (21) installed on the Unihub Louver (1) on the electrode of each chip of the wafer +41.
A test is performed by making contact with 1 K' and applying a voltage and electric frame signal from the test equipment. In order to continuously test each chip on a wafer, a microscope (6
), the large number of probes can be seen with the naked eye on the electrodes of the chip.
They are aligned so that they are in contact with each other, and this condition is stored in the memory in the CPU of the hub louver. Thereafter, the wafer is tested by automatically moving to each chip and touching the electrodes with a broom.
また、最近のウニハブルーバに複数のウニへ全力竜ット
(7)に人ね自動的にウェハ載置台(ウェハチャック)
(5)にローディングしたり、試験完了後にウェハ全カ
セットにアンローディングする装置が製造されている。In addition, the recent unihub ruba can automatically handle multiple wafers (7) using a wafer mounting table (wafer chuck).
(5) Equipment has been manufactured that loads all wafers into cassettes and unloads all wafers into cassettes after testing is completed.
従来のウニハブルーバは前述した様に最初に、拳微廓で
肉@により位1合せtしなければならない欠点がある。As mentioned above, the conventional sea urchin rubber has the disadvantage that it must first be aligned with the meat using a fist.
また最近のVLSIに、チップ上の電極数が200以上
にも達し、プローブの重なり合いのため顕微鏡から全数
の電極が観察できず位置合せが困難である欠点があった
。Furthermore, recent VLSIs have had the disadvantage that the number of electrodes on a chip has reached over 200, and that all the electrodes cannot be observed from a microscope due to overlapping probes, making alignment difficult.
この発明に上記のような従来のものの欠点を除去するた
めになされたもので、クエハプローバにファイバースコ
ープより成る光学システムを設置することにより、モニ
タテレビにチップの電極及びプローブを映像し、位置合
せt容易にできるウエハブローパを提供することt目的
としている〇以下、この発明の一実施例11に2図につ
いて説明する。(1)〜(1)に前記と同様な動作であ
り、これ゛にプローブ(3)とウェハ(1上のチップが
見易i任意の位置にファイバースコープial を設置
し、これtモニタテレビ(9)に接続する0
oiArz元源用電源でファイバースコープ(8)の先
端から発光し、観察対称物を照明する0手前のコントロ
ーラ(ロ)により、ファイバースコープの先端の照度及
びON、 OFF 、先端の角ji[Thコント費−ル
するO
Il!察対称に、モニタテレビ(9)に映像されるので
、プローブとウェハ上の電極の接触が容易に位置合せで
きる。This invention was made to eliminate the above-mentioned drawbacks of the conventional ones, and by installing an optical system consisting of a fiber scope on the query probe, the electrodes and probes of the chip can be imaged on a monitor television, and the alignment can be performed. The purpose is to provide a wafer bumper that can be easily manufactured.Hereinafter, an 11th embodiment of the present invention will be described with reference to FIGS. (1) to (1) are the same operations as above, in which the probe (3) and the chip on the wafer (1) are easily visible. The controller (b) in front of the fiberscope (8) lights up the fiberscope (8) using the 0 oiArz source power supply connected to the 0 oiArz source power source to illuminate the object to be observed. Since the angle ji [Th control cost O Il!] is imaged on the monitor television (9), the contact between the probe and the electrode on the wafer can be easily aligned.
以上の1うに、この発明にウエハプローバに774バー
スコープとモニタテレビにより、初期ノ位置合せを行う
様にしたので、従来顕微鏡で不可能でめった多ピンのウ
ェハプロービングが可能となった0
なお、上記実施例でに、ファイバースコープを1本の場
合について記述したが、複数のファイバースコープ會設
置し、これをコントローラで切替えることも可能であり
、さらに確実に位置合せが行なえる〇
また、モニタテレビt−接続する例を示したが、ファイ
バースコープに接眼レンズ又にカメラ接続も可能である
〇
以上のように、この発明によればウエハプローバの位置
合せ會ファイバースコープで構成したので、多ビンのウ
ェハプロービングが容易にしかも確実に行なえるようK
なった0また、肉眼による顕微鏡観察に比べ、作業者の
疲労it−大幅に軽減することができた。As mentioned above, in this invention, the wafer prober is equipped with a 774 bar scope and a monitor television to perform initial alignment, making it possible to perform multi-pin wafer probing, which was previously impossible with a microscope. Although the above embodiment describes the case of one fiberscope, it is also possible to install multiple fiberscopes and switch between them using a controller, which allows for more reliable alignment. Although an example of a T-connection is shown, it is also possible to connect an eyepiece or a camera to a fiberscope. As described above, according to the present invention, since the wafer prober alignment is configured with a fiberscope, it is possible to connect a multi-bin K for easy and reliable wafer probing
In addition, compared to microscopic observation with the naked eye, worker fatigue was significantly reduced.
gt図に従来のウエハプローパを示す外観図、第2図に
この発明の一実施例によるウエハプローパを示す外観図
でるる。
図において、(1)・・・ウエハプローパ、(21・・
・プローブカード、(8)・・・プローブ、(4)・・
・ウェハ、(6)・・・ウェハチャツク、(6)・・・
顕微鏡、(7)・・・ローダ及びアンローダ用カセット
、(8j・・・ファイバースコープ、(9)・・・モニ
タテレビ、 (101・・・光源用電源、aυ・・・コ
ントローラでろる〇
なお、図中、同一符号に同一、又に相当部分を示す。
代理人 葛野信−
第1図
第2図
手続補正書(自発)
特許11艮官殿
1、・11件の表示 特願昭 6マ一5ssss
号2、発明の名称 ウェハプロービング装置3、
補11:、をする晶
明細書の発明の詳細な説明の欄
6、補正の内容
明細書をつぎのとおり訂正する。Fig. gt is an external view showing a conventional wafer proper, and Fig. 2 is an external view showing a wafer proper according to an embodiment of the present invention. In the figure, (1)... wafer proper, (21...
・Probe card, (8)... Probe, (4)...
・Wafer, (6)...Wafer chuck, (6)...
Microscope, (7)...Cassette for loader and unloader, (8j...Fiberscope, (9)...Monitor TV, (101...Power source for light source, aυ...Controller) In the figures, the same reference numerals indicate the same or corresponding parts. Agent Makoto Kazuno - Figure 1 Figure 2 Procedural amendment (spontaneous) Patent No. 11 Public Prosecutor's Office No. 1, Display of 11 cases Patent application Sho 6 Ma1 5ssss
No. 2, Title of the invention: Wafer probing device 3,
Supplement 11: Column 6 of the Detailed Description of the Invention in the Crystal Specification, the description of the contents of the amendment, is amended as follows.
Claims (1)
と、このファイバースコープの前置及び角f′1に変更
するコントローラと、上記ファイバースコープに接続さ
れたモニタテレビとt備えたことYr特徴とするウェハ
ブロービング製置0It is characterized by comprising a 7' eyeglass scope placed at a desired position on the wafer, a controller for changing the front position and angle f'1 of this fiberscope, and a monitor television connected to the fiberscope. Wafer brobbing production 0
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3853682A JPS58155734A (en) | 1982-03-10 | 1982-03-10 | Wafer probing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3853682A JPS58155734A (en) | 1982-03-10 | 1982-03-10 | Wafer probing device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58155734A true JPS58155734A (en) | 1983-09-16 |
Family
ID=12528000
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3853682A Pending JPS58155734A (en) | 1982-03-10 | 1982-03-10 | Wafer probing device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58155734A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61206237A (en) * | 1985-03-08 | 1986-09-12 | Nippon Maikuronikusu:Kk | Semiconductor wafer prober |
JPS6376342A (en) * | 1986-09-18 | 1988-04-06 | Tokyo Electron Ltd | Probe device |
JPS63114228A (en) * | 1986-10-31 | 1988-05-19 | Tokyo Electron Ltd | Tester |
JPS63204153A (en) * | 1987-02-19 | 1988-08-23 | Tokyo Electron Ltd | Probe |
JPH01158489A (en) * | 1987-09-02 | 1989-06-21 | Tokyo Electron Ltd | Electric characteristics testing method by prober |
JPH02154442A (en) * | 1988-12-06 | 1990-06-13 | Tokyo Electron Ltd | Probe device |
-
1982
- 1982-03-10 JP JP3853682A patent/JPS58155734A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61206237A (en) * | 1985-03-08 | 1986-09-12 | Nippon Maikuronikusu:Kk | Semiconductor wafer prober |
JPS6376342A (en) * | 1986-09-18 | 1988-04-06 | Tokyo Electron Ltd | Probe device |
JPS63114228A (en) * | 1986-10-31 | 1988-05-19 | Tokyo Electron Ltd | Tester |
JPS63204153A (en) * | 1987-02-19 | 1988-08-23 | Tokyo Electron Ltd | Probe |
JPH01158489A (en) * | 1987-09-02 | 1989-06-21 | Tokyo Electron Ltd | Electric characteristics testing method by prober |
JPH02154442A (en) * | 1988-12-06 | 1990-06-13 | Tokyo Electron Ltd | Probe device |
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