JPS58140690U - power supply - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本考案の一実施例を示すもので、第１図はカバー
を取外した状態の正面図、第２図はカバーを取付けた状
態の第１図■−■線断面図、第３図は第２図■−■線断
面図である。 Ｒ３・・・上部室、Ｒ４・・・下部室、Ｒ５・・・前部
室、Ｒ６・・・後部室、１・・・ハウジング、４゜・・
・隔壁板、叶・・放熱板、１２・・・電力用半導体素子
、１５・・・冷却ファン、１６・・・吸気口、１７・・
・通気口、１８・・・排気口。The drawings show an embodiment of the present invention. Figure 1 is a front view with the cover removed, Figure 2 is a sectional view taken along the line ■-■ in Figure 1 with the cover attached, and Figure 3 is a cross-sectional view taken along the line ■-■ in Figure 1 with the cover attached. FIG. 2 is a sectional view taken along the line ■-■. R3... Upper chamber, R4... Lower chamber, R5... Front chamber, R6... Rear chamber, 1... Housing, 4°...
・Partition plate, leaf... Heat sink, 12... Power semiconductor element, 15... Cooling fan, 16... Air intake, 17...
・Vent, 18...Exhaust port.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 密閉ハウジング１内を隔壁板４２により上部室Ｒ３と下
部室Ｒ４とに区画し、該上部室Ｒ３を放熱板５により前
部室Ｒ３と後部室Ｒ６とに区画し、該放熱板５の前面に
多数の電力用半導体素子１２を密着して取付け、前記下
部室Ｒ１内に冷却ファン１５を配設し、前記下部室Ｒ４
の前壁に吸気口１６を、また前記隔壁板４゜に前記下部
室Ｒ１と前記後部室Ｒ６とを連通ずる通気口１７を、さ
らに前記後部室Ｒ６の土壁に排気口１８をそれぞれ設け
てなる、電源装置。The inside of the sealed housing 1 is divided into an upper chamber R3 and a lower chamber R4 by a partition plate 42, and the upper chamber R3 is divided into a front chamber R3 and a rear chamber R6 by a heat sink 5. A cooling fan 15 is disposed in the lower chamber R1, and a cooling fan 15 is installed in the lower chamber R4.
An intake port 16 is provided in the front wall of the partition wall, a ventilation port 17 is provided in the partition plate 4° for communicating the lower chamber R1 and the rear chamber R6, and an exhaust port 18 is provided in the earthen wall of the rear chamber R6. A power supply.