JPS5814044B2 - positive characteristic porcelain - Google Patents
positive characteristic porcelainInfo
- Publication number
- JPS5814044B2 JPS5814044B2 JP53163564A JP16356478A JPS5814044B2 JP S5814044 B2 JPS5814044 B2 JP S5814044B2 JP 53163564 A JP53163564 A JP 53163564A JP 16356478 A JP16356478 A JP 16356478A JP S5814044 B2 JPS5814044 B2 JP S5814044B2
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- positive characteristic
- porcelain
- positive
- layers
- electrode layer
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Description
【発明の詳細な説明】
本発明は正の抵抗温度係数を有するチタン酸バリウム系
半導体磁器（以下正特性磁器と記す）に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to barium titanate-based semiconductor porcelain (hereinafter referred to as positive characteristic porcelain) having a positive temperature coefficient of resistance.
正特性磁器は、キュリ一温度を適当に選定することによ
り任意の発熱温度が得られること、キュリ一温度を超え
ると急激に抵抗値が増大し自己温度制御機能または電流
制機能を発揮すること、さらに速応性に富み起動と殆ん
ど同時に定常温度まで温度が上昇すること等々の優れた
特長があり、従来より種々の発熱装置あるいは電流制御
素子として使用されている。With positive characteristic porcelain, any heat generation temperature can be obtained by appropriately selecting the Curie temperature, and when the Curie temperature is exceeded, the resistance value increases rapidly and exhibits a self-temperature control function or current control function. Furthermore, it has excellent features such as being highly responsive and allowing the temperature to rise to a steady state almost at the same time as startup, and has conventionally been used as a variety of heat generating devices or current control elements.
第１図は、正特性磁器の従来例を示している。FIG. 1 shows a conventional example of positive characteristic porcelain.
図示する如く従来の正特性磁器は正特性磁器素体１の両
面にニッケル無電解メッキまたは銀合金ペースト印刷法
等の方法により、電極２，３をそれぞれ被着した構造を
有している。As shown in the figure, the conventional positive characteristic porcelain has a structure in which electrodes 2 and 3 are respectively adhered to both sides of a positive characteristic porcelain body 1 by a method such as electroless nickel plating or silver alloy paste printing.
上述のように、従来の正特性磁器は１つのペレットで成
る正特性磁器素体１の両面に外部との接続用電極２，３
を設けた構造であったから、次のような欠点があった。As mentioned above, the conventional positive characteristic porcelain has electrodes 2 and 3 for connection with the outside on both sides of the positive characteristic porcelain body 1 made of one pellet.
This structure had the following drawbacks:
（イ）発熱量の増大を図るには、正特性磁器素体１を大
型化しなければならないから、小型大容量化が困難であ
る。(a) In order to increase the calorific value, it is necessary to increase the size of the positive characteristic porcelain element 1, which makes it difficult to increase the size and capacity.
特に正特性磁器をカラーテレビのシャドーマスクの消磁
回路における電流制御用素子として使用する場合や、電
気毛布等の温度制御用素子として使用する場合には、実
装密度を高くすることが望まれるわけで、第１図のよう
な構造ではこの高密度実装化の要請に十分には応えるこ
とができない。In particular, when using positive characteristic porcelain as a current control element in the degaussing circuit of a color television shadow mask, or as a temperature control element for electric blankets, etc., it is desirable to increase the packaging density. , the structure as shown in FIG. 1 cannot fully meet this demand for high-density packaging.
（ロ）複数個の正特性磁器を並列的に使用すれば、大容
量化を達成し得るが、小型化の手段にはならない。(b) If a plurality of positive characteristic ceramics are used in parallel, it is possible to increase the capacity, but this is not a means for downsizing.
また、並列使用の場合、各正特性磁器を熱的に結合させ
るため、接着材を用いて互いに重ね合せる等の構造を取
らなければならず、接着材による熱容量増大、それによ
る即応性の悪化、熱特性の変動等を招き、更に組立が面
倒になる等の問題を生じる。In addition, in the case of parallel use, in order to thermally bond each positive characteristic porcelain, it is necessary to use a structure such as stacking them on top of each other using an adhesive, which increases the heat capacity due to the adhesive and deteriorates quick response. This causes problems such as fluctuations in thermal characteristics and further troublesome assembly.
（ハ）第１図の構造の正特性磁器は、電極２，３のある
表面側で低く、中間部で高くなる温度勾配を示す。(c) The positive characteristic porcelain having the structure shown in FIG. 1 exhibits a temperature gradient that is low on the surface side where the electrodes 2 and 3 are located and high in the middle part.
このことは、正特性磁器素体１の中間部に発生した熱の
表面方向への熱伝導が効率が非常に悪く、即応性に欠け
ることを意味する。This means that the efficiency of heat conduction toward the surface of the heat generated in the intermediate portion of the positive characteristic porcelain body 1 is very low, and the immediate response is lacking.
（ニ）しかも前記温度勾配によって正特性磁器素体１が
層状に熱破壊を起すことがあり、信頼性に欠ける難点が
ある。(d) Furthermore, the positive characteristic ceramic element 1 may undergo thermal destruction in layers due to the temperature gradient, resulting in a disadvantage of lack of reliability.
（ホ）正特性磁器素体１の厚さを薄くすれば、温度勾配
を緩和して、熱破壊を防止し、また即応性を向上させる
ことができるが、正特性磁器素体１の機械的強度が弱く
なり、製造及び組込工程において簡単に破損してしまう
。(E) If the thickness of the positive characteristic porcelain body 1 is reduced, the temperature gradient can be alleviated, thermal damage can be prevented, and the responsiveness can be improved. Its strength is weakened and it is easily damaged during the manufacturing and assembly process.
このため、正特性磁器素体１の薄型化、それによる温度
勾配の緩和及び即応性の向上に限界があった。For this reason, there is a limit to the ability to reduce the thickness of the positive characteristic porcelain body 1, thereby reducing the temperature gradient and improving responsiveness.
本発明は上述する従来からの技術的課題を解決し、小型
大容量で、熱応答性もしくは即応性に優れ、機械的強度
が大きく、熱的破壊を受け難く、しかも電極層の酸化に
よる劣化、剥離、半田喰われまたは外的損傷等を生じる
ことがなく、加えて製造が容易で量産性に富む高信頼度
の正特性磁器を提供することを目的とする。The present invention solves the above-mentioned conventional technical problems, and has a small size and large capacity, excellent thermal responsiveness or quick response, high mechanical strength, and is not susceptible to thermal damage. It is an object of the present invention to provide highly reliable positive characteristic porcelain that does not cause peeling, solder eating, external damage, etc., is easy to manufacture, and is highly suitable for mass production.
上記目的を達成するため、本発明に係る正特性磁器は、
焼結により一体化された正特性磁器焼結体の内部に正特
性磁器層と電極層とを交互に有して成ることを特徴とす
る。In order to achieve the above object, the positive characteristic porcelain according to the present invention:
It is characterized by having positive characteristic porcelain layers and electrode layers alternately inside a positive characteristic porcelain sintered body integrated by sintering.
以下実施例たる添付図面を参照し、本発明の内容を具体
的に詳説する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The content of the present invention will be specifically explained in detail below with reference to the accompanying drawings which are examples.
第２図は本発明に係る正特性磁器の部分欠損斜視図であ
り、焼結により一体化された正特性磁器焼結体の内部に
、正特性磁器層４と電極層５とを交互に設けた構造とな
っている。FIG. 2 is a partially cutaway perspective view of the positive characteristic porcelain according to the present invention, in which positive characteristic porcelain layers 4 and electrode layers 5 are alternately provided inside the positive characteristic porcelain sintered body integrated by sintering. It has a similar structure.
前記電極層５の各々は、この実施例では、隔一毎に正特
性磁器焼結体の両端面に設けた外部電極６ａ，６ｂにそ
れぞれ導通接続させた構造となっている。In this embodiment, each of the electrode layers 5 is electrically connected to external electrodes 6a and 6b provided on both end faces of the positive characteristic ceramic sintered body at intervals.
したがって、この実施例に示す正特性磁器は、第５図に
示す如く、外部電極６ａ−６ｂ間に複数の正特性サーミ
スタを電気的に並列に接続したものとして表現できる。Therefore, the PTC porcelain shown in this embodiment can be expressed as a plurality of PTC thermistors electrically connected in parallel between the external electrodes 6a and 6b, as shown in FIG.
上述のように、本発明に係る正特性磁器は、焼結により
一体化された正特性磁器焼結体の内部に正特性磁器層４
と電極層５とを交互に設けた構造となっているから、次
のような効果を得ることができる。As described above, the positive characteristic porcelain according to the present invention has the positive characteristic porcelain layer 4 inside the positive characteristic porcelain sintered body integrated by sintering.
Since it has a structure in which the electrode layers 5 and 5 are alternately provided, the following effects can be obtained.
（イ）実施例にも示すように、正特性磁器層４の各各に
よって構成される正特性サーミスタを並列接続等するこ
とにより、簡単に小型大容量のものを得ることができる
。(a) As shown in the embodiments, by connecting the positive temperature coefficient thermistors formed by each of the positive characteristic ceramic layers 4 in parallel, etc., it is possible to easily obtain a small-sized and large-capacity thermistor.
（ロ）正特性磁器焼結体の厚さ方向に正特性磁器層４に
よる正特性サーミスタを複数形成した構造となるので、
焼結体の厚さ方向の温度勾配が著しく緩和され、熱破壊
が起きにくくなる。(b) Since the structure has a plurality of positive temperature coefficient thermistors formed by the positive temperature coefficient ceramic layer 4 in the thickness direction of the positive coefficient ceramic sintered body,
The temperature gradient in the thickness direction of the sintered body is significantly relaxed, making thermal breakdown less likely to occur.
（ハ）正特性磁器層４の各々を薄くしても、全体として
の厚さ及び機械的強度が低下することがない。(c) Even if each of the positive characteristic ceramic layers 4 is made thinner, the overall thickness and mechanical strength do not decrease.
このため、正特性磁器層４を薄くして各正特性サーミス
タの熱応答性を向上させると同時に、温度勾配を緩和さ
せつつ、充分な機械的強度を確保することができる。Therefore, it is possible to improve the thermal response of each PTC thermistor by making the PTC ceramic layer 4 thinner, and at the same time, it is possible to ensure sufficient mechanical strength while alleviating the temperature gradient.
（ニ）正特性サーミスタの個々を構成する正特性磁器層
４の各々が、非常に密にかつ安定に熱結合するので、特
注の安定した高信頼度の正特性磁器が得られる。(d) Since each of the positive temperature coefficient porcelain layers 4 constituting each positive temperature coefficient thermistor is thermally coupled very tightly and stably, a custom-made, stable and highly reliable positive temperature coefficient porcelain can be obtained.
（ホ）電極層５を正特性磁器焼結体の内部に封入したモ
ノリシツクな構造となるので、電極層５の酸化による劣
化、剥離、半田喰われまたは外的損傷等を生じることの
ない高信頼度の正特性磁器が得られる。(e) Since it has a monolithic structure in which the electrode layer 5 is encapsulated inside a positive characteristic ceramic sintered body, it is highly reliable without causing deterioration of the electrode layer 5 due to oxidation, peeling, solder eating, or external damage. A porcelain with positive characteristics is obtained.
（ヘ）後で説明するように、印刷法、ドクターブレード
法またはロールコータ法等によって量産できるので、製
造が非常に容易である。(f) As will be explained later, it can be mass-produced by printing, doctor blade, roll coater, etc., so manufacturing is very easy.
次に第３図により、第２図に示した正特性磁器を、印刷
法を用いて作る場合の工程について説明する。Next, with reference to FIG. 3, a process for producing the positive characteristic porcelain shown in FIG. 2 using a printing method will be explained.
まず第３図ａ１，ａ２に示すように、Ａｌ板１０の表面
上に載置したマイカ板１１上に、正特性磁器粉とバイン
ダと適量の水とから成るペーストを１用いて第１の正特
性磁器層７ａを矩形状に印刷塗布する。First, as shown in FIG. 3 a1 and a2, a first positive coating is applied to a mica plate 11 placed on the surface of an Al plate 10 using a paste consisting of positive characteristic porcelain powder, a binder, and an appropriate amount of water. The characteristic porcelain layer 7a is printed and coated in a rectangular shape.
ここで正特性磁器紛は例えばＢａＴｉ０３（チタン酸バ
リウム）とＹ（イットリウム）との混合物からなる。Here, the positive characteristic porcelain powder is made of, for example, a mixture of BaTi03 (barium titanate) and Y (yttrium).
次にｂ１，ｂ２に示すように、第１の正特性磁器層７ａ
に、三辺に若干の巾ｇ１，ｇ１，ｇ２を残して、１１０
０℃〜１４００℃の焼成温度に耐えることのできる材料
、例えばＰｄ−Ａｇ合金から成る第１の電極層８ａを矩
形状に印刷塗布によって形成する。Next, as shown in b1 and b2, the first positive characteristic ceramic layer 7a
, leave some width g1, g1, g2 on the three sides, 110
A first electrode layer 8a made of a material that can withstand a firing temperature of 0° C. to 1400° C., for example, a Pd-Ag alloy, is formed into a rectangular shape by printing and coating.
更にＣ１，Ｃ２に示すように、第１の電極層８ａ上、お
よび電極層を印刷しなかった前記幅ｇ１，ｇ１，ｇ２の
第１の正特性磁器層７ａ面上に、該正特性磁器層７ａと
，同質の材料を用いて、ほぼ同じ厚さに第２の正特性磁
器層７ｂを印刷塗布によって形成する。Furthermore, as shown in C1 and C2, the positive characteristic ceramic layer is placed on the first electrode layer 8a and on the surface of the first positive characteristic ceramic layer 7a having widths g1, g1, and g2 on which no electrode layer is printed. A second positive characteristic ceramic layer 7b is formed by printing and coating using the same material as 7a and having approximately the same thickness.
次にｄ１，ｄ２に示すように、前記第２の正特性磁器層
７ｂ上に、三辺に幅ｇ１，ｇ１，ｇ２を残して、第２の
電極層８ｂを印刷塗布によって形成する。Next, as shown at d1 and d2, a second electrode layer 8b is formed on the second positive characteristic ceramic layer 7b by printing and coating, leaving widths g1, g1, and g2 on three sides.
この幅ｇ２の不印刷部は、図示のように、前記第１の電
極層８ａのｇ２の不印刷部と反対側の辺に設けられるも
のである。As shown in the figure, this non-printed portion having a width g2 is provided on the side of the first electrode layer 8a opposite to the non-printed portion having a width g2.
次に第２の電極層８ｂおよび幅ｇ１，ｇ１，ｇ２の部分
に、図ｅｌ，ｅ２に示すように、第３の正特性磁器層７
ｃを印刷塗布する。Next, as shown in FIGS.
Print and apply c.
以上のような印刷塗布作業を繰返して最終的には、第４
図に示すように、さらに電極層８ｃ，８ｄ，８ｅ，８ｆ
および正特性磁器層７ｄ，７ｅ，７ｆが交互に重畳され
た積層体を形成することとなる。By repeating the printing and coating work as described above, finally, the fourth
As shown in the figure, further electrode layers 8c, 8d, 8e, 8f
A laminate is formed in which the positive characteristic ceramic layers 7d, 7e, and 7f are alternately superimposed.
この積層体は１１００〜１４００℃程度の温度で焼成焼
結される。This laminate is fired and sintered at a temperature of about 1100 to 1400°C.
第４図に示す如く、積層体の一端面には一つおきの電極
層８ｂ，８ｄ，８ｆの一端縁が現われ、積層体の他端面
には他の電極層８ａ，８ｃ，８ｅの一端縁が現われる。As shown in FIG. 4, one edge of every other electrode layer 8b, 8d, 8f appears on one end surface of the laminate, and one edge of the other electrode layers 8a, 8c, 8e appears on the other end surface of the laminate. appears.
したがって第２図に示したように、積層体の両端面にそ
れぞれ外部電極６ａ，６ｂを形成することにより、電極
層８ａ，８ｃ，８ｅと、外部電極６ａとが電気的に導通
し、他の電極層８ｂ，８ｄ，８ｆと外部電極６ｂとが電
気的に導通する。Therefore, as shown in FIG. 2, by forming external electrodes 6a, 6b on both end faces of the laminate, the electrode layers 8a, 8c, 8e are electrically connected to the external electrode 6a, and other Electrode layers 8b, 8d, 8f and external electrode 6b are electrically connected.
またこの構成のものはモノリシツクな構造となり、電極
層が磁器内に封入された形態をとるから、信頼性が向上
する。Furthermore, since this configuration has a monolithic structure and the electrode layer is encapsulated within the porcelain, reliability is improved.
上記の実施例では、第５図のような並列回路が形成され
るものについて、示したが、第６図ａ〜ｈの工程により
、第７図の端面図、および第８図の回路図に示すような
直列回路を内部に形成するものも実現可能である。In the above embodiment, a parallel circuit as shown in FIG. 5 is formed, but by the steps shown in FIG. 6 a to h, the end view in FIG. 7 and the circuit diagram in FIG. It is also possible to form a series circuit inside as shown.
即ち、第６図において、まずａ，ｂ，ｃに示すように、
前実施例と同様に正特性磁器層７ａ一電極層８ａ一正特
性磁器層７ｂを順次形成し、その後ｄに示すように周囲
に若干の幅を残して電極層８ｘ１を印刷塗布し、ｅに示
すようにその上に正特性磁器層７ｃを印刷塗布し、ｆに
示すように前記電極層Ｘ１と同様に電極層Ｘ２を印加し
、さらにｇに示すように正特性磁器層７ｄを印刷した後
、ｈに示すように、前記電極層８ａと反対側に幅ｇ２を
残して電極層８ｂを印刷し、その上に正特性磁器層７ｅ
（図示せず）を印刷塗布する。That is, in FIG. 6, first, as shown in a, b, and c,
As in the previous example, a positive characteristic ceramic layer 7a, an electrode layer 8a, and a positive characteristic ceramic layer 7b are formed one after another, and then, as shown in d, an electrode layer 8x1 is printed and coated leaving a slight width around the periphery, and as shown in e. After printing a positive characteristic ceramic layer 7c thereon as shown, applying an electrode layer X2 in the same manner as the electrode layer X1 as shown in f, and further printing a positive characteristic ceramic layer 7d as shown in g. , h, an electrode layer 8b is printed leaving a width g2 on the side opposite to the electrode layer 8a, and a positive characteristic ceramic layer 7e is printed thereon.
(not shown) is applied by printing.
これによって第７図に示すような積層体が形成され、電
極層８ａ，８ｂに対し外部電極を接続することによって
、第８図に示すような直列回路を構成する正特性磁器が
実現される。As a result, a laminate as shown in FIG. 7 is formed, and by connecting external electrodes to the electrode layers 8a and 8b, a positive characteristic ceramic configuring a series circuit as shown in FIG. 8 is realized.
この実施例の場合も、第２図〜第５図と同様に、熱応答
性に優れ、機械的強度が大きく、熱的破壊を受け難く、
しかも電極層の酸化による劣化、剥離、半田喰われまた
は外的損傷等を生じることがなく、更に製造が容易で量
産性に富む高信頼度の正特性磁器が得られる。In the case of this example as well, as in FIGS. 2 to 5, it has excellent thermal response, high mechanical strength, and is not susceptible to thermal damage.
In addition, there is no deterioration due to oxidation of the electrode layer, no peeling, no solder eating, no external damage, etc., and it is possible to obtain a highly reliable positive characteristic porcelain that is easy to manufacture and highly suitable for mass production.
なお、以上の説明では、印刷法によって正特性磁器層と
電極層との積層構造を実現することとしたが、所定パタ
ンで電極層を印刷した正特性磁器シートを順次重ね合わ
せることによっても実現することができる。In the above explanation, the laminated structure of the positive characteristic porcelain layer and the electrode layer was realized by the printing method, but it can also be realized by sequentially overlapping positive characteristic porcelain sheets on which electrode layers are printed in a predetermined pattern. be able to.
また上記実施例のようなチップタイプとする代りに外部
回路接続用リードパタンを形成したものも実現できる。Furthermore, instead of using a chip type as in the above embodiment, it is also possible to form a lead pattern for external circuit connection.
以上述べたように、本発明に係る正特性磁器は、焼結に
より一体化された正特性磁器焼結体の内部に正特性磁器
層と電極層とを交互に有して成るととを特徴とするから
、小型大容量で、熱応答性に優れ、機械的強度が大きク
、熱的破壊を受け難く、しかも電極層の酸化による劣化
、剥離、半田喰われまたは外的損傷等を生じることがな
く、更に製造が容易で量産性に富む高信頼性の正特性磁
器を提供することができる。As described above, the positive characteristic porcelain according to the present invention is characterized by having positive characteristic porcelain layers and electrode layers alternately inside the positive characteristic porcelain sintered body integrated by sintering. Because of this, it is small and large in capacity, has excellent thermal response, has high mechanical strength, and is resistant to thermal damage, and does not cause deterioration due to oxidation of the electrode layer, peeling, solder eating, or external damage. Furthermore, it is possible to provide a highly reliable positive characteristic porcelain that is easy to manufacture and has high mass productivity.
第１図は従来の正特性磁器の斜視図、第２図は本発明に
係る正特性磁器の部分欠損斜視図、第３図は同じく印刷
法による工程説明図で、ａ１〜ｅ１は平面図、ａ２〜ｅ
２は端面図、第４図は同じくその端面図、第５図は同じ
くその回路図、第６図は同じく他の実施例における工程
説明図、第７図は第６図の工程で得られた積層体の端面
図、第８図は同じくその回路図をそれぞれ示している。
４・・・・・・正特性磁器層、５・・・・・・電極層、
７ａ〜７ｇ・・・・・・正特性磁器層、８ａ〜８ｆ，８
ｘ１，８ｘ２・・・・・電極層。FIG. 1 is a perspective view of a conventional positive characteristic porcelain, FIG. 2 is a partially cutaway perspective view of a positive characteristic porcelain according to the present invention, FIG. a2~e
2 is an end view, FIG. 4 is an end view thereof, FIG. 5 is a circuit diagram thereof, FIG. 6 is a process explanatory diagram of another embodiment, and FIG. 7 is obtained by the process shown in FIG. 6. An end view of the laminate and FIG. 8 also show a circuit diagram thereof. 4... Positive characteristic ceramic layer, 5... Electrode layer,
7a to 7g...Positive characteristic ceramic layer, 8a to 8f, 8
x1, 8x2...electrode layer.
Claims (1)
正特性磁器層と電極層とを交互に有して成ることを特徴
とする正特性磁器。 ２ 前記電極層は、前記正特性磁器層の各々が互いに電
気的に並列接続となるように接続したことを特徴とする
特許請求の範囲第１項に記載の正特性磁器。 ３ 前記正特性磁器層を介して隣り合う２つの電極層の
うち一方の電極層の一端縁は前記正特性磁器層の一端面
側に現われ、他方の電極層の一端縁は前記正特性磁器層
の他端面側に現われる如く形成したことを特徴とする特
許請求の範囲第２項に記載の正特性磁器。 ４ 前記電極層は、前記正特性磁器層の各々が電気的に
直列接続となるように設けたことを特徴とする特許請求
の範囲第１項に記載の正特性磁器。[Scope of Claims] 1. A positive characteristic porcelain characterized by having positive characteristic porcelain layers and electrode layers alternately inside a positive characteristic porcelain sintered body integrated by sintering. 2. The positive characteristic porcelain according to claim 1, wherein the electrode layer is connected so that each of the positive characteristic porcelain layers is electrically connected in parallel to each other. 3 One end edge of one of the two electrode layers adjacent to each other with the positive characteristic ceramic layer interposed therebetween appears on one end surface side of the positive characteristic ceramic layer, and one end edge of the other electrode layer appears on the one end surface side of the positive characteristic ceramic layer. The positive characteristic porcelain according to claim 2, characterized in that the positive characteristic porcelain is formed so as to appear on the other end surface side. 4. The positive characteristic porcelain according to claim 1, wherein the electrode layer is provided so that each of the positive characteristic porcelain layers is electrically connected in series.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53163564A JPS5814044B2 (en) | 1978-12-26 | 1978-12-26 | positive characteristic porcelain |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53163564A JPS5814044B2 (en) | 1978-12-26 | 1978-12-26 | positive characteristic porcelain |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5588304A JPS5588304A (en) | 1980-07-04 |
| JPS5814044B2 true JPS5814044B2 (en) | 1983-03-17 |
Family
ID=15776292
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP53163564A Expired JPS5814044B2 (en) | 1978-12-26 | 1978-12-26 | positive characteristic porcelain |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5814044B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5719987A (en) * | 1980-07-11 | 1982-02-02 | Tdk Electronics Co Ltd | Heating element |
| JPS5727691U (en) * | 1980-07-24 | 1982-02-13 | ||
| JPS63145294U (en) * | 1988-03-17 | 1988-09-26 | ||
| DE10218154A1 (en) | 2002-04-23 | 2003-11-13 | Epcos Ag | PTC component and method for its production |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5011585A (en) * | 1973-05-31 | 1975-02-06 | ||
| JPS5142042A (en) * | 1974-10-09 | 1976-04-09 | Matsushita Electric Ind Co Ltd | GASUSHIIRUDOAAKUYOSETSUKINO REIKYAKUHOHO |
-
1978
- 1978-12-26 JP JP53163564A patent/JPS5814044B2/en not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5011585A (en) * | 1973-05-31 | 1975-02-06 | ||
| JPS5142042A (en) * | 1974-10-09 | 1976-04-09 | Matsushita Electric Ind Co Ltd | GASUSHIIRUDOAAKUYOSETSUKINO REIKYAKUHOHO |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5588304A (en) | 1980-07-04 |
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