JPS58138728A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS58138728A JPS58138728A JP2300682A JP2300682A JPS58138728A JP S58138728 A JPS58138728 A JP S58138728A JP 2300682 A JP2300682 A JP 2300682A JP 2300682 A JP2300682 A JP 2300682A JP S58138728 A JPS58138728 A JP S58138728A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- micro
- composition
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は電子部品、電気部品の注型材として使用される
エボ中シ樹脂組成物に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an evo medium resin composition used as a casting material for electronic and electrical parts.
この種のエボ＋シ樹脂組成物の低比重化を図るにあたっ
ては、エポ＋シ樹脂に木粉、綿粉等の有機充填材を配合
して低比重化を図るということが成されているが、これ
らの充填材は含水率及び吸湿性が高いために湿気を嫌う
電子部品や電気部品用の材料としては好ましくなく、シ
かも難燃性に劣るという問題があった。In order to lower the specific gravity of this type of Evo+Si resin composition, attempts have been made to mix organic fillers such as wood flour and cotton flour into the Evo+Si resin to lower the specific gravity. Since these fillers have high water content and hygroscopicity, they are not suitable as materials for electronic and electrical parts that dislike moisture, and they also have a problem of poor flame retardancy.
本発明は上記の点に鑑みて成されたものであって、低比
重化を図ることができる上に難燃性を向上することがで
きるエボ士シ樹脂組成物を提供することを目的とするも
のである。The present invention has been made in view of the above points, and an object of the present invention is to provide an embossed resin composition that can reduce specific gravity and improve flame retardancy. It is something.
以下本発明の詳細な説明する。微小中空球体は内部が中
空となつ九低比重材料で、例えばシリカ系微小中空球体
等を使用することができる。微小中空球体を配合するこ
とによって軽菫化を図ることができるものである。微小
中空球体は低比重で上面へ分離して浮き易い友めに比重
は０．５以上が好ましく、ま念吸油量が大きいために全
敏の５０重量％以下配合するのか好ましい。難燃用粉体
としては三酸化アシチ℃シ、水利アルミナ、づ０ム化合
物等を使用することができ、これらの離燃用粉体を配合
することによって、難燃性が向上するものである。これ
らの充填材をエポ士シ樹脂に配合すると共に希釈剤、着
色剤、消泡剤等を配合調整してエポ＋シ樹脂組成物の主
剤を製造するものである。エボ＋シ樹脂組成物の主剤の
粘度けｓ、ｏｏ。The present invention will be explained in detail below. The hollow micro spheres are made of a material with a low specific gravity that is hollow inside, such as silica micro hollow spheres. By incorporating minute hollow spheres, it is possible to reduce the violet. The specific gravity of the micro hollow spheres is preferably 0.5 or more because they have a low specific gravity and tend to separate to the upper surface and float, and since they have a large amount of oil absorption, it is preferable to mix them in an amount of 50% by weight or less of the total weight. As flame-retardant powders, acidic trioxide, alumina, aluminum compounds, etc. can be used, and by blending these flame-retardant powders, flame retardancy is improved. . The main ingredient of the epoxy resin composition is produced by blending these fillers with the epoxy resin and adjusting the blending of diluents, colorants, antifoaming agents, and the like. The viscosity of the main ingredient of the EV+S resin composition is s, oo.
ｃｐｓ／２５℃ 以上が好ましく、粘１が５，０００
ｃｐｓ／２５℃未満の場合には微小中空球体が浮き易く
なつて主剤が２層に分離するものである。アミン系硬化
剤は常温硬化タイプのもので、アミン系硬化剤を上記主
剤に混合してエポキシ樹脂組成物を得るものである。cps/25℃ or higher is preferable, and viscosity 1 is 5,000
When the temperature is lower than cps/25°C, the micro hollow spheres tend to float and the main ingredient separates into two layers. The amine curing agent is a room temperature curing type, and the epoxy resin composition is obtained by mixing the amine curing agent with the above-mentioned main ingredient.
しかして、エポキシ樹脂組成物の主剤を製造するにあ之
っては、エポキシ樹脂に微小中空球体及び難燃用粉体と
、希釈剤、着色剤、消泡剤等を配合して本モミ士す−等
の撹拌機で微小中空球体が潰れないように混合撹拌する
ものである。製造された主剤はアミン系硬化剤と混合す
ることによって室温にて硬化するものであるが、エポキ
シ樹脂に微小中空球体を配合することにより微小中空球
体の低比重によって組成物の＠量化を図ること妙；でき
、るものであり、また難燃用粉体を配合することにより
組成物の難燃性を向上することができるものである。ま
友、微小中空球体を配合することによって組成物の粘度
は非常に高くなり、例えばビスフェノールＡ型エボ士シ
樹脂に対して４５重量慢以上の微小中空球体を配合する
とペーストあるいはパテ状となって液状に々らず、ま友
これ以〜
放置では急に低粘度となって微小中空球体が浮くことに
なるが、充填材として微小中空球体に難燃用粉体を使用
することにより難燃用粉体の配合量を調節することによ
ってエポキシ樹脂組成物の粘度を調節することができ、
従って主剤の粘度を一定の粘度以上に設定することがで
きて微小中空球体が浮いて分離するのを防ぐことができ
るものである。Therefore, when producing the main ingredient of an epoxy resin composition, it is necessary to mix the epoxy resin with micro hollow spheres, flame retardant powder, diluent, coloring agent, antifoaming agent, etc. The mixture is mixed and stirred using a stirrer such as a stirrer to prevent the microscopic hollow spheres from being crushed. The produced base resin cures at room temperature by mixing with an amine-based curing agent, but by blending microscopic hollow spheres with the epoxy resin, the composition can be quantified due to the low specific gravity of the microscopic hollow spheres. It is possible to improve the flame retardancy of the composition by adding a flame retardant powder. Friend, by blending microscopic hollow spheres, the viscosity of the composition becomes extremely high. For example, when microscopic hollow spheres with a weight of 45% or more are blended with bisphenol A type resin, it becomes paste or putty-like. It won't turn into a liquid, but from now on~ If left alone, the viscosity will suddenly decrease and the micro hollow spheres will float, but by using flame retardant powder in the micro hollow spheres as a filler, it will be flame retardant. The viscosity of the epoxy resin composition can be adjusted by adjusting the amount of powder blended,
Therefore, the viscosity of the main agent can be set to a certain level or higher, and it is possible to prevent the microscopic hollow spheres from floating and separating.
上記のように零発明け、エポキシ樹脂に充填材として微
小中空球体及び難燃用粉体を配合したので、微小中空球
体及び難燃用粉体の特性によって組成物の軽量化を図る
と共に難燃性を向ヒし、電子、電気部品の注型材として
好適な組成物が得られるものであり、ま几難燃用粉体を
微小中空球体と併用することによって組成物の粘度を調
節する １？
ことができ微小中空球体が浮き一ヒがるのを防Ｉ卜すて
アミン樹脂と反応して硬化することができ、電子部品等
に熱による悪影響を及ばずことがないものである。As mentioned above, we invented and mixed epoxy resin with microscopic hollow spheres and flame-retardant powder as fillers, so the properties of the micro-hollow spheres and flame-retardant powder make the composition lighter and flame-retardant. The viscosity of the composition can be adjusted by using the flame retardant powder in combination with the micro hollow spheres.1? It can prevent the minute hollow spheres from floating or sagging, and can be cured by reacting with the amine resin, so electronic components and the like will not be adversely affected by heat.
以下本発明を実施例に基いて具体的に説明する〈実施例
１〉
ヒスフェノール系エポキシ樹脂ＥＰ４１００（旭電化■
社商品名）を８０重量Ｓ（以下単に部と記す）１、反応
性希釈剤ＥＤ５０５（旭電化■社商品名）を２０部、プ
０ム化合物を１２部、三酸化アン千ｔシを８ｓ、水利ア
ルミナＨ−３２を４０１８、フィライト（英国製シリカ
微小中空球体、比重０、７、嵩比重０．４）を４０部、
ｔｌ フＯ−（アクリル・系消泡剤、七シサシトケミガ
ル社製）を０．５部、カーポジブラックを１部間合して
均一に混合し、エポキシ樹脂組成物の主剤を製造した。The present invention will be specifically explained below based on Examples. Example 1 Hisphenol-based epoxy resin EP4100 (Asahi Denka)
80 parts by weight S (hereinafter simply referred to as parts) 1, 20 parts of reactive diluent ED505 (product name of Asahi Denka Corporation), 12 parts of a polyamide compound, 8 s of anthic acid trioxide , 4018 parts of Irrigation Alumina H-32, 40 parts of phyllite (British-made silica micro hollow spheres, specific gravity 0.7, bulk specific gravity 0.4),
0.5 parts of tl F-O- (acrylic antifoaming agent, manufactured by Nana Shisashito Chemical Co., Ltd.) and 1 part of Carposi Black were uniformly mixed to produce a main ingredient of an epoxy resin composition.
次に、得られ念主剤をアミン系硬化剤５０部と混合して
常温にて１２時間反応せしめ、エポキシ樹脂組成物の硬
化物を得た。Next, the obtained adhesive was mixed with 50 parts of an amine curing agent and reacted at room temperature for 12 hours to obtain a cured epoxy resin composition.
く比較例１〉
水利アルミナを８０部、フィライトを０部とした他＃′
ｉ実施例１と同様にしてＩボ＋シ樹脂組１又物の硬化物
を得た。Comparative Example 1> Irrigation alumina was 80 parts, phyllite was 0 parts, etc.
In the same manner as in Example 1, a cured product of I resin set I was obtained.
〈実施例２〉
ビスフェノール系エボ士シｍ脂ＥＰ４１００を１００部
、づ０量化合物を１２部、三酸化アシ千ｔシを８部、水
利アルミナＨ−３２を６５１ｉ１４、フィライトを３ｓ
゛部、七タク〇−を０，３部、バーポジブラックを０．
３部間合して均一に混合し、エポキシ樹脂組成物の主剤
を製造し友。<Example 2> 100 parts of bisphenol-based Eboshi resin EP4100, 12 parts of 0-weight compound, 8 parts of reed trioxide, 651i14 of Irrigation Alumina H-32, and 3s of phyllite.
゛ part, 0.3 parts of Shichitaku〇-, 0.3 parts of Barposi Black.
Mix the three parts uniformly to produce the main ingredient of the epoxy resin composition.
樹脂組成物の硬化物を得た。A cured product of the resin composition was obtained.
く比較例２〉
水利アルミナを１００部、フィライトを０都とした他は
実施例２と同様にしてエポキシ樹脂組成物の硬化物を得
友。Comparative Example 2 A cured product of an epoxy resin composition was obtained in the same manner as in Example 2, except that 100 parts of alumina and 0 parts of phyllite were used.
上記実施例１．２及び比較例１．２で得られ＾エポキシ
樹脂組成物の硬化物の比重とａ燃性をがｊＪ定し、また
エポキシ樹脂組成物の主剤と硬化剤の混合直後の粘度を
測定し之結果は次の通りであつたＯ
上表の結果から水利アルミナの一部をフィライトに置き
換えた実施例１．２のものにあっては、比重が大きく低
下し念ことがわかる。また粘度も５０００ ｃｐｓ／２
５℃以上でフィライトの浮きによる分離も見られなかっ
た。The specific gravity and flammability of the cured product of the epoxy resin composition obtained in Example 1.2 and Comparative Example 1.2 above were determined, and the viscosity immediately after mixing the main ingredient and curing agent of the epoxy resin composition was determined. The results were as follows: O From the results in the table above, it can be seen that in Example 1.2, in which part of the water-containing alumina was replaced with phyllite, the specific gravity was greatly reduced. Also, the viscosity is 5000 cps/2
No separation due to floating of phyllite was observed at temperatures above 5°C.
代理人 弁理士 石 １）長 七Agent Patent Attorney Ishi 1) Choshichi
Claims (1)
び難燃用粉体と、アミシ系硬化剤とを配合して成ること
を特徴とするエボ士シ樹脂組成物。(1) An Eboshi resin composition comprising Eboshi resin, micro hollow spheres and flame retardant powder as fillers, and an amici hardening agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2300682A JPS58138728A (en) | 1982-02-15 | 1982-02-15 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2300682A JPS58138728A (en) | 1982-02-15 | 1982-02-15 | Epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58138728A true JPS58138728A (en) | 1983-08-17 |
Family
ID=12098405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2300682A Pending JPS58138728A (en) | 1982-02-15 | 1982-02-15 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58138728A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4689358A (en) * | 1985-08-06 | 1987-08-25 | The Brooklyn Union Gas Company | Insulating polymer concrete |
| JP2008156383A (en) * | 2006-12-20 | 2008-07-10 | Matsushita Electric Works Ltd | Liquid resin composition, semiconductor device and method for producing the same |
| CN101870801A (en) * | 2010-06-09 | 2010-10-27 | 舒城金泽信环保材料有限公司 | High-elasticity epoxy resin |
-
1982
- 1982-02-15 JP JP2300682A patent/JPS58138728A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4689358A (en) * | 1985-08-06 | 1987-08-25 | The Brooklyn Union Gas Company | Insulating polymer concrete |
| JP2008156383A (en) * | 2006-12-20 | 2008-07-10 | Matsushita Electric Works Ltd | Liquid resin composition, semiconductor device and method for producing the same |
| US8106523B2 (en) | 2006-12-20 | 2012-01-31 | Panasonic Electric Works Co., Ltd. | Liquid resin composition, semi-conductor device, and process of fabricating the same |
| CN101870801A (en) * | 2010-06-09 | 2010-10-27 | 舒城金泽信环保材料有限公司 | High-elasticity epoxy resin |
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