JPS58135782U - IC label - Google Patents

IC label

Info

Publication number
JPS58135782U
JPS58135782U JP3222682U JP3222682U JPS58135782U JP S58135782 U JPS58135782 U JP S58135782U JP 3222682 U JP3222682 U JP 3222682U JP 3222682 U JP3222682 U JP 3222682U JP S58135782 U JPS58135782 U JP S58135782U
Authority
JP
Japan
Prior art keywords
pin
label
package
dimensions
external dimensions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3222682U
Other languages
Japanese (ja)
Inventor
權代　裕治
Original Assignee
日本電気アイシ−マイコンシステム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気アイシ−マイコンシステム株式会社 filed Critical 日本電気アイシ−マイコンシステム株式会社
Priority to JP3222682U priority Critical patent/JPS58135782U/en
Publication of JPS58135782U publication Critical patent/JPS58135782U/en
Pending legal-status Critical Current

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  • Credit Cards Or The Like (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図、第２図、第３図、第４図は本考案に係るＩＣ用
ラベルの各実施例を示す正面図である。 １・・・ラベル用紙、２・・・ＩＣパッケージ、３・・
・ＩＣパッケージのピン、ａ・・・ピン番号。FIG. 1, FIG. 2, FIG. 3, and FIG. 4 are front views showing each embodiment of the IC label according to the present invention. 1... Label paper, 2... IC package, 3...
・IC package pin, a...pin number.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ラベル用紙の外形寸法を、ＩＣパッケージの外形寸法よ
り小さく、かつピンに接触することなくピンの内側に貼
付けられる寸法とし、その表面にピン番号をＩＣパッケ
ージのピン位置に合せて付すとともに、その裏面に粘着
剤を塗布したことを特徴とするＩＣ用ラベル。The external dimensions of the label paper are smaller than the external dimensions of the IC package, and dimensions that allow it to be pasted on the inside of the pin without touching the pin, and the pin number is attached on the front side to match the pin position on the IC package, and on the back side. An IC label characterized by having an adhesive applied to it.
JP3222682U 1982-03-08 1982-03-08 IC label Pending JPS58135782U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3222682U JPS58135782U (en) 1982-03-08 1982-03-08 IC label

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3222682U JPS58135782U (en) 1982-03-08 1982-03-08 IC label

Publications (1)

Publication Number Publication Date
JPS58135782U true JPS58135782U (en) 1983-09-12

Family

ID=30043850

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3222682U Pending JPS58135782U (en) 1982-03-08 1982-03-08 IC label

Country Status (1)

Country Link
JP (1) JPS58135782U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0476482U (en) * 1990-11-13 1992-07-03

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0476482U (en) * 1990-11-13 1992-07-03

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