JPS58133994U - High frequency circuit equipment - Google Patents
High frequency circuit equipmentInfo
- Publication number
- JPS58133994U JPS58133994U JP3119682U JP3119682U JPS58133994U JP S58133994 U JPS58133994 U JP S58133994U JP 3119682 U JP3119682 U JP 3119682U JP 3119682 U JP3119682 U JP 3119682U JP S58133994 U JPS58133994 U JP S58133994U
- Authority
- JP
- Japan
- Prior art keywords
- shield case
- frequency circuit
- high frequency
- internal space
- circuit equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図及び第2図は本考案で使用するシールドケースの
一実施例を示す展開図及び組立後のシニルド力バーとの
斜視図、第3図は第2図T1.−T□線に沿う断面図、
第4図は本考案の組立後の実施例を示す斜視図、第5図
は第4[mT2T2線に沿う断面図である。
2・・・・・・シールドケース、3. 4. 5. 6
・・・・・・枠板部、11・・・・・・仕切板部、24
・・・・・・RFスイッチ配線体、26・・・・・・R
Fモジュレータ配線体。Figures 1 and 2 are a developed view and a perspective view of an assembled shield case showing an embodiment of the shield case used in the present invention, and Figure 3 is a perspective view of the shield case shown in Figure 2 T1. - A cross-sectional view along the T□ line,
FIG. 4 is a perspective view showing an assembled embodiment of the present invention, and FIG. 5 is a sectional view taken along line 4 [mT2T2. 2... Shield case, 3. 4. 5. 6
...Frame plate part, 11...Partition plate part, 24
...RF switch wiring body, 26...R
F modulator wiring body.
Claims (1)
1個の仕切部とを含めて金属板を打ち抜き、フレーム部
と仕切部とを折曲加工して内部空間を二倍するシールド
ケースを一体成形し、このシールドケースの一方の内部
空間に第1の高周波配線体を、他方の内部空間に第2の
高周波配線体を組付は両配線体を前記シールドケースで
合体したことを特徴とする高周波回路装置。A metal plate is punched out including a top plate part, four frame parts connected to this top plate part, and one partition part, and the frame part and partition part are bent to double the internal space. A shield case is integrally molded, and a first high-frequency wiring body is assembled into one internal space of the shield case, and a second high-frequency wiring body is assembled into the other internal space by combining both wiring bodies with the shield case. A high frequency circuit device featuring:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3119682U JPS58133994U (en) | 1982-03-04 | 1982-03-04 | High frequency circuit equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3119682U JPS58133994U (en) | 1982-03-04 | 1982-03-04 | High frequency circuit equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58133994U true JPS58133994U (en) | 1983-09-09 |
Family
ID=30042880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3119682U Pending JPS58133994U (en) | 1982-03-04 | 1982-03-04 | High frequency circuit equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58133994U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61177484U (en) * | 1985-04-24 | 1986-11-05 |
-
1982
- 1982-03-04 JP JP3119682U patent/JPS58133994U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61177484U (en) * | 1985-04-24 | 1986-11-05 |
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