JPS58133944U - semiconductor rectifier - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図、第２図は従来の半導体整流装置を示す外観斜視
図、第３図は本考案の半導体整流装置をしめすもので、
同図Ａはその側面図、Ｂはその正面図、Ｃはその外観斜
視図、Ｄはその回路構成図、第４図はガラスモーノ、レ
ド型半導体素子を使用した実施例を示す一部切欠断面図
である。 １０．１１・・・・・・電極兼用放熱金属板、１３・・
・・・・半導体素子、１５・・・・・・筒状絶縁スペー
サ。1 and 2 are external perspective views showing a conventional semiconductor rectifier, and FIG. 3 shows a semiconductor rectifier according to the present invention.
In the same figure, A is a side view, B is a front view, C is a perspective view of the exterior, D is a circuit configuration diagram, and FIG. It is. 10.11... Heat dissipation metal plate that also serves as an electrode, 13...
... Semiconductor element, 15 ... Cylindrical insulating spacer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数の電極兼用放熱金属板を並列に対向配置し、該金属
板間の絶縁間隔確保及び該金属板同士の支持をガラスモ
ールド型半導体素子のモールド本体部に筒状絶縁スペー
サを被せて該筒状絶縁スペーサの端部を前記金属板に当
接するとともに、前記半導体素子のリードを前記金属板
に固着して行ったことを特徴とする半導体整流装置。A plurality of heat dissipating metal plates that also serve as electrodes are arranged in parallel and facing each other, and a cylindrical insulating spacer is placed over the mold body of the glass molded semiconductor element to ensure an insulating interval between the metal plates and to support each other. A semiconductor rectifying device characterized in that an end of an insulating spacer is brought into contact with the metal plate, and a lead of the semiconductor element is fixed to the metal plate.