JPS58122457U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS58122457U
JPS58122457U JP1836082U JP1836082U JPS58122457U JP S58122457 U JPS58122457 U JP S58122457U JP 1836082 U JP1836082 U JP 1836082U JP 1836082 U JP1836082 U JP 1836082U JP S58122457 U JPS58122457 U JP S58122457U
Authority
JP
Japan
Prior art keywords
lead piece
semiconductor equipment
exposed
resin part
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1836082U
Other languages
Japanese (ja)
Other versions
JPS635239Y2 (en
Inventor
川口　晃充
Original Assignee
新電元工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新電元工業株式会社 filed Critical 新電元工業株式会社
Priority to JP1836082U priority Critical patent/JPS58122457U/en
Publication of JPS58122457U publication Critical patent/JPS58122457U/en
Application granted granted Critical
Publication of JPS635239Y2 publication Critical patent/JPS635239Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａ、　　ｂは本考案半導体装置の構造斜視図及び
側面図第２図ａ　”　ｄは本考案半導体装置の製造工程
図である。１は樹脂部、２は半導体チップ固着部、３は
コネクタ接続部、４は半導体チップ、５はコネクタ線、
Ｅ、　　Ｂ、　Ｃはリード片をしめす。Figures 1a and 1b are structural perspective views and side views of the semiconductor device of the present invention. Figures 2a and 2d are manufacturing process diagrams of the semiconductor device of the present invention. 1 is a resin part, 2 is a semiconductor chip fixing part, 3 is a Connector connection part, 4 is a semiconductor chip, 5 is a connector wire,
E, B, and C indicate lead pieces.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体チップ固着部を有するリード片及びコネクタ接続
部を有するリード片と該リード片の夫々−面及び他面を
含んで封止する樹脂部−とでほぼ直方体を形成すると共
に、該直方体の少（とも２辺に該リード片の一部を露出
せしめ且つ該露出面が樹脂部と平面を形成するようにし
プ、−ことを特徴とする半導体装置。A lead piece having a semiconductor chip fixing part, a lead piece having a connector connection part, and a resin part sealing the lead piece including one surface and the other surface form a substantially rectangular parallelepiped, and the small ( A semiconductor device characterized in that a part of the lead piece is exposed on both sides, and the exposed surface forms a plane with the resin part.
JP1836082U 1982-02-12 1982-02-12 semiconductor equipment Granted JPS58122457U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1836082U JPS58122457U (en) 1982-02-12 1982-02-12 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1836082U JPS58122457U (en) 1982-02-12 1982-02-12 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS58122457U true JPS58122457U (en) 1983-08-20
JPS635239Y2 JPS635239Y2 (en) 1988-02-12

Family

ID=30030615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1836082U Granted JPS58122457U (en) 1982-02-12 1982-02-12 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS58122457U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0774277A (en) * 1994-07-11 1995-03-17 Matsushita Electron Corp Semiconductor device
JP2011003935A (en) * 2006-04-17 2011-01-06 Samsung Electro-Mechanics Co Ltd Light emitting diode package and method of manufacturing the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5414659U (en) * 1977-07-01 1979-01-30
JPS5572065A (en) * 1978-11-25 1980-05-30 Mitsubishi Electric Corp Plastic-molded type semiconductor device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5414659B2 (en) * 1974-12-04 1979-06-08

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5414659U (en) * 1977-07-01 1979-01-30
JPS5572065A (en) * 1978-11-25 1980-05-30 Mitsubishi Electric Corp Plastic-molded type semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0774277A (en) * 1994-07-11 1995-03-17 Matsushita Electron Corp Semiconductor device
JP2011003935A (en) * 2006-04-17 2011-01-06 Samsung Electro-Mechanics Co Ltd Light emitting diode package and method of manufacturing the same

Also Published As

Publication number Publication date
JPS635239Y2 (en) 1988-02-12

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