JPS58118763U - Conductive substrate for circuit production - Google Patents

Conductive substrate for circuit production

Info

Publication number
JPS58118763U
JPS58118763U JP1355782U JP1355782U JPS58118763U JP S58118763 U JPS58118763 U JP S58118763U JP 1355782 U JP1355782 U JP 1355782U JP 1355782 U JP1355782 U JP 1355782U JP S58118763 U JPS58118763 U JP S58118763U
Authority
JP
Japan
Prior art keywords
metal plate
circuit production
conductive substrate
hole
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1355782U
Other languages
Japanese (ja)
Inventor
矢吹　守弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP1355782U priority Critical patent/JPS58118763U/en
Publication of JPS58118763U publication Critical patent/JPS58118763U/en
Pending legal-status Critical Current

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Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、回路製作用基板体　　正面図、第２図は、保
護カバーの一部をはがした一部　　斜視図、第３図は、
切断貫通用工具　　側面図、第４図は、切断貫通した一
部　　斜視図。Figure 1 is a front view of the board for circuit production, Figure 2 is a perspective view of a part with the protective cover partially removed, and Figure 3 is
A side view of the tool for cutting and penetrating, and FIG. 4 is a perspective view of a portion of the tool that has been cut and penetrated.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 貫通した多線穴の絶縁板体に貼り付けてなる金属板に大
小の定形貫通穴を設け、かつ、絶縁板体の一部穴と金属
板体の一部小定形穴とを重ね合わせて同一した貫通穴を
設けて、その一部（金属板導電部分）片を切断貫通する
ことにより独立片（回路）を形成することを特長とする
回路製作用導電基板。A metal plate of various sizes is provided in a metal plate pasted on an insulating plate with multi-wire holes, and some of the holes in the insulating plate and some small-sized holes in the metal plate are overlapped to make the same hole. A conductive board for circuit production, characterized in that an independent piece (circuit) is formed by cutting a part of the through hole (a conductive part of a metal plate) through the through hole.
JP1355782U 1982-02-04 1982-02-04 Conductive substrate for circuit production Pending JPS58118763U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1355782U JPS58118763U (en) 1982-02-04 1982-02-04 Conductive substrate for circuit production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1355782U JPS58118763U (en) 1982-02-04 1982-02-04 Conductive substrate for circuit production

Publications (1)

Publication Number Publication Date
JPS58118763U true JPS58118763U (en) 1983-08-13

Family

ID=30026070

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1355782U Pending JPS58118763U (en) 1982-02-04 1982-02-04 Conductive substrate for circuit production

Country Status (1)

Country Link
JP (1) JPS58118763U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6277342B1 (en) * 2016-11-04 2018-02-07 達也 宮崎 Metal foil substrate and pattern forming method for electronic circuit and apparatus using the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4843162A (en) * 1971-10-02 1973-06-22

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4843162A (en) * 1971-10-02 1973-06-22

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6277342B1 (en) * 2016-11-04 2018-02-07 達也 宮崎 Metal foil substrate and pattern forming method for electronic circuit and apparatus using the same

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