JPS58110172A - Soldering method by laser - Google Patents

Soldering method by laser

Info

Publication number
JPS58110172A
JPS58110172A JP56206858A JP20685881A JPS58110172A JP S58110172 A JPS58110172 A JP S58110172A JP 56206858 A JP56206858 A JP 56206858A JP 20685881 A JP20685881 A JP 20685881A JP S58110172 A JPS58110172 A JP S58110172A
Authority
JP
Japan
Prior art keywords
solder
soldering
laser
cylinder
guide cylinder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56206858A
Other languages
Japanese (ja)
Other versions
JPS5841942B2 (en
Inventor
Masakazu Nakazono
中園正和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56206858A priority Critical patent/JPS5841942B2/en
Publication of JPS58110172A publication Critical patent/JPS58110172A/en
Publication of JPS5841942B2 publication Critical patent/JPS5841942B2/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)

Abstract

PURPOSE:To make the fixing of a body to be soldered until the solder solidifies and the supply of the solder to a prescribed position sure in the stage of fixing said body onto a soldering surface, and soldering the same by supplying the solder thereto by using a guiding cylinder for fixing thereby shielding reflected lasers. CONSTITUTION:The side part of a lead wire (a body to be soldered) 10 of which the surface is plated with solder is brought into abutment on the soldering surface 9 of a projected platelike terminal. One end of a guiding cylinder 5 is pressed from the top of the wire 10 on the surface 9 to fix the wire 10. Then the axial line of the cylinder 5 and the optical axis of a laser are made approximately perpendicular to the surface 9 and the optical axis of the laser emitted so as to cross the wire 10 is made approximately coincident therewith. When solid solder wires 11, 11 are charged through the opening in the upper part of the cylinder 5, the solder wires are positioned by the cylinder 5 so as to enter the inside of the spot diameter area of the laser. Thereupon, the laser light is oscillated to melt the solder 11 and to form the fillet thereof. Since the laser reflected by the soldering surface is shielded by the inside wall surface of the cylinder 5, the burn of the object around the same is prevented.

Description

【発明の詳細な説明】 発明の技術分野 本暢明は、レーザを利用してｌよんだ付けを行うレーザ
はんだ付は方法に関する。DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a laser soldering method for performing soldering using a laser.

発明の技術的背歌 近時、レーザを利用して非接触加熱によりリード線を端
子にはんだ付けすることが行われているＣ）とのレーザ
はんだ付けは、まず端子にリード線をのせ、ｌＩＪかな
いように固定したのち、はんだ付は部位にはんだを供給
し、レーザを照射して行っている。Technical backstory of the invention Recently, lead wires are soldered to terminals by non-contact heating using a laser. After fixing the parts so that they do not touch, soldering is done by supplying solder to the parts and irradiating them with a laser.

背景技術の問題点 上記のようなレーザはんだ付は方法によれば。Problems with background technology Laser soldering as above is according to the method.

はんだ表面にてレーザが反射し１反射したレーザにより
他部分が焼損する虞がある。また、リード線は、はんだ
付は部位近傍にて固定されていないので、レーザにょプ
溶融し九はんだが冷部するまでにリード線がしばしば動
いてしまい、七〇結来いもはんだ付は等のはんだ付は不
良を惹起する。The laser beam may be reflected on the solder surface, and the reflected laser beam may burn out other parts. In addition, since the lead wires are not fixed near the soldering part, the lead wires often move when the laser beam melts and the solder cools down. Soldering causes defects.

さらに、他の問題としてはんだをレーザのスポット領域
内に供給しをければならない力Ｓ、狭小なスポット領域
にはんだを確実に供給することはきわめて煩雑な作業で
ある。Furthermore, another problem is the force S required to supply the solder into the laser spot area, and it is an extremely complicated task to reliably supply the solder to a narrow spot area.

発明の目的 はんだｌ！！面でのレーザ反射、はんだが固化していな
いときの被はんだ付は体のｗｂｅ及びはんだ供給の困−
性を場滅した高信頼性のレーザはんだ付は方法を提供す
るにある。Purpose of the invention Solder! ! Laser reflection on the surface, soldering when the solder is not solidified may cause problems with body wbe and solder supply.
There is a way to provide highly reliable laser soldering that has become obsolete.

発明の＠１ はんに付は面上に被はんだ付は体を載置し、この被はん
だ付は体を筒体で抑圧固定したのち、筒体の中空部の一
端部から固体はんだ片をはんだ付は予定部位に供給し、
筒体の中空部を介してはんだ付は予定部位にレーザを照
射して被はんだ付は体のはんだ付は面へのはんだ付けを
行うものである。@1 of the invention In the soldering process, a body to be soldered is placed on a surface, and after the body is pressed and fixed with a cylindrical body, a piece of solid solder is inserted from one end of the hollow part of the cylindrical body. For soldering, supply to the planned location,
Soldering is performed by irradiating a laser beam onto the intended area through the hollow part of the cylinder, and soldering is performed on the surface of the body of the object to be soldered.

発明の実施例 ４１図は１本発明の一夷ｌｌＡ例において喝−られる装
置を示している。すなわち、本実施例においては、レー
ザを発振するためのレーザ装置　（１）　、このレーザ
装置（１）から照射されたレーザを集光するための集光
レンズ（２）、この集光レンズ（２）により集光された
レーザをその一端面から入光し他端面から出光する光フ
ァイバ（３）、光ファイバ（３）の他端面位置に一方の
焦点位置がくるように設けられた集光レンズ（４）及び
この集光レンズ（４）により出光されかつはんだ付は予
定部位を十分におおう大きさのスポット径を有するレー
ザを囲繞するように設けられた案内円筒（５）からなっ
ている。Embodiment 4 of the Invention Figure 1 shows the apparatus used in one embodiment of the invention. That is, in this embodiment, a laser device (1) for oscillating a laser, a condensing lens (2) for condensing the laser irradiated from this laser device (1), and this condensing lens (2) are used. ) into an optical fiber (3) through which the laser beam focused by the laser enters from one end face and exits from the other end face, a condenser lens provided so that one focal point is located at the other end face position of the optical fiber (3) (4) and a guide cylinder (5) which is provided so as to surround a laser which is emitted by the condenser lens (4) and which has a spot diameter large enough to sufficiently cover the area to be soldered.

上記案内円筒（５）の材質はステンレス鋼又はテフロン
コートされた銅のようにはんだ付けされないものからで
きていて、内径は例えば４１１＠前後、長さは４〜１０
１１ｍである。なお、集光レンズ（４）から出光される
レーザのスポット（６）の径は上記案内円筒（５）の内
径とほぼ等しくなるように設定されている。The material of the guide cylinder (5) is made of a material that cannot be soldered, such as stainless steel or Teflon-coated copper, and has an inner diameter of, for example, around 411 mm and a length of 4 to 10 mm.
It is 11m. The diameter of the laser spot (6) emitted from the condenser lens (4) is set to be approximately equal to the inner diameter of the guide cylinder (5).

このように構成された装置において、４２図および第３
図に示すような支持体（７）に突設された板状の端子（
８）のはんだ付は面（９）上に被はんだ付は体である表
面がはんだめっきされたリード線四の側部を当接させる
。しかして、案内円筒（５）の一端部を上記はんだ付は
面（９）上に当接されたリード線ｕ（１の上から押圧し
リード線１１１が動かないように固定する。このとき、
案内円＊　ｔ５）の軸線と、上記集光レンズ（４）から
その光軸が上記はんだ付け［ｆｉ　ｔ９１にほぼ―直に
なり、かつ上記リードｍ［ＩＯ）に交差するように出光
されたレーザの光軸がほぼ一致するように設定する。In the device configured in this way, FIGS. 42 and 3
A plate-shaped terminal (
In the soldering step 8), the side portion of the lead wire 4 whose surface is solder-plated is brought into contact with the surface (9). Then, one end of the guide cylinder (5) is pressed from above the lead wire U (1) which is in contact with the soldering surface (9) and is fixed so that the lead wire 111 does not move.At this time,
The laser beam is emitted from the condenser lens (4) so that its optical axis is almost perpendicular to the soldering [fit91] and intersects the lead m[IO]. Set so that the optical axes of the two are almost the same.

−しかるのら、案内円筒（５）の上６１１０から固体は
ば゛ んだ片である例えび長さｊ　ＩＪＩ　、２直径１，５騙
橿度の円柱状やに入り糸はんだを２〜３個投入する。こ
れら糸はんだは案内円筒（５）Ｋよシレーザのスポット
！１１１１域内に入るように位置決めされる。しかして
レーザ装置（１）よりレーザを発振すると、発振された
レーザは集光レンズ（２）により光ファイバ（３）の一
端面に集光され、レーザは光ファイバ（３）の一端面か
ら他端面まで伝送され、集光レンズ（４）から案内円筒
（５）の内儀にほぼ等しいスポット（６）の径のレーザ
が出力され、レーザ光は案内円筒（５）のよ藝開口から
入光して中空部分を通過し下部開口から出光してはんだ
付は面（９）上のはんだ付は予定部位に照射される。レ
ーザ照射された糸はんだ←υ、　（１１１は。-However, from the upper part 6110 of the guide cylinder (5), a solid piece is spread out, for example, a cylindrical wire with length j IJI, 2 diameter 1.5 degrees of concavity, and 2 to 3 pieces of cored wire solder. Insert. These solder threads are the guide cylinder (5) K and the laser spot! It is positioned to fall within the 1111 area. When the laser device (1) oscillates a laser, the oscillated laser is focused on one end surface of the optical fiber (3) by the condenser lens (2), and the laser beam is emitted from one end surface of the optical fiber (3) to the other end surface of the optical fiber (3). The laser beam is transmitted to the end face, and a laser beam having a diameter of a spot (6) approximately equal to the inner diameter of the guide cylinder (5) is output from the condensing lens (4), and the laser beam enters from the opening of the guide cylinder (5). The light passes through the hollow part and exits from the lower opening, and is irradiated onto the intended soldering area on the soldering surface (9). Laser irradiated solder wire ←υ, (111 is.

溶融すると同時にリードＩｓ四側に表面張力により引−
寄せられ、はんだフィレットが形成される。At the same time as it melts, it is pulled on the four sides of lead Is by surface tension.
They are brought together to form solder fillets.

このときはんだ表面にてレーザは反射するが１反射され
たレーザは案内円筒（５）の内壁面により遍蔽されるの
で、支持体（力をはじめとして周囲の物体を焼損するこ
とはない。はんだフィレット形成後も案内円筒（５）の
リード線への抑圧は溶融はんだが完全に固化するまで継
続する。このようにすることにより、はんだの溶融中に
端子（８）は動かないので、いもはんだ付は尋のはんだ
付は不良の発生を防止できる。はんだフィレットが固化
すると案内円筒（５）を取りはずしレーザはんだ付けを
終ｒする。At this time, the laser is reflected by the solder surface, but the reflected laser is covered uniformly by the inner wall surface of the guide cylinder (5), so it will not burn out surrounding objects including the support (force). Even after the fillet is formed, the guide cylinder (5) continues to press the lead wire until the molten solder completely solidifies.By doing this, the terminal (8) does not move while the solder is melting, so Proper soldering can prevent the occurrence of defects. When the solder fillet has solidified, the guide cylinder (5) is removed and the laser soldering is finished.

なお、上記実施例における案内円筒（５）の代りＶＣ中
空部横断面が矩形、三角形又は楕円の筒体を用いてもよ
い。要するに、一定のスポット径を有するレーザがほぼ
内接するように中空部によ！ｌａｄ、ｅ４するものであ
ればどのような形状の筒体でもよい３、さらに、上記実
施例においては、はんだ付は予定部位に照射されるレー
ザのスポット径は案内円筒（５）の内径とほぼ同じであ
るが、案内円＠　（５）の内儀より若干大きめにしても
よい。こうしても、案内円筒（５）に照射されるレーザ
はスポットのｍｌ１Ｉｄ、部であるので、エネルギ一度
は低く案内円筒は解融せず、はんに付は予定部位を余す
ところなく完全にレーザ照射することができる。Incidentally, instead of the guide cylinder (5) in the above embodiment, a cylinder whose VC hollow section has a rectangular, triangular or elliptical cross section may be used. In short, the laser beam with a certain spot diameter is created in the hollow part so that it is almost inscribed! The cylinder may have any shape as long as it can be used for soldering.In addition, in the above embodiment, the spot diameter of the laser irradiated onto the planned soldering area is approximately the same as the inner diameter of the guide cylinder (5). It is the same, but the guide circle can be made slightly larger than the guide circle in (5). Even in this case, since the laser beam irradiated to the guide cylinder (5) is ml1Id of the spot, the energy is low enough that the guide cylinder does not melt, and when applying the solder, the laser beam is completely irradiated to the planned area. can do.

発明の効果 本発明によれば、はんだ付は予定部位にて被はんだ付は
体を押圧している筒体により固体はんだ！ｌＳ。Effects of the Invention According to the present invention, soldering is carried out at the planned site, and the soldering target is solid soldered by the cylindrical body pressing the body! lS.

片を所定位置に確貞に供給できる。Ａ１ｌ１！体の内壁
面によりはんだ表面にて反射したレーザを遣蔽で龜るの
で、他部分を焼損したり、作業者の安全を神かしたりす
ることＵＳない。さらに、被はん疋付は体は、＃融けん
だが完全に固定されるまで筒体により押圧固定されるの
で、被はんだ付は体が動くことによる例えばいもはんだ
付・す尋のはんだ付は不良の発生を防止できる。その結
果、上記三つの効果が相俟ってレーザはんだ付けの１ｉ
ｄ性が向上す名という格別の効果を得ることができる。Pieces can be reliably fed to predetermined positions. A1l1! Since the laser reflected from the solder surface by the inner wall surface of the body is blocked by the shield, there is no risk of burning out other parts or jeopardizing the safety of the workers. Furthermore, the body of the solder is pressed and fixed by the cylindrical body until the molten material is completely fixed, so the body of the solder can move, such as potato soldering or bottom soldering. It is possible to prevent the occurrence of defects. As a result, the above three effects combine to improve laser soldering's 1i
It is possible to obtain the special effect of improving the physical properties.

【図面の簡単な説明】[Brief explanation of drawings]

４１図は本発明のレーザはんだ付は方法に用いられる装
置を示す概略図、４２図及び第３図はそれぞれ本発明の
レーザはんだ付は方法によるはんだ付けを説明するため
の平面図及び豊部切欠所面図である。 （５）・・・案内円筒（案内筒体”）　、　ｆ９）・・
・はんだ付は而、顛・・・リード＃（被はんだ付は体）
、（ｌｌｌ、Ｑト・・糸はんだ（固体はんだ片〕。Figure 41 is a schematic diagram showing an apparatus used in the laser soldering method of the present invention, and Figures 42 and 3 are a plan view and a cutout for explaining soldering by the laser soldering method of the present invention, respectively. It is a location diagram. (5)...Guide cylinder (guide cylinder), f9)...
・Soldering is the body...Lead # (Soldering is the body)
, (lll, Qt... Thread solder (solid solder piece).

Claims (1)

【特許請求の範囲】[Claims] はんだ付は面上に破はんだ付は体を載置する工程と、上
記はんだ付は面のはんだ付は予定部位に案内筒体を上記
被はんだ付は体を介して押圧して案内筒体の一方の開口
を上記はんだ付は予定部位に対向させる工程と、上記案
内筒体の他方の開口から固体はんだ片を投入して上記固
体はんだ片を上記はんだ付は予定部位に位置決めする工
程と、上記案内筒体の他方の開口からこの開口とほぼ同
じ大きさのスポット径を有するレーザを照射して上記固
体はんだ片を溶融し上記はんだ付は面と上記被はんだ付
は体との間にはんだフィレットを形成する工程と、上記
はんだフィレットの同化後に上記案内筒体を堆９はずす
工程とを具備することを特許とするレーザはんだ付は方
法。Soldering is a process of placing a broken solder body on a surface, and soldering above is a process of placing a guide cylinder on the planned area by pressing the guide cylinder through the soldering body. a step of arranging one opening to face the region to be soldered; a step of inserting a piece of solid solder from the other opening of the guide cylinder and positioning the solid solder piece to the region to be soldered; The solid solder piece is melted by irradiating a laser beam with a spot diameter approximately the same size as this opening from the other opening of the guide cylinder, thereby forming a solder fillet between the soldering surface and the soldering body. and a step of removing the guide cylinder after the solder fillet is assimilated.
JP56206858A 1981-12-23 1981-12-23 Laser soldering method Expired JPS5841942B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56206858A JPS5841942B2 (en) 1981-12-23 1981-12-23 Laser soldering method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56206858A JPS5841942B2 (en) 1981-12-23 1981-12-23 Laser soldering method

Publications (2)

Publication Number Publication Date
JPS58110172A true JPS58110172A (en) 1983-06-30
JPS5841942B2 JPS5841942B2 (en) 1983-09-16

Family

ID=16530206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56206858A Expired JPS5841942B2 (en) 1981-12-23 1981-12-23 Laser soldering method

Country Status (1)

Country Link
JP (1) JPS5841942B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4697061A (en) * 1985-09-19 1987-09-29 Siemens Aktiengesellschaft Method for welding by means of laser light
JPS63127767U (en) * 1987-02-12 1988-08-22
US5239156A (en) * 1991-09-27 1993-08-24 General Electric Company Apparatus and method for laser joining of superconducting tapes

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4697061A (en) * 1985-09-19 1987-09-29 Siemens Aktiengesellschaft Method for welding by means of laser light
JPS63127767U (en) * 1987-02-12 1988-08-22
US5239156A (en) * 1991-09-27 1993-08-24 General Electric Company Apparatus and method for laser joining of superconducting tapes

Also Published As

Publication number Publication date
JPS5841942B2 (en) 1983-09-16

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