JPS58103525A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS58103525A JPS58103525A JP20264481A JP20264481A JPS58103525A JP S58103525 A JPS58103525 A JP S58103525A JP 20264481 A JP20264481 A JP 20264481A JP 20264481 A JP20264481 A JP 20264481A JP S58103525 A JPS58103525 A JP S58103525A
- Authority
- JP
- Japan
- Prior art keywords
- curing agent
- curing
- catalyst
- epoxy resin
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】
本発明はＸボ中シ樹脂組成物に関し、ｘ４中シ樹脂に硬
化剤としてフェノールノｌｌ５ｖ：）り樹脂及び一般式
が
で示される化合物を併用して配合すると共に硬化触媒と
して２−メチルイ三タリールー無水ピ０メリット酸錯体
を配合することを特徴とするエボ中シ樹脂組成物に係る
ものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an X4 medium resin composition, which is prepared by blending a phenol resin as a curing agent and a compound represented by the general formula into an X4 medium resin, and curing the composition. This invention relates to an Evo medium resin composition which is characterized in that it contains a 2-methylitalylphimellitic anhydride complex as a catalyst.
フェノールボラ・シフ樹脂を硬化剤として用いたエボ中
シ樹脂組成物の一般的な配合は、例えばＩボ中シ樹脂２
０重量−程度、フェノールノボ５ウク樹脂ｌＯ重量％程
度、硬化触ｍとしてベシジルジメチルア三シ等の三級ア
！シや２−メチルイ！タリール、２−エチルイ！：タリ
ール、２−フェニルイ：タリール等のイ！タリール類を
０．２〜１．０重量−程度、無機充填材としてシリカ６
５重量−程度、−燃剤としてｇｂ、０．４重量饅程度、
離型剤としてカルナバワックス１重量慢程度である。こ
の配合によれば硬化速度が速く成形サイクルの短いＸボ
十シ樹脂組成物を得ることができるが、この反面保存性
が悪く５℃以下の冷蔵状態で保存する必要があシ、５℃
以下で保存しても２力月程度のライフしかないという欠
点があった。そこで上記配合のうち、硬化触媒である三
級アエシやイミダリール類の替シに２−メチルイミタリ
ールー無水ピ０メリラト鍍錯塩を１〜５重量％用いるこ
とＫよｆｉ、２０Ｃで６力月以上という長期の保存性を
有するエボ中シ樹脂組成物を得ることができることが見
出されたが、このものでは逆に多ｔの硬化触媒を用いて
も硬化速度か遅く、成形加工サイクルが長くなるという
欠点があった。A general formulation of an Evo medium resin composition using Phenol Bora Schiff resin as a curing agent is, for example, I Bo medium resin 2.
0% by weight, about 10% by weight of phenolic resin, and tertiary acetic acid such as besidyl dimethyl acetate as a curing catalyst. Shiya 2-Methyrui! TARIL, 2-ETHILI! : Tarir, 2-phenyl: Tarir etc.! About 0.2 to 1.0 weight of taryl and silica 6 as an inorganic filler.
5 weight - degree, - GB as fuel, 0.4 weight cake degree,
As a mold release agent, about 1 weight of carnauba wax is used. According to this formulation, it is possible to obtain an X-Boss resin composition with a fast curing speed and a short molding cycle, but on the other hand, it has poor storage stability and must be stored in a refrigerated state below 5°C.
There was a drawback that even if you saved it below, you would only have about 2 months of life. Therefore, in the above formulation, it is recommended to use 1 to 5% by weight of 2-methylimitary-anhydride-melilato complex salt as a replacement for the curing catalysts such as tertiary acetic acid and imidalyl. It has been found that it is possible to obtain an evo-medium resin composition with long-term storage stability.However, in this composition, even if a high-t curing catalyst is used, the curing speed is slow and the molding cycle becomes long. There was a drawback.
本発明は上記の点に鑑みてなされ次ものであって、長期
保存性含有すると共に硬化速度が速く成形サイクルが短
いＸ＄十シ樹脂組成物を提供するコトを目的とするもの
である。The present invention was made in view of the above-mentioned points, and an object of the present invention is to provide a resin composition having a long shelf life, a fast curing speed, and a short molding cycle.
以下本発明の詳細な説明する。The present invention will be explained in detail below.
本発明に係る工率中シ樹脂組成物は、エボ士シ樹脂に、
硬化剤としてフェノールノボラック樹脂と一般式が
で示される化合物（以下硬化剤化合物と称す）とを併用
して配合すると共に、硬化触媒として２−メチルイニタ
リールー無水ピ０メリもシト酸錯体を配合し、さらに必
要に応じて常用される無機充填材、離燃剤、離型剤等を
配合して調製したものである。The medium-efficiency resin composition according to the present invention includes:
A phenol novolak resin and a compound represented by the general formula (hereinafter referred to as a curing agent compound) are combined as a curing agent, and a 2-methylinital-anhydride-meritic acid complex is blended as a curing catalyst. In addition, it is prepared by adding commonly used inorganic fillers, flame retardants, mold release agents, etc. as necessary.
ここで、工車十シ衝脂七しては任意のものを使用するこ
とか可能であるが、特に０−クレリールノＩＡ５ラクエ
ボ＋シ樹脂やフェノールノボ５ツク工卓中シ稠ＭＷＩ等
の多官能工車十シｗ脂が好ましい。この多官能工卓中シ
樹脂としては、エボ＋シ基が特に好ましい・
硬化剤としては上記のようにフェノールノボ５で示され
る硬化剤化合物を用いることにより、フェノールノボラ
ック樹脂と該硬化剤化合物とを併用するものであり、該
硬化剤化合物の使用量はフェノールノボ５ツク樹脂の使
用可能量の範囲内においては特に限定されるものでない
。該硬化剤化合物の増量は硬化速度の向上に関係するの
で、好ましい硬化速度を達成するのに必要な量だけ使用
すればよいのである。ま次上記硬化剤化合物におけるｎ
の数は限定されるもので蝶ないが、通常ｎ〜０．８の条
件下反応させることにより得られるものである。従って
該硬化剤化合物としてはレリルシシ一本ル乙アルデヒド
樹脂、カテコール−ホルムアルデヒド樹脂、ハイド０中
ノシーホルムアルヂしド樹脂が主として用いられること
になるが、このうちレリルシシーホルムアルデヒド樹脂
が用いて好適である。尚、しリルシシ、カテコール、て
いる化合物であれば使用可能である。Here, it is possible to use any desired resin, but in particular, multifunctional resins such as 0-Clearyl resin and phenol resin MWI can be used. Koguruma Jushi w fat is preferred. As this polyfunctional resin, Evo+C group is particularly preferable. By using the curing agent compound represented by Phenol Novo 5 as the curing agent, the phenol novolac resin and the curing agent compound can be combined. The amount of the curing agent compound to be used is not particularly limited within the usable amount of the phenolic resin. Increasing the amount of the curing agent compound is related to increasing the cure rate, so only the amount necessary to achieve the desired cure rate may be used. n in the above curing agent compound
Although the number of n is limited, it is usually obtained by reacting under conditions of n to 0.8. Therefore, as the curing agent compound, Relyl-formaldehyde resin, catechol-formaldehyde resin, and Hyde-0 medium formaldehyde resin are mainly used, but among these, Relyl-formaldehyde resin is preferably used. be. Incidentally, any compound such as trichloride, catechol, etc. can be used.
硬化触媒である２−メチルイ！：タリールー無水ピ０メ
リット酸錯体は、例えば２−メチルイミタリールと無水
ピロメリット駿とをそれぞれナト５ヒト０フ５シ溶液と
し、２−メチルイ！タリール／無水ピ０メリウト酸＝２
．００℃ル比率となるように両溶液を撹拌−混合するこ
とにょシ、生じる沈殿をＰ別・乾燥して粉体として得ら
れる。これと同等なものとして商品名スリ中ニア−ＭＰ
Ｍ（丸善石油株式会社製）として市販されているものを
用いることができる。この２−メチルイエタリールー無
水ピＯメリウト酸錯体の使用量は特に限定されるもので
ないが、通常Ｉボ中シ樹脂組成物全量に対して０．５〜
５．０重量が好適である。2-Methyl, a curing catalyst! :Tary-pyromellitic anhydride complex can be prepared, for example, by preparing a solution of 2-methylimitaryl and pyromellitic anhydride, respectively. Taryl/pimeliutic anhydride = 2
．． Both solutions are stirred and mixed at a ratio of 00°C, and the resulting precipitate is separated from P and dried to obtain a powder. The equivalent product name is Surichunia-MP.
M (manufactured by Maruzen Sekiyu Co., Ltd.) commercially available can be used. The amount of the 2-methylyetary-piomelutic anhydride complex to be used is not particularly limited, but is usually 0.5 to 0.5 to
5.0 weight is preferred.
上述のように得られたＩボ中シ樹脂組成物は、２−メチ
ルイエタリールー・ピロメリット酸錯体によって長期に
亘る保存性を有するものであり、しかも硬化剤としてフ
ェノールノボ５５り樹脂と併用する硬化剤化合物によっ
て硬化速度が促進され２−メチルイ！！タリールーピＯ
メリウト酸錯体を用いたくもかかわらず成形サイクルを
短縮して生産効率よく成形加工が行なえるものである。The I-bodied resin composition obtained as described above has long-term storage stability due to the 2-methylyetary-pyromellitic acid complex, and it can also be used in combination with phenol novo-55 resin as a curing agent. The curing rate is accelerated by the curing agent compound that 2-methyl! ! Tully Lupi O
Even though a meliut acid complex is used, the molding cycle can be shortened and molding processing can be carried out with high production efficiency.
次に本關を実施例により具体的に説明する。Next, the main subject will be specifically explained using examples.
第１表に示す配合によって原料を計量して容器中で十分
撹拌混合し、これを温度８５ Ｃ１回転数１５ ｗｐｍ
の前０−ルと温度１２０℃、回転数１２ｖｐｍの後ロー
ルとで構成される試験用０−ル機にて６分間溶融混練し
、こののちシート状材料を得た。このものを三方式万能
粉砕機にて粉砕することにより、実施例１−５、比較例
１〜２、従来例第１表（重量部）
上記のようにして得られ次実施例１〜５、比較例１〜２
、従来例のエポ士シ樹脂組成物について、３０℃の条件
下における保存性及び硬化速度の測定試験を行なっ几。The raw materials were weighed according to the formulation shown in Table 1, stirred and mixed thoroughly in a container, and mixed at a temperature of 85 C1 and a rotation speed of 15 wpm.
The mixture was melt-kneaded for 6 minutes in a testing machine consisting of a front roll and a rear roll at a temperature of 120° C. and a rotational speed of 12 vpm, after which a sheet material was obtained. By pulverizing this material with a three-way universal pulverizer, Examples 1-5, Comparative Examples 1-2, Conventional Examples Table 1 (parts by weight) were obtained as described above, and the following Examples 1-5, Comparative examples 1-2
A conventional epoxy resin composition was tested for storage stability and curing speed at 30°C.
その結果を第２表に示す。The results are shown in Table 2.
第 ２ 表
３０℃保存性は、材料５ｙを直圧プレスで１７５℃に於
て成形した月板延びの初期値に対する９０−保持率に達
するまでの１数で示し、また硬化速度は、°トランスフ
ァー成形にて１７Ｓ℃の条件で成形する際の注入開始か
ら成形品を取り出し得るまでの最少時間で示した。第２
表の結果より、実施例のものは、良好な保存性を有する
と共に２従米通りの速い硬化速度を有して速い成形サイ
クルで成形を行ないえることが確隠され九〇Table 2 The storage stability at 30°C is expressed as the number of times it takes to reach a 90-retention rate with respect to the initial value of the elongation of the moon plate formed by molding material 5y at 175°C with a direct pressure press, and the curing speed is expressed by the degree of retention at 175°C. It is shown as the minimum time from the start of injection until the molded product can be taken out when molding is performed at 17S°C. Second
From the results in the table, it is confirmed that the products of Examples have good storage stability, a fast curing speed comparable to that of the conventional US, and can be molded in a fast molding cycle.90
Claims (1)
示される化合物を併用して配合すると共に硬化触媒とし
て２−メチルイエタリールー無水ピ０メリット酸錯体を
配合することを特徴とするｌｌ１ｌｃ中シａｍ組成物。+11 A ll1lc medium composition characterized by blending a compound represented by phenol as a curing agent with an evo medium resin and a 2-methylyetary-piomellitic anhydride complex as a curing catalyst. thing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20264481A JPS58103525A (en) | 1981-12-15 | 1981-12-15 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20264481A JPS58103525A (en) | 1981-12-15 | 1981-12-15 | Epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58103525A true JPS58103525A (en) | 1983-06-20 |
Family
ID=16460751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20264481A Pending JPS58103525A (en) | 1981-12-15 | 1981-12-15 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58103525A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6084037A (en) * | 1996-12-19 | 2000-07-04 | Shin -Etsu Chemical Co., Ltd. | Epoxy resin composition and semiconductor device |
| US6376923B1 (en) * | 1999-06-08 | 2002-04-23 | Shin-Etsu Chemical Co., Ltd. | Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device |
| WO2003075339A1 (en) * | 2002-03-01 | 2003-09-12 | National Starch And Chemical Investment Holding Corporation | B-stageable underfill encapsulant and method for its application |
| US7037399B2 (en) | 2002-03-01 | 2006-05-02 | National Starch And Chemical Investment Holding Corporation | Underfill encapsulant for wafer packaging and method for its application |
-
1981
- 1981-12-15 JP JP20264481A patent/JPS58103525A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6084037A (en) * | 1996-12-19 | 2000-07-04 | Shin -Etsu Chemical Co., Ltd. | Epoxy resin composition and semiconductor device |
| US6376923B1 (en) * | 1999-06-08 | 2002-04-23 | Shin-Etsu Chemical Co., Ltd. | Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device |
| WO2003075339A1 (en) * | 2002-03-01 | 2003-09-12 | National Starch And Chemical Investment Holding Corporation | B-stageable underfill encapsulant and method for its application |
| US7037399B2 (en) | 2002-03-01 | 2006-05-02 | National Starch And Chemical Investment Holding Corporation | Underfill encapsulant for wafer packaging and method for its application |
| US7608487B2 (en) | 2002-03-01 | 2009-10-27 | Henkel Ag & Co. Kgaa | B-stageable underfill encapsulant and method for its application |
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