JPS58103159U - Printed board - Google Patents

Printed board

Info

Publication number
JPS58103159U
JPS58103159U JP19814081U JP19814081U JPS58103159U JP S58103159 U JPS58103159 U JP S58103159U JP 19814081 U JP19814081 U JP 19814081U JP 19814081 U JP19814081 U JP 19814081U JP S58103159 U JPS58103159 U JP S58103159U
Authority
JP
Japan
Prior art keywords
hole
lead wire
board
printed board
land portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19814081U
Other languages
Japanese (ja)
Inventor
石田　正臣
Original Assignee
ソニー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ソニー株式会社 filed Critical ソニー株式会社
Priority to JP19814081U priority Critical patent/JPS58103159U/en
Publication of JPS58103159U publication Critical patent/JPS58103159U/en
Pending legal-status Critical Current

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来例を示す斜視図であり、第２図はその縦断
面図であり、第３図はその横断面図である。第４図は本
考案の一実施例を示す斜視図であ一す、第５図はその縦
断面図であり、第６図はランド部を示す平面図であり、
第７図は実装部品の実装状態を示す斜視図である。 １１・・・絶縁性基板、１３・・・実装部品、１４・・
・スルーホール、１５・・・リード線、１６・・・ラン
ド部。FIG. 1 is a perspective view showing a conventional example, FIG. 2 is a longitudinal cross-sectional view thereof, and FIG. 3 is a cross-sectional view thereof. FIG. 4 is a perspective view showing an embodiment of the present invention, FIG. 5 is a longitudinal sectional view thereof, and FIG. 6 is a plan view showing a land portion.
FIG. 7 is a perspective view showing the mounted state of the mounted components. 11... Insulating board, 13... Mounted components, 14...
-Through hole, 15...Lead wire, 16...Land part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板に穿設されたスルーホールにリード線を挿通して上
記基板上に実装される実装部品の上記スルーホールに挿
通されたクリンチカットされるリード線の折曲げ方向に
のみ上記スルーホールの穴径と同幅若しくは上記穴径よ
り小さい幅のランド部を上記基板上に設け、このランド
部にリード線を接続して実装部品を実装するよ□うにし
てなるプリント基板。The hole diameter of the through hole is determined only in the bending direction of the lead wire that is inserted into the through hole of the mounted component to be mounted on the board by inserting the lead wire into the through hole drilled in the board and is to be clinch cut. A printed circuit board in which a land portion having a width equal to or smaller than the hole diameter is provided on the substrate, and a lead wire is connected to the land portion to mount a mounted component.
JP19814081U 1981-12-29 1981-12-29 Printed board Pending JPS58103159U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19814081U JPS58103159U (en) 1981-12-29 1981-12-29 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19814081U JPS58103159U (en) 1981-12-29 1981-12-29 Printed board

Publications (1)

Publication Number Publication Date
JPS58103159U true JPS58103159U (en) 1983-07-13

Family

ID=30111335

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19814081U Pending JPS58103159U (en) 1981-12-29 1981-12-29 Printed board

Country Status (1)

Country Link
JP (1) JPS58103159U (en)

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