JPS58103149U - semiconductor equipment - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図、第２図及び第３図は本考案の一実施例の説明図
であり、第１図及び第２図はキャップ部材に封止材を段
差ができるよう被着した場合の平面図及び側面図で、第
３図は半導体装置゛の断面図である。 図中、１はキャップ部材、２は封止材、３は封止材の段
差のある部分、４は半導体素子の収容容器、５はキャビ
ティである。FIGS. 1, 2, and 3 are explanatory diagrams of one embodiment of the present invention, and FIGS. 1 and 2 are plan views when the sealing material is applied to the cap member so as to form a step. FIG. 3 is a cross-sectional view of the semiconductor device. In the figure, 1 is a cap member, 2 is a sealing material, 3 is a stepped portion of the sealing material, 4 is a storage container for a semiconductor element, and 5 is a cavity.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子と該半導体素子の収容容器と、該半導体素子
を該収容容器内に封止材を介して気密封止するキャップ
部材とを備え、前記収容容器と前記キャップ部材とを重
で加熱し気密封止を行う半導体装置において、前記キャ
ップ部材の内側表面の周辺部に封止材を少くとも１か所
段差ができるよう被着することを特徴とする半導体装置
。It includes a semiconductor element, a housing container for the semiconductor element, and a cap member that hermetically seals the semiconductor element in the housing container via a sealing material, and the housing container and the cap member are heated with heavy gas and air is heated. A semiconductor device that is hermetically sealed, characterized in that a sealing material is applied to a peripheral portion of the inner surface of the cap member so as to form a step at least in one place.