JPS58100989A - Ultrasonic welding method - Google Patents

Ultrasonic welding method

Info

Publication number
JPS58100989A
JPS58100989A JP19673481A JP19673481A JPS58100989A JP S58100989 A JPS58100989 A JP S58100989A JP 19673481 A JP19673481 A JP 19673481A JP 19673481 A JP19673481 A JP 19673481A JP S58100989 A JPS58100989 A JP S58100989A
Authority
JP
Japan
Prior art keywords
welding
materials
ultrasonic welding
projections
ultrasonic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19673481A
Other languages
Japanese (ja)
Inventor
Toshiaki Miyazaki
宮崎 俊秋
Hideyuki Shinonaga
篠永 秀之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP19673481A priority Critical patent/JPS58100989A/en
Publication of JPS58100989A publication Critical patent/JPS58100989A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

PURPOSE:To improve the reliability of welding and to expand the application range of materials to be welded by providing projections on either one of the abutting surfaces of joining materials to decrease an initial welding area and subjecting the mateials to ultrasonic welding. CONSTITUTION:Projections 8a are provided at certain intervals on the joining surface of at least one, for example, 8 of joining materials 7, 8 and the materials 7, 8 are sandwiched between a chip and an anvil and are subjected to ultrasonic welding. When ultrasonic oscillations are started by pressurizing the chip, the preceding ends 8c of the projections 8a of the material 8 and the material 7 begin to rub each other immediately, and the oxides and foreign matter such as dust, oils and fats on the surfaces of the materials 7, 8 are discharged from the friction surfaces along the slopes 8d of the projections to the outside. Thus the contact between the clean metallic surfaces is easily obtained and good ultrasonic welding is accomplished. If at this time the end part 7a of the material 7 after the end of the welding is kept within the range of the bottom side 8d of the corresponding projection 8a, sticking force is improved.

Description

【発明の詳細な説明】 発明の技術分野 発明の技術的背景とその問題点 金属材料などを接合する方法の一つとして、超音波溶接
法がある。従来の方法を第1図の構成図により説明する
と、超音波発振器1から発生する高周波電流を振動子2
にて超音波振動に変換し、ホーン3を介してチップ4に
振動を矢印5の方向に起すとともに、チップ4とアンビ
ル6との間に接合材料7及び8をはさんで荷重を矢印9
の方向に加えて超音波振動で摩擦圧接するものである。
DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention Technical Background of the Invention and its Problems Ultrasonic welding is one of the methods for joining metal materials and the like. To explain the conventional method using the configuration diagram shown in FIG. 1, the high frequency current generated from the ultrasonic oscillator 1 is
The ultrasonic vibrations are converted into ultrasonic vibrations and vibrations are generated in the tip 4 in the direction of the arrow 5 through the horn 3, and the bonding materials 7 and 8 are sandwiched between the tip 4 and the anvil 6 to transfer the load in the direction of the arrow 9.
Friction welding is performed using ultrasonic vibration in addition to the direction of .

このとき接合材料7とチップ4の間および接合材料8と
アンビル6の間で相対スベリを起こさないようにすれば
、接合材料7及び8間で摩擦発熱がおこる。この発熱に
よって接合材料7及び8は局部的に高温にな1〕、材料
の塑性流動が起こりやすくなるとともに金属原子の相互
拡散が起こりやすくなり接合材料間の固相接合が行こな
われる。しかし、このよろな接合方法によれば超音波振
動を起こす振動子2の容量によって接合材料7及び8の
大きさ等の形状および材料が画定されている。
At this time, if relative slippage is prevented between the bonding material 7 and the chip 4 and between the bonding material 8 and the anvil 6, frictional heat generation will occur between the bonding materials 7 and 8. Due to this heat generation, the bonding materials 7 and 8 become locally high in temperature 1], making it easier for plastic flow of the materials to occur, as well as mutual diffusion of metal atoms, and solid phase bonding between the bonding materials is performed. However, according to these various bonding methods, the shapes and materials such as the sizes of the bonding materials 7 and 8 are determined by the capacity of the vibrator 2 that generates ultrasonic vibrations.

従って振動子2を大きくしない限り現行の溶接の能力を
向上させることができないという欠点があった。
Therefore, there is a drawback that the current welding ability cannot be improved unless the vibrator 2 is made larger.

発明の目的 本発明は上記の欠点を解決するために行こなわれたもの
で、当初の溶接面積を小さくして被溶接物の寸法、材質
など溶接適用軸弁を拡大する超音波溶接方法を提供する
ことを目的とすることにある。
Purpose of the Invention The present invention has been carried out to solve the above-mentioned drawbacks, and provides an ultrasonic welding method that reduces the initial welding area and expands the welding applicable shaft valve such as the size and material of the welded object. The goal is to do something.

発明の概要と実施例 本発明の構成につき一実施例の図面により説明する。第
2図は接合要部の拡大断面図で、接合材料7又は8のい
ずれか一方(第2図では8)に突起8aをある間隔lを
とって設ける。この突起8aはプレス加工でも機械加工
を利用してもよい。高さ、突起の巾は被溶接材料のは質
、厚さ及び大きさ、必要な溶接強度、溶接機の容量を勘
案して実験的に決めることが可能である。またこの時溶
接終了後接合材料7の端部7aが対応する突起8aの底
辺8bの範囲内にあるようにすると固着力が一層増す。
Summary of the Invention and Embodiments The structure of the present invention will be explained with reference to the drawings of one embodiment. FIG. 2 is an enlarged sectional view of the main part of the joint, and projections 8a are provided at a certain interval l on either the joining material 7 or 8 (8 in FIG. 2). This protrusion 8a may be formed by press working or machining. The height and width of the protrusion can be determined experimentally by taking into consideration the quality, thickness and size of the material to be welded, the required welding strength, and the capacity of the welding machine. At this time, if the end portion 7a of the joining material 7 is located within the range of the bottom side 8b of the corresponding projection 8a after welding is completed, the adhesion force will be further increased.

この接合材料7及び8を第1図に示すチップ4とアンビ
ル6の間に挟み、超音波溶接を行う。従来超音波溶接を
高い信頼性で実施する場合チップ4の加圧面積に対応す
る接合材料7及び8の接触面の範囲内の表面酸化物や塵
埃、油脂等の異物の除去を溶接過程で外部へ押し出すこ
とが必要である。このため必要以上にチップ4の面圧を
上げなければならず、被溶接材の湿度も全体的に上がる
傾向にあり、その塑性変形も太きくtrらざるを得なか
った。次に、本提案の溶接過程を説明する。千ツブ4が
加圧されホーン;3によって超音波振動を開始すると直
ちに接合材料8の突起8aの先端8Cと接合材料7が摩
擦を始め、該接合材料7と突起8aの表面の酸化物や塵
埃、油脂などの異物は突起の傾斜面8dに沿って摩擦面
から外へ排出されろ。すなわち清浄な金膠紫面同志の接
触が容易に行こなわれる。また、摩擦による発熱は従来
方法に比べ接触面積が小さいため高圧でしかも格段にそ
の熱流相開が高く伝熱による熱放散カットのため接合材
料7と突起8aの接触部はより高温になる。従って溶接
装置が同じならば材質が同じであれば執効率のアップ分
だけ大きな接触面積が接合可能であるし、厚い板の溶接
が可能である。また、溶接材料の大きさが同じならばよ
り高い温度を要する材料の溶接が可能となる。なお、突
起8aの底面8bの範囲内に接合材料7の端部7aを9
置しであるので端部7aは完全に接合され、端部の未接
合が原因となる不要な応力集中部もできない。突起8a
の間隔lは溶接部に要求される曲げモーメントに対応す
るよう決定すればよく、またその間隔lの値より大きな
底辺8bを持つチップ4を使用すること(二よって溶接
可能である。
These joining materials 7 and 8 are sandwiched between the tip 4 and the anvil 6 shown in FIG. 1, and ultrasonic welding is performed. Conventionally, in order to carry out ultrasonic welding with high reliability, foreign matter such as surface oxides, dust, and oil within the contact area of the joining materials 7 and 8 corresponding to the pressurized area of the tip 4 must be removed during the welding process. It is necessary to push it out. For this reason, it was necessary to increase the surface pressure of the chip 4 more than necessary, the overall humidity of the welded material tended to increase, and its plastic deformation had to become large. Next, the welding process of this proposal will be explained. As soon as the tube 4 is pressurized and ultrasonic vibration is started by the horn 3, the tip 8C of the protrusion 8a of the welding material 8 and the welding material 7 begin to rub, causing oxides and dust on the surfaces of the welding material 7 and the protrusion 8a to be removed. Foreign matter such as oil and fat should be discharged from the friction surface along the sloped surface 8d of the protrusion. In other words, contact between clean gold and purple masks can be easily carried out. Furthermore, since the contact area of heat generation due to friction is smaller than in the conventional method, the pressure is high, and the heat flow phase difference is significantly high, and the heat dissipation due to heat transfer is cut, so the contact area between the bonding material 7 and the protrusion 8a becomes higher temperature. Therefore, if the welding equipment is the same and the materials are the same, a larger contact area can be welded due to the increased efficiency, and thick plates can be welded. Furthermore, if the size of the welding material is the same, it becomes possible to weld materials that require a higher temperature. Note that the end portion 7a of the bonding material 7 is placed within the range of the bottom surface 8b of the protrusion 8a.
Since the end portions 7a are placed in a fixed position, the end portions 7a are completely joined, and there is no unnecessary stress concentration area caused by the unjoined end portions. Protrusion 8a
The interval 1 may be determined to correspond to the bending moment required for the welding part, and the tip 4 having a base 8b larger than the value of the interval 1 may be used (2), so that welding is possible.

すなわち従来得られなかったはるかに大きな曲げモーメ
ント強ザをもつ超音波溶接が可能となる。
In other words, it becomes possible to perform ultrasonic welding with a much larger bending moment intensity than was previously possible.

以上は一実施例について述べたが他の変形例として第:
(図に示すような(A)リング状突起1、(B)ゴバン
目状空起、(C)単独突起など複数個の単独突起によっ
ても上記本発明と同様の効果が得られろ。
The above has described one embodiment, but as another modification:
(The same effect as that of the present invention can be obtained by using a plurality of individual protrusions, such as (A) ring-shaped protrusion 1, (B) gong-like protrusion, and (C) single protrusion as shown in the figure.

発明の効果 以上本発明によれ1ば、超音波溶接機の能力が拡大活用
され、材質的に適用困難であった材料をも容易(二接合
可能とする;Jか、よjl大きな曲げ強度を有する接合
を得ることができる。また接合端部の応力集中も著しく
軽減する効果がある。
Effects of the Invention According to the present invention, the capabilities of an ultrasonic welding machine can be expanded and used, and materials that are previously difficult to apply can be easily joined (two-joints can be joined; In addition, stress concentration at the joint end can be significantly reduced.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の超音波溶接法を示す構成図、第2図は本
発明の一実施例を示す接合要部拡大断面図、第3図(A
) 、 (B)、(C)は未発明の他の変形例を示す突
起部平面図である。 1・・・超音波発振器   2・・・振動子3・・・ホ
ーン      4・・・チップ5・・・振動方向  
   6・・・アンビル7.8・・・接合材料    
7a・・・端部8a・・・突起       8b・・
・突起の底辺8C・・・突起の先端    8d・・突
起の傾斜面9・・・加圧方向     l・・・間隔。 (7317)代理人 弁理士 則 近 憲 佑(ばか1
名)
Fig. 1 is a configuration diagram showing a conventional ultrasonic welding method, Fig. 2 is an enlarged sectional view of the main part of the welding part showing an embodiment of the present invention, and Fig. 3 (A
), (B), and (C) are plan views of protrusions showing other uninvented modifications. 1... Ultrasonic oscillator 2... Vibrator 3... Horn 4... Chip 5... Vibration direction
6...Anvil 7.8...Joining material
7a...End portion 8a...Protrusion 8b...
- Base of the protrusion 8C... Tip of the protrusion 8d... Inclined surface of the protrusion 9... Pressure direction l... Spacing. (7317) Agent Patent Attorney Noriyuki Chika (Idiot 1)
given name)

Claims (1)

【特許請求の範囲】 j (1)接合材料に超音波振動を振起して、接合材料間の
局部発熱によって接合を行う超音波溶接方法において、
接合材料の少なくとも一方の当接面に突起を設けたこと
を特徴とする超音波溶接方法。 (2)  接合材料の少なくとも一方の当接面に突起を
設けたものにおいて他方の接合材料の喘部な対応する突
起の底辺の範囲に配置したことを特徴とする特許請求の
範囲@1項記載の超音波溶接方法。
[Claims] j (1) In an ultrasonic welding method in which ultrasonic vibration is excited in the joining materials and the joining is performed by local heat generation between the joining materials,
An ultrasonic welding method characterized in that a protrusion is provided on at least one contact surface of the joining materials. (2) In a case where a protrusion is provided on at least one abutting surface of the bonding material, the protrusion is disposed in the range of the bottom of the corresponding protrusion, which is the pant of the other bonding material. Ultrasonic welding method.
JP19673481A 1981-12-09 1981-12-09 Ultrasonic welding method Pending JPS58100989A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19673481A JPS58100989A (en) 1981-12-09 1981-12-09 Ultrasonic welding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19673481A JPS58100989A (en) 1981-12-09 1981-12-09 Ultrasonic welding method

Publications (1)

Publication Number Publication Date
JPS58100989A true JPS58100989A (en) 1983-06-15

Family

ID=16362699

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19673481A Pending JPS58100989A (en) 1981-12-09 1981-12-09 Ultrasonic welding method

Country Status (1)

Country Link
JP (1) JPS58100989A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5118370A (en) * 1986-11-07 1992-06-02 Sharp Kabushiki Kaisha LSI chip and method of producing same
JP2002280139A (en) * 2001-03-16 2002-09-27 Yazaki Corp Ultrasonic jointing method of wire
KR100613469B1 (en) * 2004-09-14 2006-08-21 명화공업주식회사 Method for manufacturing water pump impeller assembly for automobile
DE102008002959A1 (en) * 2008-07-22 2010-01-28 Schunk Sonosystems Gmbh Method for the sealing welding of elements by means of ultrasound
JP2012125807A (en) * 2010-12-15 2012-07-05 Nissan Motor Co Ltd Bonding method and bonding member
JP2012125803A (en) * 2010-12-15 2012-07-05 Nissan Motor Co Ltd Electrically conductive material bonding method
CN104607794A (en) * 2013-09-06 2015-05-13 通用汽车环球科技运作有限责任公司 Apparatus and methods for joining polymeric composites using a hybrid friction/ultrasound technique for achieving desired weld characteristics
CN105711076A (en) * 2016-04-08 2016-06-29 博奥生物集团有限公司 Pipeline forming and chip packaging method based on ultrasonic welding technology
US20190009357A1 (en) * 2017-07-06 2019-01-10 Nippon Mektron, Ltd. Ultrasonic bonding jig, bonding structure, and bonding method

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5118370A (en) * 1986-11-07 1992-06-02 Sharp Kabushiki Kaisha LSI chip and method of producing same
JP2002280139A (en) * 2001-03-16 2002-09-27 Yazaki Corp Ultrasonic jointing method of wire
KR100613469B1 (en) * 2004-09-14 2006-08-21 명화공업주식회사 Method for manufacturing water pump impeller assembly for automobile
DE102008002959A1 (en) * 2008-07-22 2010-01-28 Schunk Sonosystems Gmbh Method for the sealing welding of elements by means of ultrasound
JP2012125807A (en) * 2010-12-15 2012-07-05 Nissan Motor Co Ltd Bonding method and bonding member
JP2012125803A (en) * 2010-12-15 2012-07-05 Nissan Motor Co Ltd Electrically conductive material bonding method
CN104607794A (en) * 2013-09-06 2015-05-13 通用汽车环球科技运作有限责任公司 Apparatus and methods for joining polymeric composites using a hybrid friction/ultrasound technique for achieving desired weld characteristics
CN104607794B (en) * 2013-09-06 2017-06-06 通用汽车环球科技运作有限责任公司 Apparatus and method for connecting Polymeric composites
CN105711076A (en) * 2016-04-08 2016-06-29 博奥生物集团有限公司 Pipeline forming and chip packaging method based on ultrasonic welding technology
US20190009357A1 (en) * 2017-07-06 2019-01-10 Nippon Mektron, Ltd. Ultrasonic bonding jig, bonding structure, and bonding method
US10744591B2 (en) * 2017-07-06 2020-08-18 Nippon Mektron, Ltd. Ultrasonic bonding jig, bonding structure, and bonding method

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